EEWORLDEEWORLDEEWORLD

Part Number

Search

DEV-12921

Description
LILYPAD XBEE
CategoryModule/solution   
File Size99KB,1 Pages
ManufacturerSparkFun Electronics
Environmental Compliance
Download Datasheet Parametric View All

DEV-12921 Online Shopping

Suppliers Part Number Price MOQ In stock  
DEV-12921 - - View Buy Now

DEV-12921 Overview

LILYPAD XBEE

DEV-12921 Parametric

Parameter NameAttribute value
The main purposeRF
typeXBEE
Specification-
LilyPad XBee
DE V-12 921 RO HS
images are CC BY-NC-SA 3.0
Description:
The LilyPad XBee is a breakout board for the popular XBee modules
that can be sewn into your e-textile projects to provide them with a little “connectivity.”
This board includes easy-to-sew tabs and all the necessary power regulation to run
on the LilyPad system. Once sewn into your project just attach your favorite XBee to
the pre-soldered headers and you are good to go!
LilyPad is a wearable e-textile technology developed by Leah Buechley and
cooperatively designed by Leah and SparkFun. Each LilyPad was creatively designed
to have large connecting pads to allow them to be sewn into clothing. Various input,
output, power, and sensor boards are available. They’re even washable!
LilyPad XBee was co-developed by Kate Hartman and Rob Faludi. It works with all
the popular XBee module types!
Note:
This LilyPad board does NOT include and XBee module.
Note:
A portion of this sale is given back to Dr. Leah Buechley for continued
development and education of e-textiles and to Rob Faludi and Kate Hartman for
product support and continued development.
Dimensions:
• 50mm outer diameter
• Thin 0.8mm PCB
https://www.sparkfun.com/products/12921
11/24/2015
Question: How to paste the attachment
How to paste attachment?...
goodboy Automotive Electronics
Do you know the layered approach of embedded systems?
[align=left][size=14px]Embedded systems are divided into four layers: hardware layer, driver layer, operating system layer and application layer. [/size][/align] [align=left][size=3]Hardware layer: It...
18538579903 Linux and Android
ASF upgraded to 3.23
ASF has quietly upgraded to 3.23.1. [b]Main updates:[/b] Release ASF3.23 (Apr 2015)SAM4C/CM 256k devices supportSAML21 - Low power applicationUSB MultiTouch HID ExampleBLE SDK SupportSmartConnect 6Low...
dcexpert Microchip MCU
Holtek Launches New 8-bit OTP MCU with 40mA Output Current
Holtek Semiconductor has launched a new 8-bit MCU product with high drive current, the HT48R52A, which has up to 40 input/output pins and can withstand a current of up to 40mA. It can directly drive L...
fighting MCU
IAR and smartRFflashprogrammer settings conflict!!
Problems occurred when debugging IAR730B Fri Jun 11 14:37:00 2010: Error (col 1): Unknown or ambiguous symbol. main Fri Jun 11 14:37:01 2010: Error (col 1): Unknown or ambiguous symbol. main Fri Jun 1...
caimengyi RF/Wirelessly
3G Wireless Broadband Communication Network Learning Materials
Confucius said: "Isn't it a pleasure to learn and practice it from time to time?" The crowd said: "Isn't it a pleasure to have friends to share it with?"...
1234 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2554  1678  392  1494  1257  52  34  8  31  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号