Multi-function Serial Interface (Max eight channels)
4 channels with 16 steps×9-bit FIFO (ch.4-ch.7), 4 channels
without FIFO (ch.0-ch.3)
channel.
UART
CSIO
LIN
I
2
C
NMI (non-maskable interrupt) and 48 peripheral interrupts
and 16 priority levels
management
24-bit System timer (Sys Tick): System timer for OS task
Operation mode is selectable from the followings for each
On-chip Memories
[Flash memory]
These series are based on two independent on-chip Flash
memories.
Up
to 512 Kbyte
Built-in Flash Accelerator System with 16 Kbyte trace buffer
memory
The read access to Flash memory can be achieved without
wait cycle up to operation frequency of 72 MHz. Even at the
operation frequency more than 72 MHz, an equivalent
access to Flash memory can be obtained by Flash
Accelerator System.
Security function for code protection
Kbyte
cycle
4 wait-cycle: the operation frequency more than 72 MHz
2 wait-cycle: the operation frequency more than 40 MHz, and
to 72 MHz
0wait-cycle: the operation frequency to 40 MHz
Security function is shared with code protection
Read
MainFlash
UART
Full-duplex
double buffer
Selection with or without parity supported
Built-in dedicated baud rate generator
External clock available as a serial clock
Hardware Flow control: Automatically control the
transmission by CTS/RTS (only ch.4)
Various error detect functions available (parity errors,
framing errors, and overrun errors)
CSIO
double buffer
Built-in dedicated baud rate generator
Overrun error detect function available
Full-duplex
WorkFlash
32
LIN
LIN
[SRAM]
This Series contain a total of up to 64 Kbyte on-chip SRAM.
This is composed of two independent SRAM (SRAM0,
SRAM1). SRAM0 is connected to I-code bus and D-code bus
of Cortex-M3 core. SRAM1 is connected to System bus.
SRAM0: Up to 32 Kbyte
SRAM1: Up to 32 Kbyte
protocol Rev.2.1 supported
Full-duplex double buffer
Master/Slave mode supported
LIN break field generate (can be changed 13 to 16-bit
length)
LIN break delimiter generate (can be changed 1 to 4-bit
length)
Various error detect functions available (parity errors,
framing errors, and overrun errors)
I
2
C
Standard-mode
supported
(Max 100 kbps) / Fast-mode (Max 400 kbps)
Cypress Semiconductor Corporation
Document Number: 002-05622 Rev. *D
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised
February
9,
2018
MB9B110R Series
DMA Controller (Eight channels)
DMA Controller has an independent bus for CPU, so CPU
and DMA Controller can process simultaneously.
Multi-function Timer (Max three units)
The Multi-function timer is composed of the following blocks.
16-bit free-run timer × 3 ch./unit
Input capture × 4 ch./unit
Output compare × 6 ch./unit
A/D activating compare × 3 ch./unit
Waveform generator × 3 ch./unit
16-bit PPG timer × 3 ch./unit
The following function can be used to achieve the motor
control.
8 independently configured and operated channels
Transfer can be started by software or request from the
built-in peripherals
Transfer address area: 32 bit (4 Gbyte)
Transfer mode: Block transfer/Burst transfer/Demand
transfer
Transfer data type: byte/half-word/word
Transfer block count: 1 to 16
Number of transfers: 1 to 65536
A/D Converter (Max 16 channels)
12-bit A/D Converter
Successive Approximation
Built-in
PWM signal output function
DC chopper waveform output function
Dead time function
Input capture function
A/D convertor activate function
DTIF (Motor emergency stop) interrupt function
Real-time clock (RTC)
The Real-time clock can count
Year/Month/Day/Hour/Minute/Second/A day of the week from
00 to 99.
Register type
3 unit
Conversion time: 1.0 μs @ 5 V
Priority conversion available (priority at 2 levels)
Scanning conversion mode
Built-in FIFO for conversion data storage (for SCAN
conversion: 16 steps, for Priority conversion: 4 steps)
Base Timer (Max eight channels)
Operation mode is selectable from the followings for each
channel.
Interrupt function with specifying date and time
16-bit PWM timer
16-bit PPG timer
16-/32-bit reload timer
16-/32-bit PWC timer
General Purpose I/O Port
This series can use its pins as general purpose I/O ports
when they are not used for external bus or peripherals.
Moreover, the port relocate function is built in. It can set
which I/O port the peripheral function can be allocated.
(Year/Month/Day/Hour/Minute) is available. This function is
also available by specifying only Year, Month, Day, Hour or
Minute.
Timer interrupt function after set time or each set time.
Capable of rewriting the time with continuing the time count.
Leap year automatic count is available.
Quadrature Position/Revolution Counter (QPRC)
(Max three channels)
The Quadrature Position/Revolution Counter (QPRC) is used
to measure the position of the position encoder. Moreover, it
is possible to use up/down counter.
Capable of pull-up control per pin
Capable of reading pin level directly
Built-in the port relocate function
Up 103 fast general purpose I/O Ports@120 pin Package
Some pin is 5 V tolerant I/O.
See4. List of Pin Functions to confirm the corresponding
pins.
The detection edge of the three external event input pins AIN,
BIN and ZIN is configurable.
16-bit position counter
16-bit revolution counter
Two 16-bit compare registers
Document Number: 002-05622 Rev. *D
Page 2 of 117
MB9B110R Series
Dual Timer (32-/16-bit Down Counter)
The Dual Timer consists of two programmable 32-/16-bit
down counters.
Operation mode is selectable from the followings for each
channel.
Resets
requests from INITX pin
on reset
Software reset
Watchdog timers reset
Low-voltage detector reset
Clock supervisor reset
Power
Reset
Free-running
Periodic (=Reload)
One-shot
Watch Counter
The Watch counter is used for wake up from power
consumption mode.
Clock Super Visor (CSV)
Clocks generated by internal CR oscillators are used to
supervise abnormality of the external clocks.
External OSC clock failure (clock stop) is detected, reset is
asserted.
Interval timer: up to 64 s (Max) @ Sub Clock: 32.768 kHz
External Interrupt Controller Unit
Up to 16 external interrupt input pin
Include one non-maskable interrupt (NMI)
Watchdog Timer (Two channels)
A watchdog timer can generate interrupts or a reset when a
time-out value is reached.
This series consists of two different watchdogs, a "Hardware"
watchdog and a "Software" watchdog.
"Hardware" watchdog timer is clocked by low-speed internal
CR oscillator. Therefore, "Hardware" watchdog is active in
any power consumption mode except Stop mode.
External OSC frequency anomaly is detected, interrupt or
reset is asserted.
Low-Voltage Detector (LVD)
This Series include 2-stage monitoring of voltage on the VCC
pins. When the voltage falls below the voltage has been set,
Low-Voltage Detector generates an interrupt or reset.
LVD1: error reporting via interrupt
LVD2: auto-reset operation
Low-Power Consumption Mode
Three power consumption modes supported.
Sleep
Timer
Stop
Debug
Serial Wire JTAG Debug Port (SWJ-DP)
Embedded Trace Macrocells (ETM) provide comprehensive
debug and trace facilities.
CRC (Cyclic Redundancy Check) Accelerator
The CRC accelerator helps a verify data transmission or
storage integrity.
CCITT CRC16 and IEEE-802.3 CRC32 are supported.
CCITT CRC16 Generator Polynomial: 0x1021
IEEE-802.3 CRC32 Generator Polynomial: 0x04C11DB7
Clock and Reset
Clocks
Five clock sources (2 external oscillators, 2 internal CR
oscillator, and Main PLL) that are dynamically selectable.
Main
Power Supply
Wide range voltage:
VCC
= 2.7 V to 5.5 V
Clock:
Sub Clock:
High-speed internal CR Clock:
Low-speed internal CR Clock:
Main PLL Clock
4 MHz to 48 MHz
32.768 kHz
4 MHz
100 kHz
Document Number: 002-05622 Rev. *D
Page 3 of 117
MB9B110R Series
Table of Contents
Features .............................................................................................................................................................................. 1
List of Pin Functions ................................................................................................................................................. 13
5.
I/O Circuit Type .......................................................................................................................................................... 44
Precautions for Product Design ................................................................................................................................ 49
6.2
Precautions for Package Mounting ........................................................................................................................... 50
6.3
Precautions for Use Environment ............................................................................................................................. 52
Pin Status in Each CPU State ................................................................................................................................... 60
Absolute Maximum Ratings ...................................................................................................................................... 65
DC Characteristics .................................................................................................................................................... 68
12.3.1
Current Rating ....................................................................................................................................................... 68
AC Characteristics .................................................................................................................................................... 72
12.4.1
Main Clock Input Characteristics ........................................................................................................................... 72
12.4.2
Sub Clock Input Characteristics ............................................................................................................................. 73
External Bus Timing ............................................................................................................................................... 76
12.4.9
Base Timer Input Timing ........................................................................................................................................ 85
C Timing .............................................................................................................................................................. 97
Write / Erase time ................................................................................................................................................ 104
12.7.2
Erase/write cycles and data hold time.................................................................................................................. 104
Write / Erase time ................................................................................................................................................ 104
12.8.2
Erase/write cycles and data hold time.................................................................................................................. 104
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