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ZSSC3224BI2B

Description
WAFER (UNSAWN) - BOX
Categoryunclassified   
File Size970KB,47 Pages
ManufacturerIDT (Integrated Device Technology, Inc.)
Websitehttp://www.idt.com/
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ZSSC3224BI2B Overview

WAFER (UNSAWN) - BOX

High End 24-Bit Sensor Signal
Conditioner IC
Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-
accuracy amplification and analog-to-digital conversion of a differ-
ential or pseudo-differential input signal. Designed for high resolu-
tion sensor module applications, the ZSSC3224 can perform offset,
span, and 1
st
and 2
nd
order temperature compensation of the
measured signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a corrected tempera-
ture output measured with an internal sensor.
The measured and corrected sensor values are provided at the
digital output pins, which can be configured as I2C (≤ 3.4MHz) or
SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a 26-bit internal
digital signal processor (DSP) running a correction algorithm.
Calibration coefficients are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory. Programming
the ZSSC3224 is simple via the serial interface. The interface is
used for the PC-controlled calibration procedure, which programs
the set of calibration coefficients in memory. The ZSSC3224
provides accelerated signal processing, increased resolution, and
improved noise immunity in order to support high-speed control,
safety, and real-time sensing applications with the highest
requirements for energy efficiency.
ZSSC3224
Datasheet
Features
Flexible, programmable analog front-end design; up to 24-bit
analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing sensor
signals: gain range 6.6 to 216 (linear)
Internal auto-compensated 18-bit temperature sensor
Digital compensation of individual sensor offset; 1
st
and 2
nd
order digital compensation of sensor gain as well as 1
st
and
2
nd
order temperature gain and offset drift
Programmable interrupt operation
High-speed sensing: e.g., 18-bit conditioned sensor
signal measurement rate >200s
-1
Typical sensor elements can achieve an accuracy of better
than ±0.10% full scale output (FSO) at -40 to 85°C
Integrated 26-bit calibration math digital signal
processor (DSP)
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for high-
density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery applications
Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute voltage (e.g.,
thermopile) sensor modules
Supply voltage range: 1.68V to 3.6V
Operating mode current: ~1.0mA (typical)
Sleep Mode current: 20nA (typical)
Temperature resolution: <0.7mK/LSB
Excellent energy-efficiency:
with 18-bit resolution: <100pJ/step
with 24-bit resolution: <150nJ/step
Small die size
Operation temperature: –40°C to +85°C
Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer
bonding
Signal Output /
Post-processing
Applications
Barometric altitude measurement for portable navigation or
emergency call systems; altitude measurement for car
navigation
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
ZSSC3224 Application Example
VSS
VDD
VDD
Stacked-Die Sensor Module
VDD
VSS
ZSSC3224
SS
VSS
VDDB
INP(+)
SS
MOSI
SDA
RES
RES
VDDB
INN
EOC
sensor element
INP
VSSB
MOSI
SDA
SCLK
SCL
SCLK
SCL
Microcontroller
EOC
INN(-)
VSSB
MISO
MISO
© 2018 Integrated Device Technology, Inc
1
November 12, 2018

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