®
Technical Data Sheet
EM808 Solder Paste
Lead-Free Water-Soluble
Product Description
Kester EM808 is a lead free, organic acid, water-soluble solder paste that provides users with the highest level of
consistency and performance. Batch after batch, EM808 provides hours of stable stencil life, tack time and repeatable
brick definition. EM808 robust printing characteristics result in consistent solder paste volume regardless of idle time,
stencil life and print speed. The activator package in the EM808 is very aggressive and provides superior wetting to OSP
coated and Immersion Silver boards.
Performance Characteristics:
■
Outstanding batch-to-batch
consistency
■
Lead-free
■
Water-Soluble
■
Excellent anti-slumping
characteristics minimizing bridging
defects
Standard Applications:
Stencil Printing: 88% Metal
Enclosed Head Printing: 88% Metal
■
Capable of 60 minute idle times in
printing
■
Print speed up to 150 mm/sec (6 in/
sec)
■
Excellent solderability to a wide
variety of metalizations including
Palladium, leaving bright, shiny
joints
■
Residues easily removed with hot
DI water, even up to 48 hours after
soldering
■
Minimal foam in wash systems
■
8+ hour stencil life
■
Compatible with enclosed print head
systems
■
Classified as ORM0 per J-STD-004
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the
stated banned substances.
Physical Properties
Data given for Sn96.5Ag3.0Cu0.5, 88% metal,
-325+500 mesh)
Initial Tackiness (typical):
37 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Solder Ball Test:
Preferred
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Tested to J-STD-005, IPC-TM-650, Method
2.4.45
Viscosity (typical):
1800 poise
Malcom Viscometer @ 10rpm and 25°C
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Chloride and Bromides:
None
Detected
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Surface Insulation Resistivity (SIR),
(typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Blank
Day 1 1.9*10
10
Ω
Day 4 1.1*10
10
Ω
Day 7 8.3*10
10
Ω
EM808
1.4*10
8
Ω
2.0*10
8
Ω
8.3*10
9
Ω
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
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Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
®
Kester EM808 is available in the Sn96.5Ag3.0Cu0.5 alloy with Type 3 powder. Type 3 powder mesh is recommended, but
different powder particle size distributions are available for standard and fine pitch applications. For specific packaging
information see Kester’s Solder Paste Packaging Chart for available sizes. The appropriate combination depends on
process variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80-90 durometer stainless steel or polyurethane
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Reflow Profile
The recommended reflow profile for EM808 made with SAC alloys
is shown here. This profile is simply a guideline. Since EM808 is
a highly active solder paste, it can solder effectively over a wide
range of profiles. Your optimal profile may be different from the
one shown based on you oven, board and mix of defects. Please
contact Kester Technical Support if you need additional profiling
advice.
Cleaning
EM808 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of soldering.
De-ionized water is recommended for the final rinse. Water temperatures should be 49-60°C (120-140°F). Kester’s 5768
Cleaner can also be used in a 1-2% ratio for aqueous cleaning systems.
Storage and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow
characteristics, and overall performance. EM808 should be stabilized at room temperature prior to printing. EM808 should
be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact Kester Technical Support if you require
additional advice with regard to storage and handling of this material. Shelf life is 6 months from date of manufacture and
held at 0-10°C (32-50°F).
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
PCB Design
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