A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
I am new to the community and hope you can help me. The question is: I am using VHDL to design a digital frequency counter. How should the counter count at each bin? Please give me some advice. If you...
[i=s]This post was last edited by sszztt on 2017-1-12 09:41[/i] [backcolor=white][font=Tahoma, Helvetica, SimSun, sans-serif][size=12px][color=#000000]I have revealed all my secrets[/color][/size][/fo...
"Unable to start program.... There is no process on the other end of the pipe" The deployment has been successful. I see that there is already an exe in the emulator. Console log: INFO: WAVEDEV.DLL: S...
The TMS320C62x series DSP provides three booting methods: (1) No boot process: the CPU starts executing code directly from address 0; (2) ROM boot: the DMA/EDMA controller copies a fixed number of cod...
Q&A on the manufacturing process of power inverters 1. What is the difference between the continuous output power and peak output power of power inverters? Continuous power and peak power differ in th...
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:57[/i][font=宋体][size=14pt]Beijing Huifeng Tengda Technology Development Co., Ltd.[/size][/font][font=Times New Roman] [color=black][fon...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
The term "remote meter reading" literally emphasizes remoteness. But how far is remote? One kilometer? Two kilometers? Those aren't considered far at all. Currently, the longest distance for ...[Details]
Yongxin Technology's BCL603S2H chipset integrates the nRF54L15 system-on-chip for monitoring various sensors and achieving seamless wireless connectivity.
Oslo, Norway – August 19, 2...[Details]
Bosch, an "old money" company, is radical in its investment in new technologies.
Bosch announced at this year's Technology Day that it will invest more than 2.5 billion euros (about 21.1...[Details]
Recently, Freya Hella officially announced a major breakthrough in the field of wire-controlled steering: following the successful launch of mass production projects for two high-end Chinese and Ge...[Details]
Modern automotive electronics have entered a new phase of fundamental change and advancement, evolving from the application of electronic components to in-vehicle electronic systems. Sensors are on...[Details]
Photovoltaic water pump inverter, photovoltaic water pump control system and control method
This application provides a photovoltaic water pump inverter, a photovoltaic water pump control sys...[Details]
NVIDIA is ushering in a new chapter for the field with its new Omniverse library, Cosmos physics model, and AI computing infrastructure.
The new NVIDIA Omniverse NuRec 3D Gaussian Splattin...[Details]