A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
3.4.2 Hardware Test (Disable Cache and Use Cache)
Modify the code in the main.c file to select the hardware test mode, as shown in the following figure:
After recompiling, use the emulator to connect ...
Previous designs were basically completed based on buck devices. This time I tried the solution of 5V to 12V. Let's see how it works. Requirements: input 5V-9V, output current <=0.5A Enter the relevan...
Job Description: 1. Complete FPGA programming, debugging and subsequent maintenance work according to customer needs 2. Engage in drawing embedded schematics Job Requirements: 1. Proficient in VHDL an...
Intel introduced a method to maintain NAND data integrity in SSDs using a 20nm process at the Flash Summit. [/align][align=left][url=]http://www.flashmemorysummit.com/English/Collaterals/Proceedings/2...
[font=楷体, 楷体_GB2312][size=6][color=#2e8b57][b]I would like to obtain a copy of the test standard for constant-pressure audio broadcasting, UIC-568 "Railway Passenger Car Audio Equipment"[/b][/color][/...
Introduction
Power subsystems are becoming more and more integrated into the overall system. Power systems have moved from being separate "essential dangerous devices" to being monitorable...[Details]
To differentiate their products in a crowded and competitive market, manufacturers of handheld devices often consider battery life and power management as key selling points for cell phones, PDAs, ...[Details]
July 11, 2012, Beijing - Altera Corporation (NASDAQ: ALTR) today announced the launch of 40-Gbps Ethernet (40GbE) and 100-Gbps Ethernet (100GbE) intellectual property (IP) core products. These core...[Details]
1. Principle of displacement angle sensor
The angle sensor is used to detect angles. It has a hole in its body that fits the LEGO axle. When connected to the RCX, the angle sensor counts once ...[Details]
The data collector of the automatic weather station is generally designed based on a single-chip microcomputer or a PC/104 bus controller. It has the characteristics of good compatibility with PC, low...[Details]
In the single-chip microcomputer system, in addition to display devices, sound devices are often used, and the most common sound device is the buzzer. Buzzers are generally used for some low-demand...[Details]
1. Disadvantages of choosing too high a voltage level
Choosing too high a voltage level will result in too high an investment and a long payback period. As the voltage level increases, the...[Details]
Corelink Semiconductor has launched the CL1100-based 5-7W E27 LED lighting driver system solution DB2. This driver module meets the requirements of small size (L×W×H=5.1cm×2.1cm×1.8cm), low standby...[Details]
The above is to use MB1404 as a stereo composite signal transmitter. You can use the internal high-frequency amplifier and oscillator or not! According to my experience, I still recommend beginners...[Details]
Cars equipped with xenon headlights are already common on the road. Whether they are standard equipment on high-end cars or embellishments on modified cars, xenon lamps are gradually becoming a sym...[Details]
1. Introduction
AS-Interface bus technology is an intelligent network that uses a single cable to connect sensors and actuators to controllers, transmit data, and provide power. It can be used...[Details]
1. Fully understand the design requirements of all parties and determine the appropriate solution.
When starting a hardware development project, the original driving force will come from many a...[Details]
With the explosive growth of electronic functions in cars, will more and more luxurious cars endanger the safety of passengers? This is the origin of the problem of over-electrification of cars. What ...[Details]
The battery and its management system are one of the key technologies of electric vehicles. In the past few years, most companies have encountered embarrassment in the development of electric vehic...[Details]
The cruise control system (CCS) of a vehicle is also called a constant speed driving system. It is an electronic control device that uses advanced electronic technology to automatically adjust the ...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
