To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website:
http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to
http://www.renesas.com/inquiry.
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
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“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
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“Standard”:
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
R8C/26 Group, R8C/27 Group
SINGLE-CHIP 16-BIT CMOS MCU
REJ03B0168-0210
Rev.2.10
Sep 26, 2008
1.
Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and
are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction
efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash.
Their peripheral functions are the same.
1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 1 of 69
R8C/26 Group, R8C/27 Group
1. Overview
1.2
Performance Overview
Table 1.1 outlines the Functions and Specifications for R8C/26 Group and Table 1.2 outlines the Functions and
Specifications for R8C/27 Group.
Table 1.1
CPU
Functions and Specifications for R8C/26 Group
Item
Number of
fundamental
instructions
Minimum instruction
execution time
Specification
89 instructions
50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)
62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)
100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)
Single-chip
1 Mbyte
Refer to
Table 1.3 Product Information for R8C/26 Group
I/O ports: 25 pins, Input port: 3 pins
I/O ports: 8 pins (N, D version)
Timer RA: 8 bits × 1 channel
Timer RB: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer RC: 16 bits × 1 channel
(Input capture and output compare circuits)
Timer RE: With real-time clock and compare match function
(For J, K version, compare match function only.)
2 channels (UART0, UART1)
Clock synchronous serial I/O, UART
1 channel
I
2
C bus Interface
(1)
Clock synchronous serial I/O with chip select
Hardware LIN: 1 channel (timer RA, UART0)
10-bit A/D converter: 1 circuit, 12 channels
15 bits × 1 channel (with prescaler)
Start-on-reset selectable
Internal: 15 sources, External: 4 sources,
Software: 4 sources, Priority levels: 7 levels
3 circuits
• XIN clock generation circuit (with on-chip feedback resistor)
• On-chip oscillator (high speed, low speed)
High-speed on-chip oscillator has a frequency adjustment function
• XCIN clock generation circuit (32 kHz) (N, D version)
• Real-time clock (timer RE) (N, D version)
XIN clock oscillation stop detection function
On-chip
On-chip
VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)
VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)
VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)
VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)
Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 2.0
µA
(VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)
Typ. 0.7
µA
(VCC = 3.0 V, stop mode)
VCC = 2.7 to 5.5 V
100 times
-20 to 85°C (N version)
-40 to 85°C (D, J version)
(2)
, -40 to 125°C (K version)
(2)
32-pin molded-plastic LQFP
Peripheral
Functions
Operating mode
Address space
Memory capacity
Ports
LED drive ports
Timers
Serial interfaces
Clock synchronous
serial interface
LIN module
A/D converter
Watchdog timer
Interrupts
Clock generation
circuits
Electrical
Characteristics
Oscillation-stopped
detector
Voltage detection
circuit
Power-on reset circuit
Supply voltage
Current consumption
(N, D version)
Flash Memory
Programming and
erasure voltage
Programming and
erasure endurance
Operating Ambient Temperature
Package
NOTES:
1. I
2
C bus is a trademark of Koninklijke Philips Electronics N. V.
2. Specify the D, K version if D, K version functions are to be used.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 2 of 69
R8C/26 Group, R8C/27 Group
1. Overview
Table 1.2
Functions and Specifications for R8C/27 Group
Item
Specification
CPU
Number of fundamental 89 instructions
instructions
Minimum instruction
50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)
execution time
62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)
100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)
Operating mode
Single-chip
Address space
1 Mbyte
Memory capacity
Refer to
Table 1.4 Product Information of R8C/27 Group
Peripheral
Ports
I/O ports: 25 pins, Input port: 3 pins
Functions
LED drive ports
I/O ports: 8 pins (N, D version)
Timers
Timer RA: 8 bits × 1 channel
Timer RB: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer RC: 16 bits × 1 channel
(Input capture and output compare circuits)
Timer RE: With real-time clock and compare match function
(For J, K version, compare match function only.)
Serial interfaces
2 channels (UART0, UART1)
Clock synchronous serial I/O, UART
Clock synchronous
1 channel
serial interface
I
2
C bus Interface
(1)
Clock synchronous serial I/O with chip select
LIN module
Hardware LIN: 1 channel (timer RA, UART0)
A/D converter
10-bit A/D converter: 1 circuit, 12 channels
Watchdog timer
15 bits × 1 channel (with prescaler)
Start-on-reset selectable
Interrupts
Internal: 15 sources, External: 4 sources,
Software: 4 sources, Priority levels: 7 levels
Clock generation
3 circuits
circuits
• XIN clock generation circuit (with on-chip feedback resistor)
• On-chip oscillator (high speed, low speed)
High-speed on-chip oscillator has a frequency adjustment function
• XCIN clock generation circuit (32 kHz) (N, D version)
• Real-time clock (timer RE) (N, D version)
Oscillation-stopped
XIN clock oscillation stop detection function
detector
Voltage detection circuit On-chip
Power-on reset circuit
On-chip
Electrical
Supply voltage
VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)
Characteristics
VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)
VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)
VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)
Current consumption
Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
(N, D version)
Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 2.0
µA
(VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)
Typ. 0.7
µA
(VCC = 3.0 V, stop mode)
Flash Memory
Programming and
VCC = 2.7 to 5.5 V
erasure voltage
Programming and
10,000 times (data flash)
erasure endurance
1,000 times (program ROM)
Operating Ambient Temperature
-20 to 85°C (N version)
-40 to 85°C (D, J version)
(2)
, -40 to 125°C (K version)
(2)
Package
32-pin molded-plastic LQFP
NOTES:
1. I
2
C bus is a trademark of Koninklijke Philips Electronics N. V.
2. Specify the D, K version if D, K version functions are to be used.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 3 of 69
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