Specification Number : BP-ABZ-C
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Sub-G Module Data Sheet
Sample Part Number:
CMWX1ZZABZ-TEMP
CMWX1ZZABZ-TEMP-1
MP Part Number:
CMWX1ZZABZ-078
CMWX1ZZABZ-091
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Specification Number : BP-ABZ-C
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Revision History
Revision
Code
A
B
Date
Dec 1, 2016
Jan 19, 2017
Description
Initial Draft
Revise template
Updated the RF performance, Electrical Characteristics
and power up sequence.
Added weight info.
Updated P/N
Revised label info
Comments
C
Oct 16, 2018
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TABLE OF CONTENTS
1. Features ······················································································································· 4
2. Part Number ················································································································· 4
3. Block Diagram ··············································································································· 4
4. Label Information ·········································································································· 5
5. Absolute Maximum Ratings ····························································································· 5
6. Operating Condition ······································································································· 5
7. Electrical Characteristics ································································································ 6
7.1. FSK/OOK Transceiver Specification ············································································ 6
7.2. LoRa Transceiver Specification ··················································································· 6
7.3. SIGFOX Transceiver Specification ·············································································· 7
7.4. Low power mode current ···························································································· 7
8. Power Sequences ············································································································ 8
9. Reference circuit ············································································································ 9
10. Tape and Reel packing ·································································································· 11
11. Notice ························································································································ 14
CAUTION ················································································································ 16
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Specification Number : BP-ABZ-C
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1. Features
Interfaces
Main ICs
Reference Clocks
Supported Frequencies
Module Size
Weight
Package
RoHS
: I2C, UART, USB, SPI
: STM32L, SX1276
: Integrated 32MHz clock (TCXO with frequency error=±2 ppm)
and 32.768KHz clock (frequency error=±20 ppm)
: 868 MHz, 915 MHz
: 12.5 mm x 11.6 mm x 1.76 mm (Max)
: 0.48g (Typ)
: Metal Shield can
: This module is compliant with the RoHS directive
2. Part Number
Ordering Part Number
CMWX1ZZABZ-TEMP
CMWX1ZZABZ-EVK
CMWX1ZZABZ-078
CMWX1ZZABZ-TEMP-1
CMWX1ZZABZ-EVK-1
CMWX1ZZABZ-091
MCU
STM32L082
STM32L082
STM32L082
STM32L072
STM32L072
STM32L072
Secure element
NA
NA
NA
NA
NA
NA
Description
Engineering sample
Evaluation board
MP P/N
Engineering sample
Evaluation board
MP P/N
3. Block Diagram
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4. Label Information
1 pin mark
Product name
FCC ID number
IC ID number
Inspection number
TELEC logo
KCC logo
Murata Logo
5. Absolute Maximum Ratings
Table 3
Maximum ratings
Parameters
Storage Temperature
Input RF Level
VDD_USB
VDD_MCU, VDD_RF, VDD_TCXO
Supply Voltage
VREF+
Min
-40
-
-0.3
-0.3
-0.3
Typ
25
-
-
-
-
Max
+90
10
3.9
3.9
V
DD_MCU
+0.4
Unit
degC
dBm
V
V
V
6. Operating Condition
Table 4
Operating specification
Parameters
Operating Temperature
VDD_USB
(
USB peripheral used
)
(1)
VDD_USB
(
USB peripheral not used
)
(1)
Supply Voltage
VDD_MCU,VDD_RF,VDD_TCXO
VREF+
(2)
Min
-40
3.0
V
DD_MCU_min
2.2
(3)
1.8
Typ
25
-
V
DD_MCU
-
-
Max
+85
3.6
V
DD_MCU_max
3.6
V
DD_MCU
Unit
degC
V
V
V
V
(1) VDD_USB must respect the following conditions:
- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is
on the STM32L082*** datasheet and user guider.
(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
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