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CL05B104KO5NNNO

Description
CAP CER 0.1UF 16V X7R 0402
CategoryPassive components   
File Size152KB,2 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

CL05B104KO5NNNO Overview

CAP CER 0.1UF 16V X7R 0402

CL05B104KO5NNNO Parametric

Parameter NameAttribute value
capacitance.1µF
Tolerance±10%
Voltage - Rated16V
Temperature CoefficientX7R
Operating temperature-55°C ~ 125°C
characteristic-
grade-
applicationUniversal
Installation typeSurface mount, MLCC
Package/casing0402 (1005 Metric)
size/dimensions0.039" long x 0.020" wide (1.00mm x 0.50mm)
Height - Installation (maximum)-
Thickness (maximum)0.022"(0.55mm)
lead spacing-
Lead form-
notifyThere is currently market demand for these product types, so lead times will change and extend. Lead times may vary.
SPECIFICATION
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
05
B
104
K
O
5
N
N
N
O
Samsung P/N:
Description :
CL05B104KO5NNNO
CAP, 100㎋, 16V, ± 10%, X7R, 0402
Samsung Multi-layer Ceramic Capacitor
0402 (inch code)
L: 1.00 ±0.05mm
X7R
100
± 10
%
16 V
0.50 ±0.05mm
Inner electrode
Termination
Plating
Product
Special
Packaging
W: 0.50 ±0.05mm
Ni
Cu
Sn 100%
(Pb Free)
Normal
Reserved for future use
Cardboard Type, 10" reel
B. Samsung Reliablility Test and Judgement condition
Judgement
Capacitance
Tan
δ
(DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
0.05 max.
10,000Mohm or 100Mohm㎌
Whichever is Smaller
No abnormal exterior appearance
1㎑±10%
Rated Voltage
Test condition
1.0±0.2Vrms
60~120 sec.
No dielectric breakdown or
mechanical breakdown
X7R
(From -55℃ to 125℃, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500g·F, for 10±1 sec.
terminal electrode
Capacitance change : within ±12.5%
More than 75% of terminal surface
is to be soldered newly
Microscope (×10)
250% of the rated voltage
Bending to the limit (1mm)
with 1.0mm/sec.
SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Solder pot : 270±5℃, 10±1sec.
Resistance to
Soldering heat
Capacitance change : within ±7.5%
Tan
δ,
IR : initial spec.
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