74ABT827PW,118 datasheet, PDF - EEWORLD Datasheet

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74ABT827PW,118: DescriptionIC BUF NON-INVERT 5.5V 24TSSOP; Categorylogic logic; File Size172KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74ABT827PW,118 Overview

IC BUF NON-INVERT 5.5V 24TSSOP

74ABT827PW,118 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	TSSOP2
package instruction	TSSOP, TSSOP24,.25
Contacts	24
Manufacturer packaging code	SOT355-1
Reach Compliance Code	compliant
Other features	WITH DUAL OUTPUT ENABLE
Control type	ENABLE LOW
series	ABT
JESD-30 code	R-PDSO-G24
JESD-609 code	e4
length	7.8 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.064 A
Humidity sensitivity level	1
Number of digits	10
Number of functions	1
Number of ports	2
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP24,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Maximum supply current (ICC)	38 mA
Prop。Delay @ Nom-Sup	4.8 ns
propagation delay (tpd)	4.7 ns
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BICMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	4.4 mm
Base Number Matches	1

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74ABT827

10-bit buffer/line driver; non-inverting; 3-state

Rev. 5 — 7 November 2011

Product data sheet

1. General description

The 74ABT827 high-performance BiCMOS device combines low static and dynamic

power dissipation with high speed and high output drive.

The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide

data/address paths or buses carrying parity. They have NOR Output Enables (OE0, OE1)

for maximum control flexibility.

2. Features and benefits



Ideal where high speed, light loading, or increased fan-in are required

Flow-through pinout architecture for microprocessor oriented applications

Output capability: +64 mA and

32

Power-up 3-state

Inputs are disabled during 3-state mode

Latch-up protection exceeds 500 mA per JESD78B class II level A

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74ABT827D

74ABT827DB

74ABT827PW

40 C

to +85

C

40 C

to +85

C

40 C

to +85

C

Name

SO24

SSOP24

TSSOP24

Description

Version

plastic small outline package; 24 leads; body width SOT137-1

7.5 mm

plastic shrink small outline package; 24 leads; body SOT340-1

width 5.3 mm

plastic thin shrink small outline package; 24 leads;

body width 4.4 mm

SOT355-1

Type number

74ABT827PW,118 Related Products

	74ABT827PW,118	74ABT827D,623	74ABT827DB,112	74ABT827DB,118	935069210112	935178930112	935178930118	935069210118
Description	IC BUF NON-INVERT 5.5V 24TSSOP	IC BUFFER NON-INVERT 5.5V 24SO	IC BUF NON-INVERT 5.5V 24SSOP	IC BUF NON-INVERT 5.5V 24SSOP	ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 5.3 MM HEIGHT, PLASTIC, MO-150, SOT340-1, SSOP-24	ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.4 MM HEIGHT, PLASTIC, MO-153, SOT355-1, TSSOP-24	ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.4 MM HEIGHT, PLASTIC, MO-153, SOT355-1, TSSOP-24	ABT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 5.3 MM HEIGHT, PLASTIC, MO-150, SOT340-1, SSOP-24
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	TSSOP, TSSOP24,.25	SOP, SOP24,.4	SSOP, SSOP24,.3	SSOP, SSOP24,.3	SSOP,	TSSOP,	TSSOP,	SSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	unknown	unknown	unknown	unknow
Other features	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE
series	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4
length	7.8 mm	15.4 mm	8.2 mm	8.2 mm	8.2 mm	7.8 mm	7.8 mm	8.2 mm
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Number of digits	10	10	10	10	10	10	10	10
Number of functions	1	1	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2	2	2
Number of terminals	24	24	24	24	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOP	SSOP	SSOP	SSOP	TSSOP	TSSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
propagation delay (tpd)	4.7 ns	4.7 ns	4.7 ns	4.7 ns	4.7 ns	4.7 ns	4.7 ns	4.7 ns
Maximum seat height	1.1 mm	2.65 mm	2 mm	2 mm	2 mm	1.1 mm	1.1 mm	2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	4.4 mm	7.5 mm	5.3 mm	5.3 mm	5.3 mm	4.4 mm	4.4 mm	5.3 mm

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