Package Information Datasheet for
Mature Altera Devices
DS-PKG-16.8
This datasheet provides package and thermal resistance information for mature
Altera
®
devices. Package information includes the ordering code reference, package
acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead
coplanarity, weight, moisture sensitivity level, and other special information. The
thermal resistance information includes device pin count, package name, and
resistance values.
This datasheet includes the following sections:
■
■
■
“Device and Package Cross Reference” on page 1
“Thermal Resistance” on page 23
“Package Outlines” on page 44
f
For more package and thermal resistance information about Altera devices that are
not listed in this datasheet, refer to the
Package and Thermal Resistance
page of the
Altera website.
For information about trays, tubes, and dry packs, refer to
AN 71: Guidelines for
Handling J-Lead, QFP, and BGA Devices.
RoHS-compliant devices are compatible with leaded-reflow temperatures. For more
information, refer to
Altera’s RoHS-Compliant Devices
literature page.
f
f
Device and Package Cross Reference
Table 2
through
Table 22
lists the device, package type, and number of pins for each
Altera device listed in this datasheet. Altera devices listed in this datasheet are
available in the following packages:
■
■
■
■
■
■
■
■
■
■
■
Ball-Grid Array (BGA)
Ceramic Pin-Grid Array (PGA)
FineLine BGA (FBGA)
Hybrid FineLine BGA (HBGA)
Plastic Dual In-Line Package (PDIP)
Plastic Enhanced Quad Flat Pack (EQFP)
Plastic J-Lead Chip Carrier (PLCC)
Plastic Quad Flat Pack (PQFP)
Power Quad Flat Pack (RQFP)
Thin Quad Flat Pack (TQFP)
Ultra FineLine BGA (UBGA)
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
2
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Table 1
lists the Altera devices and the associated table locations.
Table 1.
Mature Altera Device and Package Cross Reference
Altera Device
Arria
®
series FPGAs
Stratix
®
series FPGAs
Cyclone
®
series FPGAs
■
■
■
■
■
■
Table locations
Arria GX Devices:
Table 2 on page 3
Stratix II Devices:
Table 3 on page 3
Stratix Devices:
Table 4 on page 5
Cyclone II Devices:
Table 5 on page 7
Cyclone Devices:
Table 6 on page 8
MAX 9000 Devices:
Table 7 on page 8
MAX 7000 Devices:
Table 8 on page 9
MAX 3000A Devices:
Table 9 on page 10
HardCopy II Devices:
Table 10 on page 11
HardCopy Devices:
Table 11 on page 11
HardCopy APEX Devices:
Table 12 on page 12
APEX II Devices:
Table 13 on page 13
APEX 20KE Devices:
Table 14 on page 13
APEX 20KC Devices:
Table 15 on page 15
APEX 20K Devices:
Table 16 on page 15
MAX
®
series CPLDs
■
■
■
HardCopy
®
series ASICs
■
■
■
APEX™ series FPGAs
■
■
■
ACEX
®
1K FPGAs
Mercury™ FPGAs
FLEX
®
series FPGAs
Excalibur™ FPGAs
Configuration devices
Enhanced configuration devices
ACEX 1K Devices:
Table 17 on page 16
Mercury Devices:
Table 18 on page 17
■
■
■
FLEX 10KA Devices:
Table 19 on page 17
FLEX 10KS Devices:
Table 20 on page 18
FLEX 10KE Devices:
Table 21 on page 18
Excalibur Devices:
Table 22 on page 21
Configuration Devices:
Table 23 on page 22
Enhanced Configuration Devices:
Table 24 on page 22
Package Information Datasheet for Mature Altera Devices
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
3
Arria GX Devices
Table 2
lists the device name, package type, and number of pins for the Arria GX
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 2.
Arria GX Devices
Device
Package
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single- Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Channel Lid: FBGA, Flip Chip, Option 1
EP1AGX50
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Channel Lid: FBGA, Flip Chip, Option 1
EP1AGX60
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
EP1AGX90
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Pins
484
780
484
780
484
780
1152
484
780
1152
1152
EP1AGX20
EP1AGX35
Stratix II Devices
Table 3
lists the device name, package type, and number of pins for the Stratix II
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 3.
Stratix II Devices (Part 1 of 2)
Device
Package
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Pins
484
672
EP2S15
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
4
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Table 3.
Stratix II Devices (Part 2 of 2)
Device
Package
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
EP2S60
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, option 2
Channel Lid: HBGA, Flip Chip
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
EP2S90
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Channel Lid: FBGA, Flip Chip, Option 1
EP2S130
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Pins
484
672
484
672
1020
484
780
1020
1508
780
1020
1508
1020
1508
780
780
1152
1152
1508
1508
EP2S30
EP2S180
EP2SGX30
EP2SGX60
EP2SGX90
EP2SGX130
Package Information Datasheet for Mature Altera Devices
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
5
Stratix Devices
Table 4
lists the device name, package type, and number of pins for the Stratix device
family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 4.
Stratix Devices (Part 1 of 2)
Device
EP1SGX10
Package
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
EP1S10
BGA, Wire Bond
FBGA, Wire Bond, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
EP1S20
BGA, Wire Bond
FBGA, Wire Bond, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
BGA, Wire Bond
FBGA, Wire Bond, Option 2
EP1S25
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
EP1S30
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Pins
672
672
1020
1020
484
672
672
780
484
672
672
780
672
672
780
1020
780
956
1020
EP1SGX25
EP1SGX40
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
Programming Basics
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