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74LV174N,112

Description
IC FF D-TYPE SNGL 6BIT 16DIP
Categorylogic    logic   
File Size132KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LV174N,112 Overview

IC FF D-TYPE SNGL 6BIT 16DIP

74LV174N,112 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
package instructionDIP, DIP16,.3
Reach Compliance Codecompliant
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDIP-T16
JESD-609 codee4
length19.025 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Sup20000000 Hz
MaximumI(ol)0.006 A
Number of digits6
Number of functions1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup31 ns
propagation delay (tpd)31 ns
Certification statusNot Qualified
Maximum seat height4.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
Trigger typePOSITIVE EDGE
width7.62 mm
minfmax20 MHz
Base Number Matches1
INTEGRATED CIRCUITS
74LV174
Hex D-type flip-flop with reset;
positive-edge trigger
Product specification
Supersedes data of 1997 Apr 07
IC24 Data Handbook
1998 May 20
Philips
Semiconductors

74LV174N,112 Related Products

74LV174N,112 74LV174PW,118 74LV174D,118 74LV174D,112 74LV174DB,118
Description IC FF D-TYPE SNGL 6BIT 16DIP IC FF D-TYPE SNGL 6BIT 16TSSOP IC FF D-TYPE SNGL 6BIT 16SO IC FF D-TYPE SNGL 6BIT 16SO IC FF D-TYPE SNGL 6BIT 16SSOP
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
package instruction DIP, DIP16,.3 SSOP, TSSOP16,.25 SOP, SOP16,.25 SOP, SOP16,.25 5.30 MM, PLASTIC, MO-150AC, SOT338-1, SSOP-14
Reach Compliance Code compliant compliant compliant compliant compliant
series LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e4 e4 e4 e4
length 19.025 mm 6.2 mm 9.9 mm 9.9 mm 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Sup 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A
Number of digits 6 6 6 6 6
Number of functions 1 1 1 1 1
Number of terminals 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output polarity TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SSOP SOP SOP TSSOP
Encapsulate equivalent code DIP16,.3 TSSOP16,.25 SOP16,.25 SOP16,.25 SSOP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 31 ns 31 ns 31 ns 31 ns 31 ns
propagation delay (tpd) 31 ns 31 ns 31 ns 31 ns 31 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.2 mm 2 mm 1.75 mm 1.75 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1 V 1 V 1 V 1 V 1 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 30 30
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width 7.62 mm 5.3 mm 3.9 mm 3.9 mm 4.4 mm
minfmax 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maker NXP NXP - - NXP
Base Number Matches 1 - 1 1 -
Parts packaging code - TSSOP SOIC SOIC SSOP
Contacts - 16 16 16 16
Humidity sensitivity level - 1 1 1 1
method of packing - TAPE AND REEL TAPE AND REEL - TAPE AND REEL

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