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74ABT827DB,112

Description
IC BUF NON-INVERT 5.5V 24SSOP
Categorylogic    logic   
File Size172KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74ABT827DB,112 Overview

IC BUF NON-INVERT 5.5V 24SSOP

74ABT827DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP2
package instructionSSOP, SSOP24,.3
Contacts24
Manufacturer packaging codeSOT340-1
Reach Compliance Codecompliant
Other featuresWITH DUAL OUTPUT ENABLE
Control typeENABLE LOW
seriesABT
JESD-30 codeR-PDSO-G24
JESD-609 codee4
length8.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.064 A
Humidity sensitivity level1
Number of digits10
Number of functions1
Number of ports2
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP24,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply5 V
Maximum supply current (ICC)38 mA
Prop。Delay @ Nom-Sup4.8 ns
propagation delay (tpd)4.7 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
Base Number Matches1
74ABT827
10-bit buffer/line driver; non-inverting; 3-state
Rev. 5 — 7 November 2011
Product data sheet
1. General description
The 74ABT827 high-performance BiCMOS device combines low static and dynamic
power dissipation with high speed and high output drive.
The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide
data/address paths or buses carrying parity. They have NOR Output Enables (OE0, OE1)
for maximum control flexibility.
2. Features and benefits
Ideal where high speed, light loading, or increased fan-in are required
Flow-through pinout architecture for microprocessor oriented applications
Output capability: +64 mA and
32
mA
Power-up 3-state
Inputs are disabled during 3-state mode
Latch-up protection exceeds 500 mA per JESD78B class II level A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74ABT827D
74ABT827DB
74ABT827PW
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
Name
SO24
SSOP24
TSSOP24
Description
Version
plastic small outline package; 24 leads; body width SOT137-1
7.5 mm
plastic shrink small outline package; 24 leads; body SOT340-1
width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
Type number

74ABT827DB,112 Related Products

74ABT827DB,112 74ABT827D,623 74ABT827DB,118 74ABT827PW,118 935069210112 935178930112 935178930118 935069210118
Description IC BUF NON-INVERT 5.5V 24SSOP IC BUFFER NON-INVERT 5.5V 24SO IC BUF NON-INVERT 5.5V 24SSOP IC BUF NON-INVERT 5.5V 24TSSOP ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 5.3 MM HEIGHT, PLASTIC, MO-150, SOT340-1, SSOP-24 ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.4 MM HEIGHT, PLASTIC, MO-153, SOT355-1, TSSOP-24 ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.4 MM HEIGHT, PLASTIC, MO-153, SOT355-1, TSSOP-24 ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 5.3 MM HEIGHT, PLASTIC, MO-150, SOT340-1, SSOP-24
Maker NXP NXP NXP NXP NXP NXP NXP NXP
package instruction SSOP, SSOP24,.3 SOP, SOP24,.4 SSOP, SSOP24,.3 TSSOP, TSSOP24,.25 SSOP, TSSOP, TSSOP, SSOP,
Reach Compliance Code compliant compliant compliant compliant unknown unknown unknown unknow
Other features WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
series ABT ABT ABT ABT ABT ABT ABT ABT
JESD-30 code R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4
length 8.2 mm 15.4 mm 8.2 mm 7.8 mm 8.2 mm 7.8 mm 7.8 mm 8.2 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 10 10 10 10 10 10 10 10
Number of functions 1 1 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2 2 2
Number of terminals 24 24 24 24 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SOP SSOP TSSOP SSOP TSSOP TSSOP SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
propagation delay (tpd) 4.7 ns 4.7 ns 4.7 ns 4.7 ns 4.7 ns 4.7 ns 4.7 ns 4.7 ns
Maximum seat height 2 mm 2.65 mm 2 mm 1.1 mm 2 mm 1.1 mm 1.1 mm 2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 5.3 mm 7.5 mm 5.3 mm 4.4 mm 5.3 mm 4.4 mm 4.4 mm 5.3 mm

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