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Y16294K64000B9W

Description
RES SMD 4.64KOHM 0.1% 1/10W 0805
CategoryPassive components   
File Size379KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

Y16294K64000B9W Overview

RES SMD 4.64KOHM 0.1% 1/10W 0805

Y16294K64000B9W Parametric

Parameter NameAttribute value
resistance4.64 kOhms
Tolerance±0.1%
Power (W)0.1W,1/10W
componentmetal foil
characteristicAnti-sulfation, moisture-proof, no inductance
Temperature Coefficient±0.2ppm/°C
Operating temperature-55°C ~ 150°C
Package/casing0805 (2012 Metric)
Supplier device packaging805
size/dimensions0.079" long x 0.049" wide (2.01mm x 1.24mm)
Height - Installation (maximum)0.025"(0.64mm)
Number of terminals2
failure rate-
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
Ultra High-Precision Z-Foil Flip Chip Resistor
with TCR of ±0.2 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Bulk Metal
®
Foil resistors are not restricted to standard
values; specific “as required” values can be supplied at
no extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μV
rms
/ V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Rapid prototype sample quantities are available.
For more information, please contact us at
foil@vpgsensors.com
critical applications by eliminating the need for corrective
circuitry and reducing the large land patterns needed
for a wrap-around configuration. The device’s flip-chip
configuration saves up to 35% PCB space compared with
a surface-mount chip with wraparound terminations while
also providing better strain relief to eliminate cracked
substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
INTRODUCTION
Based on VFR’s Bulk Metal Z-Foil technology, the VFCP
Series (foil resistor flip-chip) excels over all previous
stability standards for precision resistors with an order
of magnitude improvement in high-temperature stability,
load-life stability, and moisture resistance. These new
benchmark levels of performance provide design
engineers with the tools to build circuits not previously
achievable while reducing costs and space in the most
*
RELATED VIDEO
Refer to
Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example,
parts with lead (Pb) terminations are not RoHS compliant. Please see the information/tables in this datasheet for details.
Document No.: 63106
Revision: 19-Oct-2015
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
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