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HLMP-CB25-SV000

Description
LED BLUE CLEAR T-1 3/4 T/H
CategoryLED optoelectronic/LED    photoelectric   
File Size602KB,10 Pages
ManufacturerBroadcom
Environmental Compliance
Download Datasheet Parametric View All

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HLMP-CB25-SV000 Overview

LED BLUE CLEAR T-1 3/4 T/H

HLMP-CB25-SV000 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerBroadcom
package instructionROHS COMPLIANT, PLASTIC PACKAGE-2
Reach Compliance Codecompliant
ECCN codeEAR99
colorBLUE
ConfigurationSINGLE
Maximum forward current0.03 A
JESD-609 codee3
Lens typeUNTINTED NONDIFFUSED
Nominal luminous intensity3700.0 mcd
Installation featuresRADIAL MOUNT
Number of functions1
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Optoelectronic device typesSINGLE COLOR LED
total height8.71 mm
method of packingBULK
peak wavelength464 nm
shapeROUND
size5 mm
surface mountNO
T codeT-1 3/4
Terminal surfaceMatte Tin (Sn)
Terminal pitch2.54 mm
perspective23 deg
HLMP-CBxx, HLMP-CMxx
Precision Optical Performance Blue and Green
Data Sheet
Description
This high intensity blue and green LEDs are based on the
most efficient and cost effective InGaN material tech-
nology. This LED lamps is untinted and non-diffused, T-
1 ¾ packages incorporating second-generation optics
producing well defined spatial radiation patterns at
specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture re-
sistance in outdoor signal and sign applications. The
package epoxy contains both UV-A and UV-B inhibitors
to reduce the effects of long term exposure to direct
sunlight.
Features
Well defined spatial radiation pattern
High luminous output
Untinted, Non-diffused
Viewing angle: 15º, 23º and 30º
Standoff or non-standoff leads
Superior resistance to moisture
Applications
Traffic signals
Commercial outdoor advertising
Front panel backlighting
Front panel indicator
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
31.60
(1.244) MIN.
CATHODE
LEAD
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
31.60
(1.244) MIN.
CATHODE
LEAD
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
1.00 MIN.
(0.039)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
FLAT
PACKAGE DIMENSION A
Notes:
1. Measured just above flange.
2. All dimensions are in millimeters (inches).
3. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
PACKAGE DIMENSION B
HLMP-Cx14
HLMP-Cx25
HLMP-Cx35
d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25
(0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010)
Caution:
InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN 1142 for details.
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