Technical Data
10449
Effective October 2015
FP1108L3 and FP1108L4
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•
•
•
•
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High frequency, high current power inductors
Applications
Servers
Multi-phase and Vcore regulators
Voltage Regulator Modules (VRMs)
Desktop VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
Environmental Data
•
Storage temperature range (Component):
-40°C to +125°C
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
Solder reflow temperature: J-STD-020D
compliant
Description
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•
•
•
•
High current carrying capacity
Ultra low DCR
Low core loss
Operating frequency
− L3 version 500kHz-800kHz
− L4 version 1MHz-3MHz
Inductance range from 105nH to 180nH
Current range from 33 to 57 amps
11.0 x 8.0mm footprint surface mount package
in an 8.0mm heightt
Ferrite core material
Halogen free, lead free, RoHS compliant
•
Pb
HF
FREE
HALOGEN
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•
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Technical Data
10449
Effective October 2015
FP1108L3 and FP1108L4
High frequency, high current power inductors
Product Specifications
OCL
1
(nH) ±10%
FLL
2
(nH)
minimum
I
rms3
(amps)
I
sat
1
4
(amps)
I
sat
2
5
(amps)
I
sat
3
6
(amps)
DCR (mΩ)
±10% @ 20°C
Part Number
8
K-factor
7
L3 Version
FP1108L3-R105-R
L4 Version
FP1108L4-R120-R
FP1108L4-R150-R
FP1108L4-R180-R
120
150
180
86
108
129
91
91
91
50
40
33
42
34
28
40
32
26
0.05
0.05
0.05
552
552
552
105
76
91
57
48
45
0.05
552
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I
sat
1, @ +25ºC
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. This is for reference only and does not
represent absolute maximum ratings. Derating is necessary for AC currents. PCB layout, trace thickness and width,
air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that
the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25°C
5. I
sat
2: Peak current for approximately 20% rolloff @ +100°C
6. I
sat
3: Peak current for approximately 20% rolloff @ +125°C
7. K-factor: Used to determine B
p-p
for core loss (see graph). Bp-p = K * L *
ΔI
* 10
-3
B
p-p
: (Gauss),
K: (K-factor from table), L: (Inductance in nH),
ΔI
(Peak to peak ripple current in Amps).
8. Part Number Definition: FP1108Lx-Rxxx-R
FP1108L = Product code and size
x= Version indicator
Rxxx= inductance value in μH, R= decimal point ,
-R suffix = RoHS compliant
Dimensions (mm)
b
a
8.0
max
8.0
max
Recommended Pad Layout
3.5
Schematic
11.0
max
1108Lx
Rxxx
wwllyy R
3.6
nom
8.6
1.7
nom
3.0
nom
4.0
Part marking: 1108Lx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point)
wwllyy = date code, R = revision level
All soldering surfaces to be coplanar within 0.1 millimeters
PCB tolerances are ±0.1 millimeters unless otherwise specified
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
2
www.eaton.com/elx
FP1108L3 and FP1108L4
High frequency, high current power inductors
Packaging information (mm)
Supplied in tape and reel packaging, 500 parts per 13” diameter reel
1.5 dia
1.75
4.0
2.0
1.5 dia
Technical Data
10449
Effective October 2015
11.5
24.0
±0.3
11.4
16.0
8.1
8.4
User Direction of feed
Temperature rise vs. total loss
FP1108L3
60
60
FP1108L4
Temperature Rise (°C)
40
30
20
10
0
Temperature Rise (°C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
50
50
40
30
20
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Total Loss (W)
Total Loss (W)
www.eaton.com/elx
3
Analogue and Mixed Signal
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