EEWORLDEEWORLDEEWORLD

Part Number

Search

C1210X683J3JAC7800

Description
CAP CER 0.068UF 25V U2J 1210
CategoryPassive components   
File Size1MB,19 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance
Download Datasheet Parametric View All

C1210X683J3JAC7800 Overview

CAP CER 0.068UF 25V U2J 1210

C1210X683J3JAC7800 Parametric

Parameter NameAttribute value
capacitance.068µF
Tolerance±5%
Voltage - Rated25V
Temperature CoefficientU2J
Operating temperature-55°C ~ 125°C
characteristicSoft terminal
grade-
applicationBoardflex sensitive
failure rate-
Installation typeSurface mount, MLCC
Package/casing1210 (3225 metric)
size/dimensions0.130" long x 0.102" wide (3.30mm x 2.60mm)
Height - Installation (maximum)-
Thickness (maximum)0.035"(0.88mm)
lead spacing-
Lead form-
notifyThere is currently market demand for these product types, so lead times will change and extend. Lead times may vary.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric,
10 – 50 VDC (Commercial & Automotive Grade)
Overview
The KEMET Flexible Termination (FT-CAP) Multilayer
Ceramic Capacitor in U2J dielectric incorporates a unique,
flexible termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier layers
of the KEMET standard termination system in order to
establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure mode
of MLCCs — flex cracks, which are typically the result of
excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the
rigid ceramic body, therefore mitigating flex cracks which
can result in low insulation resistance (IR) or short circuit
failures. KEMET automotive grade capacitors meet the
demanding Automotive Electronics Council's AEC-Q200
qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with Flexible
Termination (FF-CAP), and KEMET Power Solutions (KPS)
product lines provide a complete portfolio of flex mitigation
solutions.
Combined with the stability of U2J dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS compliant, offer up to 5 mm of
flex-bend capability and capacitance change limited to –750
±20 ppm/°C from –55°C to +125°C. These devices are lead-
free, RoHS and REACH compliant without exception and are
capable of withstanding multiple passes through a lead-free
solder reflow profile.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1206
X
104
Capacitance
Code (pF)
Two significant
digits +
number of
zeros.
J
3
J
A
C
Termination Finish
C = 100% Matte Sn
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
X = Flexible
Termination
Failure Rate/
Capacitance
Rated Voltage
Dielectric
1
Design
Tolerance
(VDC)
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
J = U2J
A = N/A
1
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1087_U2J_FT-CAP_SMD • 3/13/2018
1
DAQ advanced Counters and Timing
DAQ advanced Counters and Timing...
安_然 Test/Measurement
LIS25BA can record, but there is "interference"
The operating voltage of LIS25BA is 1.8V. With so many development boards available, it is really difficult to find a 1.8V debugging board. Because we need to use TMD communication, the common microco...
littleshrimp MEMS sensors
My schematic shows 6 pins, but the datasheet shows 5 pins. How do I draw this?
I have several components that have an extra PAD pin....
XXXXTTTT PCB Design
I need help with the hardware part of FPGA image processing. The software part has been completed in MATLAB.
[size=5]Save the image as a binary file in bmp format, 24 bits. Each pixel[/size][size=5]is divided into three layers: RGB, and each layer is[/size][size=5]a two-dimensional matrix, such as a 512*512*...
chenjingzl1991 FPGA/CPLD
【TI Wireless Theme Collection】+ WSN Node Design Based on CC2530
[i=s]This post was last edited by Luffy d Dream on 2014-11-27 23:22[/i] This is what I did for my undergraduate graduation project, a WSN node design based on CC2530. [align=left]Wireless Sensor Netwo...
路飞d梦想 Energy Infrastructure?
Improvements of μC/os Ⅲ over μC/OSⅡ
Upload some information to see the improvements of μC/os Ⅲ compared to μC/OSⅡ....
academic Real-time operating system RTOS

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1593  339  2404  1748  1477  33  7  49  36  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号