ZSSC3027AI1D ES datasheet, PDF

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ZSSC3027AI1D ES: DescriptionDICE (WAFER SAWN) - WAFFLE PACK; Categoryunclassified; File Size774KB，46 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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DICE (WAFER SAWN) - WAFFLE PACK

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Low-Power, High-Resolution

16-Bit Sensor Signal Conditioner

ZSSC3027

Datasheet

Brief Description

The ZSSC3027 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Designed for high-resolution altimeter module

applications, the ZSSC3027 can perform offset,

span, and 1 and 2 order temperature compen-

sation of the measured signal. Developed for correc-

tion of resistive bridge sensors, it can also provide a

corrected temperature output measured with an

internal sensor.

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP) run-

ning a correction algorithm. Calibration coefficients

are stored on-chip in a highly reliable, non-volatile,

multiple-time programmable (MTP) memory. Pro-

gramming the ZSSC3027 is simple via the serial

interface. The IC-internal charge pump provides the

MTP programming voltage. The interface is used for

the PC-controlled calibration procedure, which pro-

grams the set of calibration coefficients in memory.

The ZSSC3027 provides accelerated signal process-

ing in order to support high-speed control, safety,

and real-time sensing applications. It complements

IDT’s ZSSC30x6 products.

•

Benefits

Integrated 18-bit calibration math DSP

Fully corrected signal at digital output

One-pass calibration minimizes calibration costs

No external trimming, filter, or buffering com-

ponents required

Highly integrated CMOS design

Excellent for low-voltage and low-power battery

applications

Optimized for operation in calibrated resistive

sensor modules

Physical Characteristics

•

Supply voltage range: 1.7 to 3.6V

Operating mode current consumption:

930µA (typical)

Sleep State current: 20nA (typical)

Temperature resolution: <0.003K/LSB

Operation temperatures: –40°C to +85°C

Small die size

Delivery options: die for wafer bonding

Available Support

•

ZSSC3026 Evaluation Kit can be used to

evaluate ZSSC3027 capabilities

Support Documentation

Features

•

ZSSC3027 Application Example

•

Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing two-

segment analog-to-digital converter (ADC)

Fully programmable gain amplifier accepting

sensors from 14 to 72 (linear factor)

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1 and 2 order digital compensation of sensor

gain as well as of 1 and 2 order temperature

gain and offset drift

Layout optimized for stacked-die bonding for

high-density chip-on-board assembly

Typical sensor elements can achieve accuracy of

better than ±0.10% FSO** @ -40 to 85°C

C™ is a trademark of NXP.

FSO = Full Scale Output.

April 20, 2016

ZSSC3027 Datasheet

Table of Contents

Table of Figures .................................................................................................................................................... 4

List of Tables ........................................................................................................................................................ 5

IC Characteristics .......................................................................................................................................... 6

1.1.

1.2.

1.3.

1.4.

2.1.

2.2.

2.3.

Absolute Maximum Ratings .................................................................................................................... 6

Operating Conditions .............................................................................................................................. 6

Electrical Parameters ............................................................................................................................. 7

Power Supply Rejection Ratio (RSRR) vs. Frequency........................................................................... 9

Brief Description ................................................................................................................................... 10

Signal Flow and Block Diagram............................................................................................................ 10

Analog Front End .................................................................................................................................. 12

Amplifier ......................................................................................................................................... 12

Analog-to-Digital Converter ............................................................................................................ 13

Temperature Measurement ........................................................................................................... 17

Bridge Supply ................................................................................................................................. 17

Digital Signal Processor (DSP) Core ............................................................................................. 17

MTP Memory.................................................................................................................................. 17

Clock Generator ............................................................................................................................. 18

Power Supervision ......................................................................................................................... 18

Interface ......................................................................................................................................... 18

Circuit Description ....................................................................................................................................... 10

2.3.1.

2.3.2.

2.3.3.

2.3.4.

2.4.

2.4.1.

2.4.2.

2.4.3.

2.4.4.

2.4.5.

3.1.

3.2.

3.3.

3.4.

3.5.

Digital Section ....................................................................................................................................... 17

Functional Description ................................................................................................................................. 19

Power Up .............................................................................................................................................. 19

Measurements ...................................................................................................................................... 19

Operational Modes ............................................................................................................................... 19

Command Interpretation ....................................................................................................................... 21

SPI/I C™ Commands .................................................................................................................... 21

Common Functionality ................................................................................................................... 24

SPI ................................................................................................................................................. 25

I C™ ............................................................................................................................................... 28

Programming Memory ................................................................................................................... 30

3.4.1.

3.5.1.

3.5.2.

3.5.3.

3.6.

3.6.1.

Communication Interface...................................................................................................................... 24

Memory ................................................................................................................................................. 29

April 20, 2016

ZSSC3027 Datasheet

3.6.2.

3.6.3.

3.7.

3.7.1.

3.7.2.

3.7.3.

3.8.

3.8.1.

3.8.2.

Memory Status Commands ........................................................................................................... 30

Memory Contents ........................................................................................................................... 31

Calibration Step 1 – Assigning Unique Identification ..................................................................... 37

Calibration Step 2 – Data Collection .............................................................................................. 37

Calibration Step 3 – Coefficient Calculations ................................................................................. 38

Bridge Signal Compensation ......................................................................................................... 39

Temperature Signal Compensation ............................................................................................... 42

Calibration Sequence ........................................................................................................................... 37

The Calibration Math ............................................................................................................................ 39

Die Pad Assignments .................................................................................................................................. 43

Quality and Reliability .................................................................................................................................. 44

Ordering Sales Codes ................................................................................................................................. 44

Related Documents ..................................................................................................................................... 45

Glossary ...................................................................................................................................................... 45

Document Revision History ......................................................................................................................... 46

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

ZSSC3027 Functional Block Diagram ........................................................................................... 11

ADC Offset ..................................................................................................................................... 16

Operational Flow Chart: Power Up ................................................................................................ 20

Operational Flow Chart: Command Mode and Normal Mode ....................................................... 21

SPI Configuration CPHA=0 ........................................................................................................... 25

SPI Configuration CPHA=1 ........................................................................................................... 26

SPI Command Request ................................................................................................................. 26

SPI Read Status ............................................................................................................................ 27

SPI Read Data ............................................................................................................................... 27

C™ Command Request .............................................................................................................. 28

I C™ Read Status .......................................................................................................................... 28

Figure 3.10 I C™ Read Data ............................................................................................................................ 29

Figure 3.11 Memory Program Operation .......................................................................................................... 30

Figure 4.1

ZSSC3027 Pad Assignments ........................................................................................................ 43

April 20, 2016

ZSSC3027 Datasheet

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 3.1

Table 3.2

Table 3.3

Table 3.4

Table 3.5

Table 3.6

Table 3.7

Table 3.8

Table 4.1

Maximum Ratings ............................................................................................................................ 6

Operating Conditions ....................................................................................................................... 6

Requirements for VDD Power-on Reset .......................................................................................... 7

Electrical Parameters ....................................................................................................................... 7

Amplifier Gain: Stage 1 .................................................................................................................. 12

Amplifier Gain: Stage 2 .................................................................................................................. 12

Gain Polarity .................................................................................................................................. 13

MSB/LSB Segmentation Settings for Bridge Measurement .......................................................... 14

MSB/LSB Segmentation Settings for Temperature Measurement ................................................ 14

ADC Conversion Times for a Single A2D Conversion................................................................... 14

Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal

Conditioning for AZBM, BM, AZTM, and TM ................................................................................. 15

ADC Offset Settings for the Measurement Configuration Register BM_config ............................. 16

SPI/I C™ Commands .................................................................................................................... 22

Get_Raw Commands .................................................................................................................... 23

General Status Byte ....................................................................................................................... 24

Status Byte for Read Operations ................................................................................................... 24

Status Byte for Write Operations ................................................................................................... 24

Mode Status ................................................................................................................................... 25

Memory Status Word ..................................................................................................................... 30

MTP Memory Content Assignments .............................................................................................. 31

Pad Assignments ........................................................................................................................... 43

April 20, 2016

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