®
Technical Data Sheet
WP601-ZH Solder Paste
Product Description
Zero-Halogen Lead-Free Water-Soluble
Kester WP601-ZH
is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow
applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent
print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen
flux formulation. WP601-ZH is a stable water-soluble formula, providing consistent stencil life, tack time and print
definition. WP601-ZH is classified as ORM0 flux under IPC J-STD-004B.
Performance Characteristics:
■
Zero-halogen (none intentionally
added)
■
Cleaning can be accomplished with
heated de-ionized water
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Consistent printing performance at
wide humidity levels (30-60% RH)
■
Good solderability in air under
straight profiles
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the
stated banned substances.
Physical Properties
Initial Tackiness (typical):
35 grams
Tested to J-STD-005A, IPC-TM-650, Method
2.4.44
Slump Test:
Pass
Tested to J-STD-005A, IPC-TM-650, Method
2.4.35
Solder Ball Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Viscosity:
2200 poise
Malcom Viscometer PCU-203 @ 10 rpm, 25°C,
measurement after 9 minutes
Reliability Properties
Copper Mirror Corrosion:
Moderate
Tested to J-STD-004B, IPC-TM-650, Method
3.1.1.1
Surface Insulation Resistivity (SIR):
Pass, All Readings >1.0x10
8
Ω
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Halogen Content:
None Detected
Tested to J-STD-004B, IPC-TM-650, Method
2.3.28.1
Corrosion Test:
Moderate
Tested to J-STD-004B, IPC-TM-650, Method
3.4.1.2
Surface Insulation Resistivity (SIR):
Pass All Readings >1.0x10
8
Ω
Tested to J-STD-004A, IPC-TM-650, Method
2.6.3.3
Electro Chemical Migration (ECM):
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.14.1
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
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Phone: +1 800.2.KESTER
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Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
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Phone: +65 6.449.1133
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Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
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Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
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Suzhou, Jiangsu Province, China 215200
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Phone: +86 512.82060807
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Fax: +86 512.8206 0808
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Website: www.kester.com
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Application Notes
Availability
®
WP601-ZH is available in the SAC305 alloy with Type 4 powder. This is recommended for standard and fine pitch applica-
tions. For specific packaging information refer to Kester’s Solder Paste Packaging Chart for available sizes. The appropri-
ate combination depends on process variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80 mm/sec (3 in/sec), process window is under evaluation
25mm/sec–150mm/sec
Stainless Steel
Optimal ranges are 20-25°C (68-77°F) and 30-60% RH
Recommended Reflow Profile
The general recommended reflow profile for WP601-ZH
formula made with SAC alloys is shown here as a starting
point. Your final profile will depend on your board mass
and component combination. WP601-ZH has excellent
solderability and wetting capabilities in air or nitrogen
reflow atmospheres. Please contact Kester Technical
Support if you need profiling advice.
Cleaning
WP601-ZH residues are best removed using automated cleaning equipment (in-line) within 48 hours of soldering. De-
ionized water is recommended for the final rinse. Water temperatures should be 49-60°C (120-140°F). Kester’s 5768
Cleaner can also be used in a 1-2% ratio for aqueous cleaning systems.
Storage, Handling and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow
characteristics and overall performance. WP601-ZH should be stabilized at room temperature prior to printing. WP601-ZH
should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Shelf life is 6 months from the date of manufacture
when handled properly when held at 0-10°C (32-50°F). Storage of cartridges should be with the small tip down or on their
sides, never with the large end down. Jars can be stored with the bottom down and stacked. Never freeze solder paste,
this will shorten its shelf life. Please contact Kester Technical Support if you require additional advice regarding storage
and handling of this material.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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