1 TIMER(S), REAL TIME CLOCK, PQCC28, PLASTIC, MS-018, LCC-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | PLASTIC, MS-018, LCC-28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| maximum clock frequency | 1 MHz |
| External data bus width | 8 |
| Information access methods | PARALLEL, MUXED BUS |
| interrupt capability | Y |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| length | 11.5062 mm |
| Number of digits | 8 |
| Number of terminals | 28 |
| Number of timers | 1 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| shortest time | SECONDS |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Volatile | YES |
| width | 11.5062 mm |
| uPs/uCs/peripheral integrated circuit type | TIMER, REAL TIME CLOCK |
| CDP6818AQ | P-0402K2082DSTS | CDP6818ADX | CDP6818AE | CDP6818AEX | |
|---|---|---|---|---|---|
| Description | 1 TIMER(S), REAL TIME CLOCK, PQCC28, PLASTIC, MS-018, LCC-28 | Fixed Resistor, Thin Film, 0.05W, 20800ohm, 75V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,CERAMIC | 1 TIMER(S), REAL TIME CLOCK, PDIP24 | IC,REAL-TIME CLOCK,CMOS,DIP,24PIN,PLASTIC |
| Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant |
| JESD-609 code | e0 | e3 | e0 | e0 | e0 |
| Number of terminals | 28 | 2 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 155 °C | 70 °C | 70 °C | 70 °C |
| Package form | CHIP CARRIER | SMT | IN-LINE | IN-LINE | IN-LINE |
| surface mount | YES | YES | NO | NO | NO |
| technology | CMOS | THIN FILM | CMOS | CMOS | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | PLASTIC, MS-018, LCC-28 | SMT, 0402 | - | DIP, DIP24,.6 | - |
| ECCN code | EAR99 | EAR99 | - | EAR99 | - |
| Information access methods | PARALLEL, MUXED BUS | - | PARALLEL | PARALLEL, MUXED BUS | PARALLEL |
| interrupt capability | Y | - | Y | Y | Y |
| JESD-30 code | S-PQCC-J28 | - | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| Package body material | PLASTIC/EPOXY | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | - | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | - | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| power supply | 5 V | - | 5 V | 5 V | 5 V |
| Nominal supply voltage | 5 V | - | 5 V | 5 V | 5 V |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | - | DUAL | DUAL | DUAL |
| shortest time | SECONDS | - | SECONDS | SECONDS | SECONDS |
| Volatile | YES | - | YES | YES | YES |
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