Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering, 10s)................................+300°C
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
I am studying electronic information engineering. I would like to ask you seniors for advice. If I go out to work, what subjects do I need to master in terms of social needs? I hope you can give me so...
[i=s]This post was last edited by chenzhufly on 2014-9-30 17:26[/i] The board was designed by a friend, so I contributed it, but he had some problems debugging it. You can also help check the PCB diag...
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