ZSSC3224BI1B datasheet, PDF - EEWORLD Datasheet

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ZSSC3224BI1B: DescriptionWAFER (UNSAWN) - BOX; Categoryunclassified; File Size970KB，47 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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High End 24-Bit Sensor Signal

Conditioner IC

Brief Description

The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-

accuracy amplification and analog-to-digital conversion of a differ-

ential or pseudo-differential input signal. Designed for high resolu-

tion sensor module applications, the ZSSC3224 can perform offset,

span, and 1

and 2

order temperature compensation of the

measured signal. Developed for correction of resistive bridge or

absolute voltage sensors, it can also provide a corrected tempera-

ture output measured with an internal sensor.

The measured and corrected sensor values are provided at the

digital output pins, which can be configured as I2C (≤ 3.4MHz) or

SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via a 26-bit internal

digital signal processor (DSP) running a correction algorithm.

Calibration coefficients are stored on-chip in a highly reliable, non-

volatile, multiple-time programmable (MTP) memory. Programming

the ZSSC3224 is simple via the serial interface. The interface is

used for the PC-controlled calibration procedure, which programs

the set of calibration coefficients in memory. The ZSSC3224

provides accelerated signal processing, increased resolution, and

improved noise immunity in order to support high-speed control,

safety, and real-time sensing applications with the highest

requirements for energy efficiency.

ZSSC3224

Datasheet

Features



Flexible, programmable analog front-end design; up to 24-bit

analog-to-digital converter (ADC)



Fully programmable gain amplifier for optimizing sensor

signals: gain range 6.6 to 216 (linear)



Internal auto-compensated 18-bit temperature sensor



Digital compensation of individual sensor offset; 1

and 2

order digital compensation of sensor gain as well as 1

and

order temperature gain and offset drift



Programmable interrupt operation



High-speed sensing: e.g., 18-bit conditioned sensor

signal measurement rate >200s

-1



Typical sensor elements can achieve an accuracy of better

than ±0.10% full scale output (FSO) at -40 to 85°C



Integrated 26-bit calibration math digital signal

processor (DSP)



Fully corrected signal at digital output



Layout customized for die-die bonding with sensor for high-

density chip-on-board assembly



One-pass calibration minimizes calibration costs



No external trimming, filter, or buffering components required



Highly integrated CMOS design



Integrated reprogrammable non-volatile memory



Excellent for low-voltage and low-power battery applications



Optimized for operation in calibrated resistive

(e.g., pressure) sensor or calibrated absolute voltage (e.g.,

thermopile) sensor modules



Supply voltage range: 1.68V to 3.6V



Operating mode current: ~1.0mA (typical)



Sleep Mode current: 20nA (typical)



Temperature resolution: <0.7mK/LSB



Excellent energy-efficiency:

with 18-bit resolution: <100pJ/step

with 24-bit resolution: <150nJ/step



Small die size



Operation temperature: –40°C to +85°C



Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer

bonding

Signal Output /

Post-processing

Applications



Barometric altitude measurement for portable navigation or

emergency call systems; altitude measurement for car

navigation



Weather forecast



Fan control



Industrial, pneumatic, and liquid pressure



High-resolution temperature measurements



Object-temperature radiation (via thermopile)

ZSSC3224 Application Example

VSS

VDD

Stacked-Die Sensor Module

VDD

VSS

ZSSC3224

VSS

VDDB

INP(+)

MOSI

SDA

RES

VDDB

INN

EOC

sensor element

INP

VSSB

MOSI

SDA

SCLK

SCL

SCLK

SCL

Microcontroller

EOC

INN(-)

VSSB

MISO

November 12, 2018

ZSSC3224 Datasheet

Contents

Pin and Pad Assignments and Descriptions .................................................................................................................................................6

1.1 ZSSC3224 Die Pad Assignments and Descriptions ............................................................................................................................6

1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions .............................................................................................................7

Absolute Maximum Ratings ..........................................................................................................................................................................8

Recommended Operating Conditions ..........................................................................................................................................................9

Electrical Characteristics ............................................................................................................................................................................10

4.1 Power Supply Rejection Ratio (PSRR) versus Frequency ................................................................................................................11

Circuit Description ......................................................................................................................................................................................12

5.1 Brief Description ................................................................................................................................................................................12

5.2 Signal Flow and Block Diagram .........................................................................................................................................................12

5.3 Analog Front End...............................................................................................................................................................................13

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.4.1

5.4.2

5.4.3

5.4.4

5.4.5

Amplifier..............................................................................................................................................................................13

Analog-to-Digital Converter ................................................................................................................................................15

Selection of Gain and Offset – Sensor System Dimensioning............................................................................................17

Temperature Measurement ................................................................................................................................................18

External Sensor Supply: Bridge Sensors............................................................................................................................18

External Sensor: Absolute Voltage Source Sensors ..........................................................................................................18

Digital Signal Processor (DSP) Core ..................................................................................................................................19

MTP Memory ......................................................................................................................................................................19

Clock Generator .................................................................................................................................................................19

Power Supervision..............................................................................................................................................................19

Interface..............................................................................................................................................................................19

5.4 Digital Section....................................................................................................................................................................................19

Functional Description ................................................................................................................................................................................20

6.1 Power Up ...........................................................................................................................................................................................20

6.2 Measurements ...................................................................................................................................................................................20

6.3 Interrupt (EOC Pin) ............................................................................................................................................................................20

6.4 Operational Modes ............................................................................................................................................................................21

6.4.1

6.5.1

6.5.2

6.5.3

6.6.1

6.6.2

6.7.1

6.7.2

SPI/I2C Commands ............................................................................................................................................................24

Common Functionality ........................................................................................................................................................26

SPI ......................................................................................................................................................................................27

I2C ......................................................................................................................................................................................30

Programming Memory ........................................................................................................................................................31

Memory Contents ...............................................................................................................................................................32

Calibration Step 1 – Assigning Unique Identification ..........................................................................................................37

Calibration Step 2 – Data Collection ...................................................................................................................................37

6.5 Communication Interface...................................................................................................................................................................26

6.6 Multiple Time Programmable (MTP) Memory ....................................................................................................................................31

6.7 Calibration Sequence ........................................................................................................................................................................37

November 12, 2018

ZSSC3224 Datasheet

6.7.3

6.7.4

6.7.5

6.8.1

6.8.2

6.8.3

Calibration Step 3a) – Coefficient Calculations ..................................................................................................................38

Calibration Step 3b) – Post-Calibration Offset Correction ..................................................................................................38

SSC Measurements ...........................................................................................................................................................39

Bridge Signal Compensation ..............................................................................................................................................39

Temperature Signal Compensation ....................................................................................................................................41

Measurement Output Data Format .....................................................................................................................................42

6.8 The Calibration Math .........................................................................................................................................................................39

Package Outline Drawings .........................................................................................................................................................................43

7.1 ZSSD3224 Die Dimensional Drawings ..............................................................................................................................................43

7.2 24-PQFN Package Dimensions .........................................................................................................................................................44

Quality and Reliability .................................................................................................................................................................................45

Related Documents ....................................................................................................................................................................................45

10. Glossary .....................................................................................................................................................................................................45

11. Marking Diagram ........................................................................................................................................................................................46

12. Ordering Information...................................................................................................................................................................................46

13. Document Revision History ........................................................................................................................................................................47

List of Figures

Figure 1.1

Figure 1.2

Figure 5.1

Figure 5.2

Figure 5.3

Figure 6.1

Figure 6.2

Figure 6.3

Figure 6.4

Figure 6.5

Figure 6.6

Figure 6.7

Figure 6.8

Figure 6.9

ZSSC3224 Die Pad Assignments .....................................................................................................................................................6

Pin Assignments: 4.0



4.0



0.85 mm 24-PQFN Package .............................................................................................................7

ZSSC3224 Functional Block Diagram with Resistive-Bridge Sensor .............................................................................................12

ZSSC3224 Functional Block Diagram with Voltage-Source Sensor...............................................................................................13

ADC Gain and Offset Setup ...........................................................................................................................................................18

Interrupt Functionality .....................................................................................................................................................................21

Operational Flow Chart: Power Up .................................................................................................................................................22

Operational Flow Chart: Command Mode and Normal Mode (Sleep and Cyclic) ..........................................................................23

SPI Configuration CPHA=0 ............................................................................................................................................................28

SPI Configuration CPHA=1 ............................................................................................................................................................28

SPI Command Request ..................................................................................................................................................................29

SPI Read Status .............................................................................................................................................................................29

SPI Read Data................................................................................................................................................................................29

I2C Command Request ..................................................................................................................................................................30

Figure 6.10 I2C Read Status .............................................................................................................................................................................30

Figure 6.11 I2C Read Data ................................................................................................................................................................................30

Figure 7.1

Figure 7.2

Approximate ZSSC3224 Pad Layout ..............................................................................................................................................43

General 24-PQFN Package Dimensions ........................................................................................................................................44

November 12, 2018

ZSSC3224 Datasheet

List of Tables

Table 1.1

Table 1.2

Table 2.1

Table 3.1

Table 3.2

Table 4.1

Table 5.1

Table 5.2

Table 5.3

Table 5.4

Table 5.5

Table 5.6

Table 6.1

Table 6.2

Table 6.3

Table 6.4

Table 6.5

Table 6.6

Table 6.7

Table 6.8

Table 6.9

Table 7.1

ZSSC3224 Die Pad Assignments .....................................................................................................................................................6

ZSSC3224 Pin Descriptions: 24-PQFN Package .............................................................................................................................7

Absolute Maximum Ratings ..............................................................................................................................................................8

Recommended Operating Conditions ..............................................................................................................................................9

Requirements for VDD Power-on Reset ...........................................................................................................................................9

Electrical Characteristics ................................................................................................................................................................10

Amplifier Gain: Stage 1...................................................................................................................................................................14

Amplifier Gain: Stage 2...................................................................................................................................................................14

Gain Polarity ...................................................................................................................................................................................14

ADC Conversion Times for a Single Analog-to-Digital Conversion ................................................................................................15

ADC Offset Shift .............................................................................................................................................................................16

Typical Conversion Times versus Noise Performance with Full Sensor Signal Conditioning for Measurement including AZSM,

SM, AZTM, and TM (Bridge-Type Sensor) .....................................................................................................................................16

SPI/I2C Commands ........................................................................................................................................................................24

Get_Raw Commands .....................................................................................................................................................................26

General Status Byte .......................................................................................................................................................................27

Mode Status ...................................................................................................................................................................................27

MTP Memory Content Assignments ...............................................................................................................................................32

Measurement Results of ADC Raw Measurement Request (Two’s Complement) ........................................................................42

Calibration Coefficients (Factors and Summands) in Memory (Sign Magnitude) ...........................................................................42

Output Results from SSC-Correction Math or DSP—Sensor and Temperature ............................................................................42

Interrupt Thresholds TRSH1 and TRSH2—Format as for SSC-Correction Math Output ...............................................................42

Physical Package Dimensions .......................................................................................................................................................44

November 12, 2018

ZSSC3224BI1B Related Products

	ZSSC3224BI1B	ZSSC3224BI2B	ZSSC3224BI5B	ZSSC3224BI1B ES	ZSSC3224BI3R	ZSSC3224BI1D ES
Description	WAFER (UNSAWN) - BOX	WAFER (UNSAWN) - BOX	WAFER (UNSAWN) - WAFER BOX	WAFER (UNSAWN) - BOX	SENSOR SIGNAL CONDITIONER	DICE (WAFER SAWN) - WAFFLE PACK

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