EEWORLDEEWORLDEEWORLD

Part Number

Search

BOND PLY 660P 11X12"

Description
THERM PAD 304.8MMX279.4MM W/ADH
CategoryThermal management products   
File Size32KB,1 Pages
ManufacturerBERGQUIST
Environmental Compliance
Download Datasheet Parametric View All

BOND PLY 660P 11X12" Overview

THERM PAD 304.8MMX279.4MM W/ADH

BOND PLY 660P 11X12" Parametric

Parameter NameAttribute value
use-
typesheet, tape
shaperectangle
shape304.80mm x 279.40mm
thickness0.0080"(0.203mm)
MaterialPolyimide
AdhesivePaste - both sides
base fabric, carrierPolyimide
colorbrown
Thermal resistivity0.81°C/W
Thermal conductivity0.4 W/m-K
Bond-Ply 660P
®
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape
Features and Benefits
• Thermal impedance:
0.87°C-in
2
/W (@50 psi)
• Highly puncture resistant Polyimide
reinforcement carrier
• Double-sided pressure sensitive
adhesive tape
• Provides a mechanical bond, eliminating the
need for mechanical fasteners or screws
Bond-Ply 660P is a thermally conductive, electri-
cally insulating, double sided pressure sensitive
adhesive tape.The tape consists of a high per-
formance, thermally conductive acrylic adhesive
coated on both sides of a Polyimide film. Use
Bond-Ply 660P in applications to replace
mechanical fasteners or screws.
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Glass Transition (°F) / (°C)
Continuous Use Temp (°F) / (°C)
ADHESION
Lap Shear @ RT (psi) / (MPa)
Lap Shear after 5 hr @ 100°C
Lap Shear after 2 min @ 200°C
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Flame Rating
THERMAL
Post-Cured Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds)
TO-220 Thermal Performance (°C/W)
Thermal Impedance (°C-in
2
/W) (1)
10
5.48
0.83
25
5.47
0.82
TYPICAL PROPERTIES OF BOND-PLY 660P
IMPERIAL VALUE
Light Brown
Polyimide Film
0.008
-22
-40 to 257
100
200
200
METRIC VALUE
Light Brown
Polyimide Film
0.203
-30
-40 to 125
0.7
1.4
1.4
VALUE
6000
V-O
0.4
50
5.15
0.81
TEST METHOD
Visual
ASTM D374
ASTM E1356
ASTM D1002
ASTM D1002
ASTM D1002
TEST METHOD
ASTM D149
U.L.94
ASTM D5470
100
5.05
0.80
200
5.00
0.79
Typical Applications
Include:
• Heat sink onto BGA graphic processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Configurations Available:
• Roll form and die-cut parts
The material as delivered will include a
continuous base liner with differential release
properties to allow for simplicity in roll
packaging and application assembly.
Shelf Life:
The double-sided pressure sensitive adhesive used in Bond-Ply products requires
the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a
6-month shelf life at a maximum continuous storage temperature of 35°C, or 3-month shelf life at
a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is
often not critical for manual assembly processing), is recommended at 12 months from date of
manufacture at a maximum continuous storage temperature of 60°C.
Building a Part Number
BP660P
0.008
– 00
– 12/250 –
NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
1212 = 12" x 12" Sheets, 12/250 = 12" x 250' rolls or
00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.008"
BP660P = Bond-Ply 660P Material
Section A
Note: To build a part number, visit our website at www.bergquistcompany.com.
Bond-Ply
®
: U.S. Patent 5,090,484 and others.
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_BP_660P_0711
Section D
Section B
Section C
Urgently looking for the principle and C language source code of 89C51 reading and writing 24C16
I am designing a single-chip microcomputer and I need to use 24C16. I want to know how to use it--------control it with 89C51. Thanks for your help....
wangjunaza Programming Basics
2006 Sichuan Province College Student Electronic Design Competition Questions - Wireless FM Walkie-Talkie (Neijiang Normal University)
[i=s]This post was last edited by paulhyde on 2014-9-15 09:26[/i] [b]Electronic Design Competition Questions - Wireless FM Walkie-Talkie[/b] [b]1. Electronic Design Competition Design Task[/b]Design a...
呱呱 Electronics Design Contest
STC12C54XXAD series AD conversion program (interrupt mode)
void ADC_SPI_ISR(void) interrupt 5 {ADC_CONTR = 0xEF; /* Software clears AD conversion flag*/AD_DATA_SAVE = ADC_DATA; /* Save AD data*/ADC_CONTR |= 0x08; /* Restart AD conversion*/ } void main(){EA = ...
护花使者 MCU
Questions about bus operation I/O ports
If I operate the I/O port through the AHB bus, do I have to jump to the APB bus first and then operate it, or can I operate it directly? It means whether the two buses operate the I/O ports in paralle...
hwl MCU
Questions about CImageList in EVC.
Does EVC4 support CImageList? CImageList m_ThumbImageList; m_ThumbImageList.Create(THUMBNAIL_WIDTH,THUMBNAIL_HEIGHT,ILC_COLOR24,0, 1); It doesn't compile because ILC_COLOR24 is undefined. What's going...
hewitt09 Embedded System
MCS-51 MCU Practical Subroutine Library (Part 2)
MCS-51 MCU Practical Subroutine Library (Part 2) (11) Label: DIVS Function: Double-byte binary signed number division (complement code) Entry conditions: dividend is in R2, R3, R4, R5, divisor is in R...
rain 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1631  721  448  2756  2634  33  15  10  56  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号