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3305-25MMX100M

Description
3305 25MMX100M PL 40 EXP
Categoryaccessories   
File Size38KB,2 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Download Datasheet View All

3305-25MMX100M Overview

3305 25MMX100M PL 40 EXP

Technical Data
October 2014
3M
Wafer De-Taping Tape 3305 for 3M
WSS
Product Description
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal
of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is
separated from the silicon wafer.
Features and Benefits
• Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass
carrier debonding
• Transparency allows for inspection without tape removal
• High instant adhesion to substrate
• Good holding power
Product Construction
Backing: Polyester film
PSA: Rubber adhesive
(Nominal 0.038mm thickness)
(Nominal 0.030mm thickness)
Typical Physical Properties
Note:
The following technical information and data should be considered representative or typical only and should
not be used for specification purposes.
Properties
Tape Thickness
Tensile Strength
Elongation
Adhesion Strength (SUS)*
1
Unit
mm
N/cm
%
N/cm
Value
0.068
78.4
125
9.41
JIS Z 0237
Test Method
*1:
Adhesion Strength is 180° peel strength on Stainless Steel.
- Substrate: Stainless Steel (SUS304) treated by abrading with #280 abrasive
- Pressure: 2kg rubber roller once for each direction
- Peel speed: 300mm/min.
- Sample width: 25mm
- Dwell time: from 20 to 40 minutes
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