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CDP6818ADX

Description
IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,CERAMIC
CategoryMicrocontrollers and processors   
File Size729KB,19 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

CDP6818ADX Overview

IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,CERAMIC

CDP6818ADX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Codenot_compliant
Is SamacsysN
Information access methodsPARALLEL
interrupt capabilityY
JESD-30 codeR-XDIP-T24
JESD-609 codee0
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
shortest timeSECONDS
VolatileYES
Base Number Matches1

CDP6818ADX Related Products

CDP6818ADX P-0402K2082DSTS CDP6818AQ CDP6818AE CDP6818AEX
Description IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,CERAMIC Fixed Resistor, Thin Film, 0.05W, 20800ohm, 75V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP 1 TIMER(S), REAL TIME CLOCK, PQCC28, PLASTIC, MS-018, LCC-28 1 TIMER(S), REAL TIME CLOCK, PDIP24 IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,PLASTIC
Is it Rohs certified? incompatible conform to incompatible incompatible incompatible
Reach Compliance Code not_compliant compliant not_compliant not_compliant not_compliant
JESD-609 code e0 e3 e0 e0 e0
Number of terminals 24 2 28 24 24
Maximum operating temperature 70 °C 155 °C 70 °C 70 °C 70 °C
Package form IN-LINE SMT CHIP CARRIER IN-LINE IN-LINE
surface mount NO YES YES NO NO
technology CMOS THIN FILM CMOS CMOS CMOS
Terminal surface Tin/Lead (Sn/Pb) Matte Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maker Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Information access methods PARALLEL - PARALLEL, MUXED BUS PARALLEL, MUXED BUS PARALLEL
interrupt capability Y - Y Y Y
JESD-30 code R-XDIP-T24 - S-PQCC-J28 R-PDIP-T24 R-PDIP-T24
Package body material CERAMIC - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - QCCJ DIP DIP
Encapsulate equivalent code DIP24,.6 - LDCC28,.5SQ DIP24,.6 DIP24,.6
Package shape RECTANGULAR - SQUARE RECTANGULAR RECTANGULAR
power supply 5 V - 5 V 5 V 5 V
Nominal supply voltage 5 V - 5 V 5 V 5 V
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE - J BEND THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm - 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL - QUAD DUAL DUAL
shortest time SECONDS - SECONDS SECONDS SECONDS
Volatile YES - YES YES YES
package instruction - SMT, 0402 PLASTIC, MS-018, LCC-28 DIP, DIP24,.6 -
ECCN code - EAR99 EAR99 EAR99 -

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