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BUK150-50DL,127

Description
MOSFET N-CH 50V 20A I2PAK
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size42KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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BUK150-50DL,127 Overview

MOSFET N-CH 50V 20A I2PAK

BUK150-50DL,127 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSFM
package instructionHSIP,
Contacts3
Manufacturer packaging codeSOT226
Reach Compliance Codecompliant
ECCN codeEAR99
Built-in protectionOVER CURRENT; OVER VOLTAGE; THERMAL
Interface integrated circuit typeBUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 codeR-PSIP-T3
length10 mm
Number of functions1
Number of terminals3
Output current flow directionSINK
Nominal output peak current43 A
Package body materialPLASTIC/EPOXY
encapsulated codeHSIP
Package shapeRECTANGULAR
Package formIN-LINE, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)245
Certification statusNot Qualified
Maximum seat height12.95 mm
surface mountNO
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperature40
Disconnect time120 µs
connection time50 µs
width4.3 mm
Philips Semiconductors
Product specification
Logic level TOPFET
BUK150-50DL
DESCRIPTION
Monolithic temperature and
overload protected logic level power
MOSFET in
TOPFET2
technology
assembled in a 3 pin plastic
package.
QUICK REFERENCE DATA
SYMBOL
V
DS
I
D
P
D
T
j
R
DS(ON)
I
ISL
PARAMETER
Continuous drain source voltage
Continuous drain current
Total power dissipation
Continuous junction temperature
Drain-source on-state resistance
Input supply current
V
IS
= 5 V
MAX.
50
20
90
150
28
650
UNIT
V
A
W
˚C
mΩ
µA
APPLICATIONS
General purpose switch for driving
lamps
motors
solenoids
heaters
in automotive systems and other
applications.
FEATURES
TrenchMOS output stage
Current limiting
Overload protection
Overtemperature protection
Protection latched reset by input
5 V logic compatible input level
Control of output stage and
supply of overload protection
circuits derived from input
Low operating input current
permits direct drive by
micro-controller
ESD protection on all pins
Overvoltage clamping for turn
off of inductive loads
FUNCTIONAL BLOCK DIAGRAM
DRAIN
O/V
CLAMP
INPUT
RIG
POWER
MOSFET
LOGIC AND
PROTECTION
SOURCE
Fig.1. Elements of the TOPFET.
PINNING - SOT226
PIN
1
2
3
tab
input
drain
source
drain
DESCRIPTION
PIN CONFIGURATION
tab
SYMBOL
D
TOPFET
I
P
1 2 3
S
May 2001
1
Rev 1.100

BUK150-50DL,127 Related Products

BUK150-50DL,127 BUK150-50DL127 BUK150-50DL
Description MOSFET N-CH 50V 20A I2PAK MOSFET RAIL TOPFET2 IC 43 A BUF OR INV BASED PRPHL DRVR, PSIP3, PLASTIC, SOT-226, 3 PIN, Peripheral Driver
Is it Rohs certified? conform to - conform to
Maker NXP - NXP
Parts packaging code SFM - SFM
package instruction HSIP, - PLASTIC, SOT-226, 3 PIN
Contacts 3 - 3
Manufacturer packaging code SOT226 - SOT226
Reach Compliance Code compliant - unknown
ECCN code EAR99 - EAR99
Built-in protection OVER CURRENT; OVER VOLTAGE; THERMAL - OVER CURRENT; OVER VOLTAGE; THERMAL
Interface integrated circuit type BUFFER OR INVERTER BASED PERIPHERAL DRIVER - BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code R-PSIP-T3 - R-PSIP-T3
length 10 mm - 10 mm
Number of functions 1 - 1
Number of terminals 3 - 3
Output current flow direction SINK - SOURCE
Nominal output peak current 43 A - 43 A
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code HSIP - HSIP
Package shape RECTANGULAR - RECTANGULAR
Package form IN-LINE, HEAT SINK/SLUG - IN-LINE, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 245 - 245
Certification status Not Qualified - Not Qualified
Maximum seat height 12.95 mm - 12.95 mm
surface mount NO - NO
Terminal form THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 2.54 mm - 2.54 mm
Terminal location SINGLE - SINGLE
Maximum time at peak reflow temperature 40 - 40
Disconnect time 120 µs - 120 µs
connection time 50 µs - 50 µs
width 4.3 mm - 4.3 mm
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