Multistage Series MS2-049-10-10-15-15
Thermoelectric Modules
The MS Series of thermoelectric modules (TEMs) are designed to
reach cool down temperatures that are not achievable with single
stage TEMs.
This product line is available in numerous heat pumping capacities,
geometric shapes and temperature differentials. Assembled with
Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the MS Series is designed for higher
current and lower heat-pumping applications.
FEATURES
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
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High temperature differential
Precise temperature control
Reliable solid state operation
Environmentally friendly
DC operation
RoHS compliant
CCD cameras
Electron microscope
Calibration equipment
Photonics laser systems
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Gas analyzers
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Infrared (IR) sensors
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Guidance systems
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APPLICATIONS
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
25°C
3.5
87
2.2
3.7
SUFFIX
00
11
22
THICKNESS
(PRIOR TO
TINNING)
FLATNESS &
PARALLELISM
0.001”/0.004”
0.001”/0.002”
0.001”/0.004”
HOT FACE
Metallized
Lapped
Pre-tinned
COLD FACE
Metallized
Lapped
Pre-tinned
LEAD LENGTH
7.87”
7.87”
7.87”
0.268”±0.008”
0.256”±0.008”
0.268”±0.008”
SEALING OPTIONS
SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION
RT
EP
RTV
Epoxy
White
Black
-60 to 204 °C
-55 to 150 °C
Non-corrosive, silicone adhesive
Low density syntactic foam epoxy encapsulant
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MS2-049-10-10-15-15
NOTES
1. Max operating temperature: 80°C
2. Do not exceed Imax or Vmax when operating module
3. Reference assembly guidelines for recommended installation
4. Solder tinning also available on metallized ceramics
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
LAIRD-ETS-MS2-049-10-10-15-15-DATA-SHEET-101416
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Microcontroller MCU
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