BU52077GWZ-E2 datasheet, PDF - EEWORLD Datasheet

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BU52077GWZ-E2: DescriptionOMNIPOLAR DETECTION HALL IC; CategoryThe sensor Sensor/transducer; File Size1MB，19 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BU52077GWZ-E2 Overview

OMNIPOLAR DETECTION HALL IC

BU52077GWZ-E2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
package instruction	UCSP-4
Reach Compliance Code	compliant
Factory Lead Time	13 weeks
Samacsys Description	Board Mount Hall Effect / Magnetic Sensors Omnipolar Detection Hall IC Dual Outputs
body width	0.8 mm
body height	0.4 mm
Body length or diameter	0.8 mm
lag	0.9 mT
Maximum magnetic field range	19 mT
Minimum magnetic field range	10.1 mT
Installation features	SURFACE MOUNT
Maximum working current	0.008 mA
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output range	1.60-0.20V
Output type	DIGITAL VOLTAGE
Package Shape/Form	SQUARE
Sensor/Transducer Type	MAGNETIC FIELD SENSOR,HALL EFFECT
Maximum supply voltage	3.6 V
Minimum supply voltage	1.65 V
surface mount	YES
Termination type	SOLDER
Base Number Matches	1

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Datasheet

Omnipolar Detection Hall IC

(Dual Outputs for both S and N Pole Polarity Detection)

BU52077GWZ

General Description

The BU52077GWZ is omnipolar Hall IC incorporating a

polarity determination circuit that enables separate

operation (output) of both the South and North poles.

The polarity judgment is based on the output processing

configuration.

This Hall IC product can be in tablets, smart phones, and

other applications in order to detect open and close of

the cover.

And this Hall IC product can be in digital video cameras

and other applications involving display panels in order

to detect the front/back location or determine the

rotational direction of the panel.

Key Specifications



VDD Voltage Range:

Operate Point:

Hysteresis:

Period:

Supply Current (AVG):

Output Type:

Operating Temperature Range:

1.65V to 3.6V

±15.0mT(Typ)

0.9mT(Typ)

50ms(Typ)

5.0µA (Typ)

CMOS

-40°C to +85°C

Package

UCSP35L1

W(Typ) x D(Typ) x H(Max)

0.80mm x 0.80mm x 0.40mm

Features



Omnipolar Detection (Polarity Detection for both S

and N Poles with Separate, Dual Outputs)

Micro Power Operation (Small Current Using

Intermittent Operation Method)

Ultra-compact CSP4 Package (UCSP35L1)

Polarity Judgment and Separate Output on both

Poles

(OUT1=S-pole Output; OUT2=N-pole Output)

High ESD Resistance 8kV(HBM)

Tablets, Smart Phones, Notebook Computers,

Digital Video Cameras, Digital Still Cameras, etc.

Applications

Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions

VDD

0.1µF

Adjust the bypass capacitor value

as necessary, according to voltage

noise conditions, etc.

TIMING

LOGIC

HALL

SAMPLE

& HOLD

ELEMENT

DYNAMIC

OFFSET

CANCELLATION

LATCH

OUT1

GND

VDD

LATCH

The CMOS output terminals

enable direct connection to

the PC, with no external

pull-up resistor required.

OUT2

GND

Pin No.

Pin Name

GND

OUT2

VDD

OUT1

Ground

Function

(TOP VIEW)

(BOTTOM VIEW)

Output (React to the north pole)

Power supply

Output (React to the south pole)

〇This

product has no designed protection against radioactive rays

〇Product

structure : Silicon monolithic integrated circuit

www.rohm.com

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11.Aug.2014 Rev.001

BU52077GWZ

Contents

General Description ....................................................................................................................................................1

Features .......................................................................................................................................................................1

Applications ................................................................................................................................................................1

Key Specifications ......................................................................................................................................................1

Package

W(Typ) x D(Typ) x H(Max) ........................................................................................................................1

Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions ......................................1

Absolute Maximum Ratings (Ta = 25°C) ...................................................................................................................3

Recommended Operating Conditions (Ta= -40°C to +85°C) ...................................................................................3

Magnetic, Electrical Characteristics (Unless otherwise specified V

=1.80V Ta=25°C)......................................3

Measurement Circuit ..................................................................................................................................................4

Typical Performance Curves .....................................................................................................................................5

Figure 6. Operate Point, Release Point vs Ambient Temperature ......................................................................5

Figure 7. Operate Point, Release Point vs Supply Voltage .................................................................................5

Figure 8. Period vs Ambient Temperature ............................................................................................................5

Figure 9. Period vs Supply Voltage .......................................................................................................................5

Figure 10. Supply Current vs Ambient Temperature ...........................................................................................6

Figure 11. Supply Current vs Supply Voltage.......................................................................................................6

Description of Operations ..........................................................................................................................................7

Intermittent Operation at Power ON .......................................................................................................................10

Magnet Selection ......................................................................................................................................................10

Slide-by Position Sensing ........................................................................................................................................ 11

Position of the Hall Element (Reference) ............................................................................................................... 11

Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) .......... 11

I/O Equivalence Circuit ............................................................................................................................................. 11

Operational Notes .....................................................................................................................................................12

Ordering Information ................................................................................................................................................14

Marking Diagrams .....................................................................................................................................................14

Physical Dimension, Tape and Reel Information ...................................................................................................15

Revision History .......................................................................................................................................................16

www.rohm.com

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Computer motherboard circuit diagram 820 1_44

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