FQD3N60C / FQU3N60C 600V N-Channel MOSFET
August 2006
FQD3N60C / FQU3N60C
600V N-Channel MOSFET
Features
• 2.4A, 600V, R
DS(on)
= 3.4
Ω
@V
GS
= 10 V
• Low gate charge ( typical 10.5nC)
• Low Crss ( typical 5pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
QFET
Description
®
These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
This advanced technology has been especially tailored to mini-
mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high effi-
ciency switched mode power supplies, electronic lamp ballasts
based on half bridge topology.
D
D
G
G
S
D-PAK
FQD Series
I-PAK
G D S
FQU Series
S
Absolute Maximum Ratings
Symbol
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
T
J
, T
STG
T
L
Drain-Source Voltage
Drain Current
Drain Current
- Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
- Pulsed
(Note 1)
Parameter
FQD3N60C / FQU3N60C
600
2.4
1.5
9.6
±
30
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/°C
°C
°C
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
C
= 25°C)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
150
2.4
5.0
4.5
50
0.4
-55 to +150
300
Thermal Characteristics
Symbol
R
θJC
R
θJA*
R
θJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient*
Thermal Resistance, Junction-to-Ambient
FQD3N60C / FQU3N60C
2.5
50
110
Units
°C/W
°C/W
°C/W
* When mounted on the minimum pad size recommended (PCB Mount)
©2006 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FQD3N60C / FQU3N60C Rev. A1
FQD3N60C / FQU3N60C 600V N-Channel MOSFET
Package Marking and Ordering Information
Device Marking
FQD3N60C
FQD3N60C
FQU3N60C
Device
FQD3N60CTM
FQD3N60CTF
FQU3N60CTU
Package
D-PAK
D-PAK
I-PAK
Reel Size
380mm
380mm
-
Tape Width
16mm
16mm
-
Quantity
2500
2000
75
Electrical Characteristics
Symbol
Off Characteristics
BV
DSS
∆BV
DSS
/
∆T
J
I
DSS
I
GSSF
I
GSSR
V
GS(th)
R
DS(on)
g
FS
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
I
S
I
SM
V
SD
t
rr
Q
rr
NOTES:
T
C
= 25°C unless otherwise noted
Parameter
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Test Conditions
V
GS
= 0 V, I
D
= 250
µA
I
D
= 250
µA,
Referenced to 25°C
V
DS
= 600 V, V
GS
= 0 V
V
DS
= 480 V, T
C
= 125°C
V
GS
= 30 V, V
DS
= 0 V
V
GS
= -30 V, V
DS
= 0 V
V
DS
= V
GS
, I
D
= 250
µA
V
GS
= 10 V, I
D
= 1.2 A
V
DS
= 40 V, I
D
= 1.2 A
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
(Note 4)
Min
600
--
--
--
--
--
2.0
--
--
--
--
--
Typ
--
0.6
--
--
--
--
--
2.8
3.5
435
45
5
12
30
35
35
10.5
2.1
4.5
--
--
--
260
1.6
Max Units
--
--
1
10
100
-100
4.0
3.4
--
565
60
8
34
70
80
80
14
--
--
3
12
1.4
--
--
V
V/°C
µA
µA
nA
nA
V
Ω
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
A
A
V
ns
µC
On Characteristics
Dynamic Characteristics
Switching Characteristics
V
DD
= 300 V, I
D
= 3A,
R
G
= 25
Ω
--
--
--
(Note 4, 5)
--
--
--
--
--
--
--
--
V
DS
= 480 V, I
D
= 3A,
V
GS
= 10 V
(Note 4, 5)
Drain-Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
GS
= 0 V, I
S
= 2.4 A
V
GS
= 0 V, I
S
= 3 A,
dI
F
/ dt = 100 A/µs
(Note 4)
--
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 47mH, I
AS
= 2.4A, V
DD
= 50V, R
G
= 25
Ω,
Starting T
J
= 25°C
3. I
SD
≤
3A, di/dt
≤
200A/µs, V
DD
≤
BV
DSS,
Starting T
J
= 25°C
4. Pulse Test : Pulse width
≤
300µs, Duty cycle
≤
2%
5. Essentially independent of operating temperature
FQD3N60C / FQU3N60C Rev. A1
2
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FQD3N60C / FQU3N60C 600V N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
10
1
Figure 2. Transfer Characteristics
10
1
I
D
, Drain Current [A]
10
0
I
D
, Drain Current [A]
V
GS
Top :
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
Bottom : 5.0 V
150 C
25 C
-55 C
※
Notes :
1. V
DS
= 40V
2. 250µ s Pulse Test
o
o
o
※
Notes :
1. 250µ s Pulse Test
2. T
C
= 25
℃
10
-1
10
0
10
1
10
0
2
4
6
8
10
V
DS
, Drain-Source Voltage [V]
V
GS
, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
12
10
1
R
DS(ON)
[Ω ],
Drain-Source On-Resistance
8
6
V
GS
= 10V
I
DR
, Reverse Drain Current [A]
10
10
0
150
℃
25
℃
※
Notes :
1. V
GS
= 0V
2. 250µ s Pulse Test
4
V
GS
= 20V
2
※
Note : T
J
= 25
℃
0
0
1
2
3
4
5
6
7
10
-1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
I
D
, Drain Current [A]
V
SD
, Source-Drain voltage [V]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
12
800
700
600
C
oss
C
iss
V
GS
, Gate-Source Voltage [V]
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
10
V
DS
= 120V
V
DS
= 300V
V
DS
= 480V
8
Capacitances [pF]
500
400
300
200
100
0
-1
10
6
4
C
rss
※
Note ;
1. V
GS
= 0 V
2. f = 1 MHz
2
※
Note : I
D
= 10A
0
10
0
10
1
0
2
4
6
8
10
12
V
DS
, Drain-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
FQD3N60C / FQU3N60C Rev. A1
3
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FQD3N60C / FQU3N60C 600V N-Channel MOSFET
Typical Performance Characteristics
(Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
1.2
Figure 8. On-Resistance Variation
vs. Temperature
3.0
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
2.5
1.1
2.0
1.0
1.5
0.9
♦
Notes :
1.0
♦
Notes :
1. V
GS
= 0 V
2. I
D
= 250
µ
A
0.5
1. V
GS
= 10 V
2. I
D
= 1.2 A
0.8
-100
-50
0
50
100
o
150
200
0.0
-100
-50
0
50
100
o
150
200
T
J
, Junction Temperature [ C]
T
J
, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
2.5
Operation in This Area
is Limited by R
DS(on)
10
1
2.0
I
D
, Drain Current [A]
1 ms
10
0
I
D
, Drain Current [A]
100
µ
s
10 ms
DC
10
µ
s
1.5
1.0
10
-1
※
Notes :
1. T
C
= 25 C
2. T
J
= 150 C
3. Single Pulse
o
o
0.5
10
-2
10
0
0.0
25
50
75
100
125
150
V
DS
, Drain-Source Voltage [V]
T
C
, Case Temperature [
℃
]
Figure 11. Transient Thermal Response Curve
Z
θ
JC
(t), Thermal Response
10
0
D = 0 .5
0 .2
0 .1
0 .0 5
※
N o te s :
1 . Z
θ
J C
( t) = 2 .5
℃
/W M a x .
2 . D u ty F a c to r , D = t
1
/t
2
3 . T
J M
- T
C
= P
D M
* Z
θ
J C
( t)
10
-1
0 .0 2
0 .0 1
s in g le p u ls e
P
DM
t
1
t
2
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
1
, S q u a r e W a v e P u ls e D u r a tio n [s e c ]
FQD3N60C / FQU3N60C Rev. A1
4
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FQD3N60C / FQU3N60C 600V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FQD3N60C / FQU3N60C Rev. A1
5
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