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74LVT32374EC,557

Description
IC FF D-TYPE QUAD 8BIT 96LFBGA
Categorylogic    logic   
File Size96KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

74LVT32374EC,557 Overview

IC FF D-TYPE QUAD 8BIT 96LFBGA

74LVT32374EC,557 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionLFBGA, BGA96,6X16,32
Contacts96
Manufacturer packaging codeSOT536-1
Reach Compliance Codenot_compliant
seriesLVT
JESD-30 codeR-PBGA-B96
JESD-609 codee0
length13.5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
Maximum Frequency@Nom-Sup150000000 Hz
MaximumI(ol)0.064 A
Humidity sensitivity level4
Number of digits8
Number of functions4
Number of ports2
Number of terminals96
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA96,6X16,32
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Prop。Delay @ Nom-Sup5.3 ns
propagation delay (tpd)6.2 ns
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
Trigger typePOSITIVE EDGE
width5.5 mm
Base Number Matches1
INTEGRATED CIRCUITS
DATA SHEET
74LVT32374
3.3 V 32-bit edge-triggered D-type
flip-flop; 3-state
Product specification
Supersedes data of 2002 Mar 20
2004 Oct 15

74LVT32374EC,557 Related Products

74LVT32374EC,557 74LVT32374EC-T 74LVT32374EC,518 74LVT32374EC/G,557 74LVT32374EC/G,518 935281136557
Description IC FF D-TYPE QUAD 8BIT 96LFBGA Trigger 3.3V 32-bit D-type 3-S IC FF D-TYPE QUAD 8BIT 96LFBGA IC FF D-TYPE QUAD 8BIT 96LFBGA IC FF D-TYPE QUAD 8BIT 96LFBGA LVT SERIES, QUAD 8-BIT DRIVER, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96
package instruction LFBGA, BGA96,6X16,32 LFBGA, LFBGA, LFBGA, LFBGA, LFBGA,
Reach Compliance Code not_compliant unknow unknown unknown unknown unknown
series LVT LVT LVT LVT LVT LVT
JESD-30 code R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
length 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 8 8 8 8 8 8
Number of functions 4 4 4 4 4 4
Number of ports 2 2 2 2 2 2
Number of terminals 96 96 96 96 96 96
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
propagation delay (tpd) 6.2 ns 6.2 ns 6.2 ns 6.2 ns 6.2 ns 6.2 ns
Maximum seat height 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm
Brand Name NXP Semiconductor - NXP Semiconductor NXP Semiconductor NXP Semiconductor -
Is it Rohs certified? incompatible - incompatible conform to conform to -
Parts packaging code BGA BGA BGA BGA BGA -
Contacts 96 96 96 96 96 -
Manufacturer packaging code SOT536-1 SOT-536-1 SOT536-1 SOT536-1 SOT536-1 -
Humidity sensitivity level 4 - 4 2 2 -
Peak Reflow Temperature (Celsius) 240 - 240 260 260 -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum time at peak reflow temperature 20 - 20 30 30 -
Maker - NXP - NXP NXP NXP
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