ZSSC3136BE1D datasheet, PDF - EEWORLD Datasheet

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ZSSC3136BE1D: DescriptionDICE (WAFER SAWN) - WAFFLE PACK; Categoryunclassified; File Size273KB，24 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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Sensor Signal Conditioner for

Safety Switch Applications

ZSSC3136

Datasheet

Brief Description

The ZSSC3136 is a member of the ZSSC313x

family of CMOS integrated circuits for automotive/

industrial sensor applications. All family members

are well suited for highly accurate amplification and

sensor-specific correction of resistive bridge sensor

signals. An internal 16-bit RISC microcontroller

running a correction algorithm compensates sensor

offset, sensitivity, temperature drift, and non-linearity

of the connected sensor element. The required

calibration coefficients are stored by the one-pass

calibration procedure in an on-chip EEPROM.

The ZSSC3136 is optimized for SIL (Safety Integrity

Level) rated switch applications. The integrated

adjustable digital filter offers the possibility of setting

up fast switching real-time applications as well as

stabilized switching applications in the case of

disturbed or unstable input signals.

In addition to the general features for switch appli-

cations, the ZSSC3136 offers the capability to set up

safety-relevant SIL2 rated switches due to its

extended safety functionalities.

Benefits

•

Capability for setting up SIL level 2 applications

Application-focused feature set

No external trimming components required

Only a few external protection devices needed

PC-controlled configuration and one-pass/

end-of-line calibration via I²C™* or ZACwire

interface: simple, cost-efficient, quick, and pre-

cise

High accuracy (0.25% FSO** @ -25 to +85°C;

0.5% FSO @ -40 to +125°C)

Optimized for automotive/ industrial environment

due to robust protection circuitries, excellent

electromagnetic compatibility and AEC-Q100

qualification

Available Support

•

Evaluation Kits

Application Notes

Mass Calibration System

Features

•

Physical Characteristics

Supply voltage 4.5 to 5.5 V

•

Operation temperature: -40°C to +125°C

(-40°C to +150°C extended temperature range

depending on product version)

•

Available in RoHS-compliant JEDEC-SSOP14

package or delivery as die

ZSSC3136 Minimum Application Requirements

•

Analog gain of 105, maximum overall

gain of 420

Sample rate: 200 Hz maximum

ADC resolution: 13/14 bit

External temperature sensor

Safety functionalities: Calibration microcontroller,

sensor connection, analog front-end

Adjustable to nearly all resistive bridge sensor

types

Digital compensation of sensor offset, sensitivity,

temperature drift, and non-linearity

Output options: ratiometric analog voltage output

(5 - 95% in maximum, 12.4 bit resolution) or

ZACwire (digital One-Wire Interface (OWI))

Sensor biasing by voltage

High voltage protection up to 33 V

Supply current: max. 5.5mA

Reverse polarity and short circuit protection

Wide operation temperature: -40 to +150°C

Traceability by user-defined EEPROM entries

* Note: I

C™ is a trademark of NXP.

** FSO = Full Scale Output.

VCC

Sensor

Module

ZSSC3136

OUT

GND

January 22, 2016

ZSSC3136 Datasheet

Contents

Electrical Characteristics ............................................................................................................................... 5

1.1. Absolute Maximum Ratings .................................................................................................................... 5

1.2. Operating Conditions .............................................................................................................................. 5

1.3. Electrical Parameters ............................................................................................................................. 6

1.3.1. Supply Current and System Operation Conditions .......................................................................... 6

1.3.2. Analog Front-End (AFE) Characteristics ......................................................................................... 6

1.3.3. Temperature Measurement ............................................................................................................. 6

1.3.4. A/D Conversion ................................................................................................................................ 7

1.3.5. Sensor Check................................................................................................................................... 7

1.3.6. DAC and Analog Output .................................................................................................................. 7

1.3.7. System Response ............................................................................................................................ 8

1.4. Interface Characteristics and EEPROM ................................................................................................. 9

1.4.1. I²C Interface .................................................................................................................................. 9

1.4.2. ZACwire™ One-Wire Interface (OWI) ............................................................................................. 9

1.4.3. EEPROM .......................................................................................................................................... 9

Circuit Description ....................................................................................................................................... 10

2.1. Signal Flow ........................................................................................................................................... 10

2.2. Application Modes ................................................................................................................................ 11

2.3. Analog Front-End (AFE) ....................................................................................................................... 11

2.3.1. Programmable Gain Amplifier (PGA) ............................................................................................. 11

2.3.2. Offset Compensation ..................................................................................................................... 12

2.3.3. Measurement Cycle ....................................................................................................................... 12

2.3.4. Analog-to-Digital Converter ............................................................................................................ 13

2.4. Temperature Measurement .................................................................................................................. 14

2.5. System Control and Conditioning Calculation ...................................................................................... 14

2.5.1. General Working Modes ................................................................................................................ 14

2.5.2. Startup Phase ............................................................................................................................... 15

2.5.3. Conditioning Calculation ................................................................................................................ 15

2.6. Analog or Digital Output ....................................................................................................................... 16

2.7. Serial Digital Interface .......................................................................................................................... 16

2.8. Failsafe Features .................................................................................................................................. 16

2.9. High Voltage, Reverse Polarity, and Short Circuit Protection .............................................................. 17

Application Circuit Examples ....................................................................................................................... 18

Pin Configuration and Package ................................................................................................................... 20

ESD Protection ............................................................................................................................................ 21

Quality and Reliability .................................................................................................................................. 21

January 22, 2016

ZSSC3136 Datasheet

Customization .............................................................................................................................................. 21

Ordering Information ................................................................................................................................... 21

Related Documents ..................................................................................................................................... 22

Glossary ...................................................................................................................................................... 22

Document Revision History ......................................................................................................................... 24

List of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 4.1

Block Diagram of the ZSSC3136 ................................................................................................... 10

Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement ........ 12

Application with On-Chip Diode Temperature Sensor ................................................................... 18

Application with External Diode Temperature Sensor ................................................................... 19

Application with External Thermistor ............................................................................................. 19

ZSSC3136 SSOP14 Pin Diagram ................................................................................................. 20

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 3.1

Table 4.1

Absolute Maximum Ratings ............................................................................................................. 5

Operating Conditions ....................................................................................................................... 5

Electrical Parameters ....................................................................................................................... 6

Interface Characteristics and EEPROM .......................................................................................... 9

Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges ......................... 11

ADC Resolution versus Output Resolution and Sample Rate ....................................................... 14

External Components for Application Circuit Examples ................................................................ 18

Pin Configuration and Definition .................................................................................................... 20

January 22, 2016

ZSSC3136BE1D Related Products

	ZSSC3136BE1D	ZSSC3136BE2T	ZSSC3136BA1B	ZSSC3136BA1C	ZSSC3136BE1B	ZSSC3136BE1C	ZSSC3136BE2R	ZSSC3136BA2T	ZSSC3136BA1D
Description	DICE (WAFER SAWN) - WAFFLE PACK	Sensor Interface Sensor Signal Conditoner	WAFER (UNSAWN) - BOX	DICE (WAFER SAWN) - FRAME	WAFER (UNSAWN) - BOX	DICE (WAFER SAWN) - FRAME	SENSOR SIGNAL CONDITIONER	SENSOR SIGNAL CONDITIONER	DICE (WAFER SAWN) - WAFFLE PACK

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