2.50 × 0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The INMP404 is
halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
*
APPLICATIONS
Mobile Devices
Teleconferencing Systems
Headsets
Security Panels
Intercom Devices
FEATURES
3.35 × 2.50 × 0.88 mm Surface-Mount Package
SNR of 62 dBA
Sensitivity of −38 dBV
Flat Frequency Response from 100 Hz to 15 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of 70 dBV
Compatible with Sn/Pb and Pb-free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
—
INMP404ACEZ-R0*
INMP404ACEZ-R7†
EV_INMP404-FX
* – 13” Tape and Reel
OUTPUT
AMPLIFIER
OUTPUT
INMP404
POWER
† – 7” Tape and reel to be discontinued. Contact
sales@invensense.com
for
availability.
VDD GND
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP404-00
Revision: 1.1.
Rev Date: 05/21/14
INMP404
TABLE OF CONTENTS
General Description .............................................................................................................................................. 1
Features ................................................................................................................................................................ 1
Ordering Information ............................................................................................................................................ 1
Table of Contents ......................................................................................................................................................... 2
Absolute Maximum Ratings ......................................................................................................................................... 4
Table 2. Absolute Maximum Ratings .................................................................................................................... 4
Pin Configurations And Function Descriptions ............................................................................................................ 6
Table 4. Pin Function Descriptions........................................................................................................................ 6
Application Information ............................................................................................................................................... 8
Connecting to Audio Codecs ................................................................................................................................. 8
PCB Design And Land Pattern Layout ........................................................................................................................ 10
Pick And Place Equipment .................................................................................................................................. 11
Revision History .................................................................................................................................................. 13