A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
This is a high-power PW device in the L bandAs shown in the pictureThe design requirements of the filter are also high powerThe picture belowScrewThere are traces of burns in the picture...
I would like to ask where I can find the 12*12*7 chip power inductor package 127 series in the component library, or can I only draw it myself? Also, if the conventional package of the chip aluminum e...
[align=center][font=punctuation, 微软雅黑, Tohoma][size=12px][color=rgb(0, 0, 0)][font=微软雅黑][color=#000000][size=26px]Yuan Fang, what do you think of this circuit? (7-End)[/size][/color][/font][/color][/s...
Tips to reduce the damage to hard disk caused by BT downloadsAlthough BT download is very popular now, and there are many resources on the Internet, it seems that more and more people think that BT do...
Today I tested the GNSS function on Beetle ESP32-C3. The GNSS is VK2828, Beidou + GPS dual-mode, and the positioning speed is relatively fast.The power supply of GNSS is directly from 3.3V on Beetle E...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
In
circuit design,
current
measurement
is widely used, and the main fields are divided into three categories: in measurement,
the electric meter
is used to measure the curre...[Details]
Do you often have to add brake fluid to your car's brakes? The fact that you need to pump out the brake fluid to make sure there is no gas in the brake fluid line may not be done by the car owner h...[Details]
For a long time, due to the limitation of hardware conditions, the display devices of traditional small handheld devices such as PDA are usually monochrome LCD, and the user interface is very simpl...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
1. Principle of displacement angle sensor
The angle sensor is used to detect angles. It has a hole in its body that fits the LEGO axle. When connected to the RCX, the angle sensor counts once ...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
Corelink Semiconductor has launched the CL1100-based 5-7W E27 LED lighting driver system solution DB2. This driver module meets the requirements of small size (L×W×H=5.1cm×2.1cm×1.8cm), low standby...[Details]
This article will introduce a design method for a distributed control system used in a tracking car, which can perform distributed control of motor modules, sensor modules, and lighting control mod...[Details]
The serial interface real-time clock chip DS1302 launched by Dallas Company in the United States can trickle charge the backup battery of the clock chip. Due to the main features of the chip such a...[Details]
introduction
At present, measuring instruments are developing towards networking, and each individual embedded instrument will become a node on the Internet. This system realizes the network...[Details]
Abstract: In order to realize wireless automatic alarm and monitoring of major safety places, based on the basic principle of pyroelectric infrared sensing, a detector for receiving infrared radia...[Details]
1 Introduction to LED
With the development of science and technology, people have higher and higher requirements on automobile light sources. LED (Light Emitting Diode) has gradually attracted...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
At present, with the diversification of portable products and the almost harsh requirements for audio and video parts, the power consumption requirements of the whole machine have been raised to a ...[Details]
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
