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MXLPLAD15KP70CA

Description
TVS DIODE 70V 113V PLAD
CategoryDiscrete semiconductor    diode   
File Size417KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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MXLPLAD15KP70CA Overview

TVS DIODE 70V 113V PLAD

MXLPLAD15KP70CA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionPLASTIC PACKAGE-1
Contacts1
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Maximum breakdown voltage86 V
Minimum breakdown voltage77.8 V
Breakdown voltage nominal value81.9 V
Shell connectionCATHODE
Maximum clamping voltage113 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PSSO-G1
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation15000 W
Number of components1
Number of terminals1
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation2.5 W
Certification statusNot Qualified
GuidelineMIL-19500
Maximum repetitive peak reverse voltage70 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
MPLAD15KP7.0A –
MPLAD15KP200CA
Available
Surface Mount 15,000 Watt
Transient Voltage Suppressor
DESCRIPTION
High-Reliability
screening available in
reference to
MIL-PRF-19500
These high power 15 kW rated transient voltage suppressors in a surface mount package are
provided with design features to minimize thermal resistance and cumulative heating.
Typical
applications include lightning and automotive load dump protection.
They are particularly effective at
meeting the multi-stroke lightning standard RTCA DO-160, section 22 for aircraft design. This
efficient low profile package design is offered in standoff voltage selections (V
WM
) of 7 volts to
200 volts in either unidirectional or bidirectional construction.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
Available in both unidirectional and bidirectional construction (bidirectional with CA suffix)
High reliability with wafer fabrication and assembly lot traceability
All parts surge tested
Low profile surface mount package
Optional upscreening is available with various screening and conformance inspection options based
on MIL-PRF-19500. Refer to
Hirel Non-Hermetic Product Portfolio
for more details on the screening
options.
Suppresses transients up to 15,000 W @ 10/1000 μs (see
Figure 1)
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant versions are available
3σ lot norm screening performed on standby current (I
D
)
PLAD
(The cathode is the metal base
under the body of this device.)
Also available:
PLAD30KP
(30,000 watts)
MPLAD30KP14A thru
MPLAD30KP400CA
APPLICATIONS / BENEFITS
Protection from switching transients and induced RFI
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC 61000-4-5 with 42 ohms source impedance:
Class 1,2,3,4,5: MPLAD15KP7.0A to 200CA
Secondary lightning protection per IEC 61000-4-5 with 12 ohms source impedance:
Class 1,2,3,4: MPLAD15KP7.0A to 200CA
Secondary lightning protection per IEC 61000-4-5 with 2 ohms source impedance:
Class 2,3: MPLAD15KP7.0A to 200CA
Class 4: MPLAD15KP5.0 to 54CA
Pin injection protection per RTCA/DO-160F for Waveform 4 (6.4/69 μs at 25 ºC)*:
Level 4: MPLAD15KP7.0A to 200CA
Level 5: MPLAD15KP7.0A to 100CA
Pin injection protection per RTCA/DO-160F for Waveform 5A (40/120 μs at 25 ºC)*:
Level 4: MPLAD15KP7.0A to 28CA
*See
MicroNote 132
for further temperature derating selection.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01004, Rev F (5/16/14)
©2013 Microsemi Corporation
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