EEWORLDEEWORLDEEWORLD

Part Number

Search

FW-25-03-G-D-303-065

Description
.050'' BOARD SPACERS
CategoryThe connector   
File Size852KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

FW-25-03-G-D-303-065 Overview

.050'' BOARD SPACERS

FW-25-03-G-D-303-065 Parametric

Parameter NameAttribute value
Number of pins50
spacing0.050"(1.27mm)
Number of rows2
spacing0.050"(1.27mm)
Length - Overall Pin0.368"(9.347mm)
Length - Post (Mating)0.065"(1.651mm)
Length - overlap height0.303"(7.696mm)
Length - solder tail-
Installation typesurface mount
Terminationwelding
Contact Plating - Post (Mating)gold
Contact Plating Thickness - Post (Mating)10.0µin (0.25µm)
colorblack
F-219
FW–20–05–F–D–610–065
FW–12–05–G–D–530–101
(1.27 mm) .050"
FW-SM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
CLP, FLE
Cable Mates:
FFSD
Low-profile or
skyscraper styles
APPLICATIONS
Variable
board spacing
MATED
HEIGHT
FW
CLP
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MATED
CLP HEIGHT*
(8.13)
FW-XX-03-X-X-233-065
.320
–02
(9.91)
FW-XX-03-X-X-303-065
.390
*Processing conditions will affect mated height.
LEAD STYLE
FW
(1.27 mm x 1.27 mm)
.050" x .050" micro pitch
Surface
mount
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
STACKER
HEIGHT
POST
HEIGHT
OPTION
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
02 thru 50
= Gold flash on post,
Matte Tin on tail
–F
–L
–“XXX”
= Stacker
Height
(in inches)
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
–“XXX”
LEAD STACKER
STYLE HEIGHT
–03
–05
STACKER
HEIGHT
(5.46) (8.51) (7.11) (10.16)
.215 to .335
.280 to .400
(8.64) (15.49) (10.29) (17.15)
.340 to .610
.405 to .675
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
Example:
–250
= (6.35 mm)
.250"
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
= Pick & Place Pad
(5 positions min.)
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–ES
02
No. of positions x
(1.27) .050
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
100
–G
–EP
(3.42)
.135
(1.27)
.050
01
(1.19)
.047
(1.27) .050
(0.41) .016 SQ
99
(4.76)
.188
POST HEIGHT
(1.65) .065
MIN
(4.27)
.168
(0.76)
.030
(3.45)
.136
x
(5.08)
.200
(4.06)
.160
–A
–ES
(3.05)
.120
(1.91)
.075
DIA
–P
(0.86)
.034
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–P
STACKER
HEIGHT
(2.51)
.099
(2.92)
.115
–TR
–EP
Due to technical progress, all designs, specifications and components are subject to change without notice.
(0.89)
.035
DIA
–A
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Is anyone familiar with lithium battery protection IC? If I want to verify these parameters, is there a special instrument? It shouldn't be...
Is anyone familiar with lithium battery protection IC? If you want to verify these parameters, are there special instruments? It shouldn't be verified with an oscilloscope, multimeter, or constant tem...
QWE4562009 Test/Measurement
About WINCE compilation problem
During the compiling process of wince, I only saw that many LIB files were generated, such as netui.lib, but how did it generate DLL files from these LIB files in the end? For example, netui.dll....
liplip Embedded System
Semiconductor material bottleneck
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:59[/i]The bottleneck of semiconductor supporting materials needs to be broken through 2006-7-6  The Semiconductor Equipment and Materia...
ehk Mobile and portable
Design of Isolated Word Speech Recognition System Based on DSP
Design of Isolated Word Speech Recognition System Based on DSP...
shaomingyi DSP and ARM Processors
Some questions about PCB boards
Dear experts, please don't miss it if you pass by. I just finished drawing the PCB board. I hope you can give me some suggestions. If there are any shortcomings, you are welcome to criticize and corre...
肝胆香皂 PCB Design
Proteus simulation C51 MCU program ---- LCD display cannot be updated
Dear experts, I have written a C51 program, using the AT89C52 chip, to collect the resistor voltage, and display the result on LCD through ADC conversion. Now the problem is: when the voltage at the d...
zimiaoxinghan 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2113  2100  735  1029  1650  43  15  21  34  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号