TE0630 Spartan-6 FPGA Industrial Micromodule
User Manual
UM-TE0630 (v 0.21) 3 July 2013
Trenz Electronic GmbH
Features
●
High-density plug-in
Xilinx Spartan-6
module
●
USB 2.0 interface
with high-speed
(480 Mbit/s) data rate
●
Large
SPI Flash
for configuration and user
data, accessible via FPGA, JTAG and USB
interfaces
●
Large
DDR3 SDRAM
●
FPGA configuration via
SPI, JTAG or USB
●
3 high-efficiency on-board switch-mode
DC-DC converters
●
Power supply from B2B connector (carrier
board) or USB connector
●
Flexible expansion via high-density
shockproof B2B
connectors
●
Most user I/Os on B2B connectors routed
as
LVDS pairs
●
Evenly spread supply pins for good signal
integrity
●
Industrial temperature grade
available
upon request
●
Low-cost, versatile and ruggedized
design
●
Small size
Specifications
●
FPGA
- XC6SLX45/75/100/150-
2CSG484C(I)
●
USB-controller:
CY7C68013A-56LTXC(I)
●
Non-volatile memory:
64 Mbit SPI Flash
for configuration and user data
●
Volatile memory:
1 Gb x 16 DDR3
SDRAM
●
Up to
110 FPGA user I/O
●
Supply voltage range: 4.0 V - 5.5 V
●
1 user push-button
●
4 user LEDs
●
2 user DIP switches
●
Dimensions:
40.5 mm x 47.5 mm
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TE0630 Spartan-6 FPGA
Industrial Micromodule
UM-TE0630 (v 0.21) 3 July 2013
Table of Contents
1 Technical Specifications...............................................................................................................4
1.1 Module options.....................................................................................................................4
1.2 Dimensions...........................................................................................................................4
2 Detailed Description.....................................................................................................................5
2.1 Block Diagram......................................................................................................................5
2.2 Power Supply.......................................................................................................................5
2.2.1 Supply from B2B Connector.........................................................................................5
2.2.2 Supply from USB Connector.........................................................................................5
2.2.3 On-board Power Rails...................................................................................................6
2.2.4 Power-on Reset............................................................................................................7
2.3 FPGA User I/Os....................................................................................................................8
2.4 Board-to-board Connectors..................................................................................................9
2.5 USB Connector..................................................................................................................10
2.6 JTAG connector..................................................................................................................11
2.7 Serial EEPROM..................................................................................................................11
2.8 SPI Flash............................................................................................................................11
2.9 DDR3 SDRAM....................................................................................................................12
2.10 USB Controller.................................................................................................................12
2.11 Clock Oscillators...............................................................................................................13
2.12 LEDs.................................................................................................................................13
2.13 Push-Button......................................................................................................................14
2.14 DIP Switch........................................................................................................................14
2.15 Board revisions and assembly variants...........................................................................14
3 TE0300 compatibility.................................................................................................................15
3.1 Mechanical compatibility....................................................................................................15
3.2 Electrical compatibility........................................................................................................15
4 Module Configuration................................................................................................................17
4.1 JTAG FPGA Configuration.................................................................................................17
4.2 SPI FPGA Configuration.....................................................................................................18
4.3 eFUSE programming..........................................................................................................18
4.4 EZ-USB FX2 Firmware Programming................................................................................18
4.5 EZ-USB FX2 EEPROM Programming...............................................................................19
5 USB Drivers Installation.............................................................................................................21
5.1 Generic Driver....................................................................................................................21
5.2 Dedicated Driver.................................................................................................................24
6 B2B Connectors Pin Descriptions.............................................................................................26
6.1 Pin Labelling.......................................................................................................................27
6.2 Pin Types............................................................................................................................27
6.3 J4 Pin-out...........................................................................................................................28
6.4 J5 Pin-out...........................................................................................................................29
6.5 Signal Integrity Considerations..........................................................................................30
7 Related Materials and References............................................................................................30
7.1 Data Sheets........................................................................................................................30
7.2 User Guides........................................................................................................................30
8 Glossary of Abbreviations and Acronyms..................................................................................30
9 Legal Notices.............................................................................................................................31
9.1 Document Warranty............................................................................................................31
9.2 Limitation of Liability...........................................................................................................31
9.3 Copyright Notice.................................................................................................................31
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TE0630 Spartan-6 FPGA Industrial Micromodule
UM-TE0630 (v 0.21) 3 July 2013
9.4 Technology Licenses..........................................................................................................32
10 Environmental Protection........................................................................................................33
10.1 REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals)
Compliance Statement.............................................................................................................33
10.2 RoHS (Restriction of Hazardous Substances) compliance statement............................33
10.3 WEEE (Waste Electrical and Electronic Equipment).......................................................33
Appendix A. Indirect SPI Programming using iMPACT...............................................................35
Document Change History..........................................................................................................39
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TE0630 Spartan-6 FPGA Industrial Micromodule
1 Technical Specifications
UM-TE0630 (v 0.21) 3 July 2013
1 Technical Specifications
1.1 Module options
FPGA options
Module can be ordered with Spartan-6 XC6SLX45, XC6SLX75, XC6SLX100,
XC6SLX150 chip
1
.
Temperature grade options
Module can be ordered in commercial or in extended (from -25 C° to +85 C°)
temperature grade.
1.2 Dimensions
Figure 1 shows main module dimensions from top view.
Figure 1: Module dimensions in mm
Mounting hole diameter is 3.2 mm.
1 Contact Trenz Electronic support for availability
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TE0630 Spartan-6 FPGA Industrial Micromodule
2 Detailed Description
UM-TE0630 (v 0.21) 3 July 2013
2 Detailed Description
2.1 Block Diagram
Figure 2: TE0630 block diagram
2.2 Power Supply
The module can be powered by B2B connector J5 or the USB connector. If both
power supplies are available, the B2B connector power supply takes
precedence, disabling the USB power supply automatically.
2.2.1 Supply from B2B Connector
The B2B connector power supply requires a single nominal 5 V DC power
supply. The power is usually supplied to the module through the 5 V contacts
(5Vb2b) of B2B connector J5 (see chapter 6.4 J5 Pin-out). The recommended
minimum supply voltage is 4 V. The maximum supply voltage is 5.5 V. The
recommended maximum continuous supply current is 1.5 A.
2.2.2 Supply from USB Connector
The module is powered by the USB connector if the following conditions are
met:
●
the module is equipped with an USB connector,
●
the module is connected to a USB bus,
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TE0630 Spartan-6 FPGA Industrial Micromodule
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