ZSSC3170EA2R datasheet, PDF - EEWORLD Datasheet

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ZSSC3170EA2R: DescriptionSENSOR SIGNAL CONDITIONER; Categorysemiconductor Analog mixed-signal IC; File Size644KB，30 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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ZSSC3170EA2R Overview

SENSOR SIGNAL CONDITIONER

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Automotive Sensor Signal Conditioner

with LIN and PWM Interface

ZSSC3170

Datasheet

Brief Description

The ZSSC3170 is a CMOS integrated circuit for highly

accurate amplification and sensor specific correction

of bridge sensor signals. Featuring a maximum analog

gain of 420, as well as extended offset compensation

capabilities, the ZSSC3170 is adjustable to nearly all

resistive bridge sensor types.

Digital compensation of offset, sensitivity, temperature

drift, and nonlinearity is accomplished via a 16-bit

RISC microcontroller. Conditioning coefficients are

stored in an EEPROM certified for automotive appli-

cations.

Measured values are provided by one of the digital

LIN or PWM interfaces. Each interface can support

end-of-line calibration using the sensor output. Noise

sensitivity is greatly reduced because the calibration

equipment and the ZSSC3170 are mated digitally.

For quick and easy evaluation and support for

calibrating prototypes, IDT offers the ZSSC3170 SSC

Evaluation Kit, which includes evaluation hardware,

SSOP20 samples, and software.

Benefits



Measurement and temperature signal available via

one output pin

Compatible with nearly all resistive bridge inputs

No external trimming components required

Single-pass calibration minimizes calibration costs

End-of-line calibration using sensor output

Optimized for automotive environments with

special protection circuitry, excellent electro-

magnetic compatibility, and numerous diagnostic

features; AEC-Q100-qualified

Available Support



Evaluation Kit

Application Notes

Calculation Tools

Physical Characteristics



Features



Complies with LIN specifications 1.3 / 2.0 / 2.1

Configurable LIN publisher frame content

Data conversion rate of up to 430Hz fully utilizes

the maximum LIN channel capacity of 20kbit/s

PWM high-side and low-side switches, support for

LIN communication for end-of-line calibration

Digital compensation of offset, gain, temperature

effects up to 2 order, and nonlinearity up to 3

order. Compensation of temperature sensor offset,

gain, and nonlinearity up to 2 order.

Internal or external temperature reference

Media temperature sensing by diode or RTD

Load dump protection of the LIN pin up to ±40V

Accuracy

±0.25% FSO @ -20 to 85°C

±0.50% FSO @ -40 to 125°C

±1.00% FSO @ -40 to 150°C

3 EEPROM words available for optional user data

Supply voltage: 7 to 18 V

Current consumption in Sleep Mode: ≤ 100μA

Input span: 1.8 to 267 mV/V

ADC resolution: 13 to 14 bit

Output resolution: up to 12-bit (LIN and PWM)

Operating temperature range: -40 to 125°C

Extended operating temperature range: ≤150°C

RoHS-compliant delivery form options:

SSOP20, DFN20, or die

ZSSC3170 Basic Circuit

LIN

GND

VBAT

ZSSC3170

May 30, 2016

ZSSC3170 Datasheet

Contents

ZSSC3170 Characteristics ............................................................................................................ 5

1.1

1.2

1.3

1.4

1.5

2.1

2.2

2.3

Absolute Maximum Ratings ..................................................................................................... 5

Operating Conditions............................................................................................................... 6

Electrical Parameters .............................................................................................................. 6

Interface Characteristics ........................................................................................................ 11

EEPROM .............................................................................................................................. 11

Signal Flow and Block Diagram ............................................................................................. 12

Application Modes ................................................................................................................. 13

Analog Front End (AFE) ........................................................................................................ 14

Programmable Gain Amplifier (PGA) ............................................................................... 14

Offset Compensation ....................................................................................................... 14

Analog-to-Digital Converter ............................................................................................. 15

Circuit Description ....................................................................................................................... 12

2.3.1

2.3.2

2.3.3

2.4

2.5

Temperature Measurement ................................................................................................... 17

System Control and Conditioning Calculation ........................................................................ 18

Operating Modes ............................................................................................................. 18

Start-Up Phase ................................................................................................................ 18

Measurement Cycle ......................................................................................................... 19

Conditioning Calculation .................................................................................................. 20

PWM Outputs HOUT and LOUT ...................................................................................... 20

2.5.1

2.5.2

2.5.3

2.5.4

2.6

2.6.1

Signal Outputs....................................................................................................................... 20

2.6.2 LIN Output ....................................................................................................................... 21

2.7 Digital Test and Calibration Interface ..................................................................................... 21

2.8

2.9

3.1

3.2

Diagnostic and Failsafe Features, Watchdog, and Error Detection ........................................ 21

High Voltage, Reverse Polarity, and Short Circuit Protection ................................................. 21

Application Circuit Examples ................................................................................................. 22

Dimensioning of External Components.................................................................................. 23

Application Circuit Examples and External Components ............................................................. 22

Pinout and Package Options ....................................................................................................... 24

4.1 Die Pad Definitions and Configuration ................................................................................... 24

4.2

4.3

SSOP20 Package ................................................................................................................. 25

DFN20 Package .................................................................................................................... 25

May 30, 2016

ZSSC3170 Datasheet

ESD Protection and EMC Specification ....................................................................................... 26

Reliability and RoHS Conformity ................................................................................................. 26

Ordering Information ................................................................................................................... 26

Related Documents ..................................................................................................................... 27

Glossary ...................................................................................................................................... 27

10 Document Revision History ......................................................................................................... 29

List of Figures

Figure 2.1 Block Diagram of ZSSC3170 ........................................................................................... 12

Figure 2.2 Measurement Cycle ........................................................................................................ 19

Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch .................................................. 22

Figure 3.2 Application Circuit in PWM Mode with High-Side Switch ................................................. 22

Figure 3.3 Application Circuit in LIN Mode........................................................................................ 23

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 1.5

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 3.1

Table 4.1

Table 4.2

Absolute Maximum Ratings ............................................................................................... 5

Operating Conditions......................................................................................................... 6

Electrical Parameters ........................................................................................................ 6

Interface Characteristics .................................................................................................. 11

EEPROM ........................................................................................................................ 11

Configuration for Application Modes ................................................................................ 13

Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges

........................................................................................................................................ 14

Bridge Sensor Offset Shift Ranges .................................................................................. 15

A/D Resolution and Conversion Time in PWM Modes ..................................................... 16

A/D Resolution and Conversion Time in LIN Modes ........................................................ 16

Dimensioning of External Components for Application Examples .................................... 23

Die Pad Definitions for ZSSC3170 .................................................................................. 24

Pin Definition of SSOP20 Package .................................................................................. 25

May 30, 2016

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