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GS8180DV18D-300T

Description
Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, MO-216CAB-1, BGA-165
Categorystorage   
File Size448KB,28 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Download Datasheet Parametric View All

GS8180DV18D-300T Overview

Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, MO-216CAB-1, BGA-165

GS8180DV18D-300T Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerGSI Technology
Parts packaging codeBGA
package instruction13 X 15 MM, 1 MM PITCH, MO-216CAB-1, BGA-165
Contacts165
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.B
Is SamacsysN
Maximum access time1.8 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density18874368 bit
Memory IC TypeSTANDARD SRAM
memory width18
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)2.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
Base Number Matches1
Preliminary
GS8180DV18D-330/300/250/200/167/133/100
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual DoubleData Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 2.5 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
- 330
-300
-250
-200
-167
-133
-100
10 ns
18Mb
Σ
2x2B4V
SigmaQuad SRAM
100 MHz–330 MHz
2.5 V V
DD
1.8 V and 1.5 V I/O
Bottom View
165-Bump, 13 mm x 15 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
JEDEC Std. MO-216, Variation CAB-1
tKHKH 3.0 ns 3.3 ns 4.0 ns 5.0 ns 6.0 ns 7.5 ns
tKHQV 1.6 ns 1.8 ns 2.1 ns 2.3 ns 2.5 ns 3.0 ns 3.0 ns
SigmaRAM™ Family Overview
GS818DV18 are built in compliance with the SigmaQuad SRAM
pinout standard for Separate I/O synchronous SRAMs. They
are18,874,368-bit (18Mb) SRAMs. These are the first in a family of
wide, very low voltage HSTL I/O SRAMs designed to operate at the
speeds needed to implement economical high performance
networking systems.
SigmaQuad SRAMs are offered in a number of configurations. Some
emulate and enhance other synchronous separate I/O SRAMs. A
higher performance SDR (Single Data Rate) Burst of 2 versionis also
offered. The logical differences between the protocols employed by
these RAMs hinge mainly on various combinations of address
bursting, output data registering, and write cueing. Along with the
Common I/O family of SigmaRAMs, the SigmaQuad family of SRAMs
allows a user to implement the interface protocol best suited to the
task at hand.
two input register clock inputs, K and K. K and K are independent
single-ended clock inputs, not differential inputs to a single differential
clock input buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and C
clock inputs. C and C are also independent single-ended clock inputs,
not differential inputs. If the C clocks are tied high, the K clocks are
routed internally to fire the output registers instead.
Because Separate I/O
Σ
2x2B4 RAMs always transfer data in four
packets, A0 and A1 are internally set to 0 for the first read or write
transfer, and automatically incremented by 1 for the next transfers.
Because the LSBs are tied off internally, the address field of a
Σ
2x2B4 RAM is always two address pins less than the advertised
index depth (e.g., the 1M x 18 has a 256K addressable index).
Clocking and Addressing Schemes
A
Σ
2x2B4 SigmaQuad SRAM is a synchronous device. It employs
Rev: 1.02 5/2003
1/28
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
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