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XC18V512PC20I

Description
IC PROM SER I-TEMP 3.3V 20-PLCC
Categorystorage    storage   
File Size204KB,21 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
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XC18V512PC20I Overview

IC PROM SER I-TEMP 3.3V 20-PLCC

XC18V512PC20I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXILINX
Parts packaging codeQLCC
package instructionPLASTIC, LCC-20
Contacts20
Reach Compliance Codenot_compliant
ECCN code3A991.B.1.B.2
Maximum access time15 ns
Maximum clock frequency (fCLK)33 MHz
Data retention time - minimum10
Durability10000 Write/Erase Cycles
JESD-30 codeS-PQCC-J20
JESD-609 codee0
length8.9662 mm
memory density524288 bit
Memory IC TypeCONFIGURATION MEMORY
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals20
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC20,.4SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL/SERIAL
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum standby current0.01 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
typeNOR TYPE
width8.9662 mm
0
R
XC18V00 Series In-System
Programmable Configuration
PROMs
0
DS026 (v4.1) December 15, 2003
0
Product Specification
Features
In-system programmable 3.3V PROMs for
configuration of Xilinx FPGAs
- Endurance of 20,000 program/erase cycles
Program/erase over full commercial/industrial
voltage and temperature range (–40°C to +85°C)
IEEE Std 1149.1 boundary-scan (JTAG) support
Simple interface to the FPGA
Cascadable for storing longer or multiple bitstreams
Low-power advanced CMOS FLASH process
-
Dual configuration modes
-
Serial Slow/Fast configuration (up to 33 MHz)
- Parallel (up to 264 Mb/s at 33 MHz)
5V tolerant I/O pins accept 5V, 3.3V and 2.5V signals
3.3V or 2.5V output capability
Available in PC20, SO20, PC44, and VQ44 packages
Design support using the Xilinx Alliance and
Foundation series software packages.
JTAG command initiation of standard FPGA
configuration
Description
Xilinx introduces the XC18V00 series of in-system program-
mable configuration PROMs (Figure
1).
Devices in this 3.3V
family include a 4-megabit, a 2-megabit, a 1-megabit, and a
512-kilobit PROM that provide an easy-to-use, cost-effec-
tive method for re-programming and storing Xilinx FPGA
configuration bitstreams.
When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. A short access
time after CE and OE are enabled, data is available on the
PROM DATA (D0) pin that is connected to the FPGA D
IN
pin. New data is available a short access time after each ris-
ing clock edge. The FPGA generates the appropriate num-
ber of clock pulses to complete the configuration. When the
FPGA is in Slave Serial mode, the PROM and the FPGA
are clocked by an external clock.
CLK CE
When the FPGA is in Master-SelectMAP mode, the FPGA
generates a configuration clock that drives the PROM.
When the FPGA is in Slave-Parallel or Slave-SelectMAP
Mode, an external oscillator generates the configuration
clock that drives the PROM and the FPGA. After CE and
OE are enabled, data is available on the PROMs DATA
(D0-D7) pins. New data is available a short access time
after each rising clock edge. The data is clocked into the
FPGA on the following rising edge of the CCLK. A free-run-
ning oscillator can be used in the Slave-Parallel or
Slave-SelecMAP modes.
Multiple devices can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all PROMs in this
chain are interconnected. All devices are compatible and
can be cascaded with other members of the family or with
the XC17V00 one-time programmable Serial PROM family.
OE/Reset
TCK
TMS
TDI
TDO
Control
and
JTAG
Interface
Data
Memory
Address
Data
Serial
or
Parallel
Interface
7
CEO
D0 DATA
Serial or Parallel Mode
D[1:7]
Parallel Interface
CF
DS026_01_090502
Figure 1:
XC18V00 Series Block Diagram
©2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and further disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other
trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
NOTICE OF DISCLAIMER: Xilinx is providing this design, code, or information "as is." By providing the design, code, or information as one possible implementation of this fea-
ture, application, or standard, Xilinx makes no representation that this implementation is free from any claims of infringement. You are responsible for obtaining any rights you
may require for your implementation. Xilinx expressly disclaims any warranty whatsoever with respect to the adequacy of the implementation, including but not limited to any war-
ranties or representations that this implementation is free from claims of infringement and any implied warranties of merchantability or fitness for a particular purpose.
DS026 (v4.1) December 15, 2003
Product Specification
www.xilinx.com
1-800-255-7778
1

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Description IC PROM SER I-TEMP 3.3V 20-PLCC Configuration Memory, 128KX8, 15ns, Parallel/serial, CMOS, PQCC20, PLASTIC, LCC-20 IC PROM SER I-TEMP 3.3V 20-SOIC Configuration Memory, 128KX8, 15ns, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44 IC PROM SER I-TEMP 3.3V 44-PLCC IC PROM SER I-TEMP 3.3V 44-VQFP IC PROM SER I-TEMP 3.3V 44-PLCC Configuration Memory, 512KX8, 20ns, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44 IC PROM SER I-TEMP 3.3V 20-SOIC IC PROM SER I-TEMP 3.3V 44-VQFP
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QLCC QLCC SOIC QFP LCC QFP LCC QFP SOIC QFP
package instruction PLASTIC, LCC-20 PLASTIC, LCC-20 SOIC-20 TQFP, TQFP44,.47SQ,32 PLASTIC, LCC-44 TQFP, TQFP44,.47SQ,32 QCCJ, LDCC44,.7SQ TQFP, TQFP44,.47SQ,32 SOIC-20 PLASTIC, VQFP-44
Contacts 20 20 20 44 44 44 44 44 20 44
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A991.B.1.B.2 3A991.B.1.B.2 3A001.B.1.A 3A991.B.1.B.2 3A001.B.1.A 3A991.B.1.A 3A001.B.1.A 3A991.B.1.B.1 3A991.B.1.A 3A991.B.1.A
Maximum access time 15 ns 15 ns 15 ns 15 ns 20 ns 20 ns 20 ns 20 ns 15 ns 15 ns
Maximum clock frequency (fCLK) 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz
Data retention time - minimum 10 10 10 10 10 10 10 10 10 10
Durability 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code S-PQCC-J20 S-PQCC-J20 R-PDSO-G20 S-PQFP-G44 S-PQCC-J44 S-PQFP-G44 S-PQCC-J44 S-PQFP-G44 R-PDSO-G20 S-PQFP-G44
length 8.9662 mm 8.9662 mm 12.8 mm 10 mm 16.5862 mm 10 mm 16.5862 mm 10 mm 12.8 mm 10 mm
memory density 524288 bit 1048576 bit 1048576 bit 1048576 bit 2097152 bit 2097152 bit 4194304 bit 4194304 bit 524288 bit 524288 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 44 44 44 44 44 20 44
word count 65536 words 131072 words 131072 words 131072 words 262144 words 262144 words 524288 words 524288 words 65536 words 65536 words
character code 64000 128000 128000 128000 256000 256000 512000 512000 64000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64KX8 128KX8 128KX8 128KX8 256KX8 256KX8 512KX8 512KX8 64KX8 64KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ SOP TQFP QCCJ TQFP QCCJ TQFP SOP TQFP
Encapsulate equivalent code LDCC20,.4SQ LDCC20,.4SQ SOP20,.4 TQFP44,.47SQ,32 LDCC44,.7SQ TQFP44,.47SQ,32 LDCC44,.7SQ TQFP44,.47SQ,32 SOP20,.4 TQFP44,.47SQ,32
Package shape SQUARE SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form CHIP CARRIER CHIP CARRIER SMALL OUTLINE FLATPACK, THIN PROFILE CHIP CARRIER FLATPACK, THIN PROFILE CHIP CARRIER FLATPACK, THIN PROFILE SMALL OUTLINE FLATPACK, THIN PROFILE
Parallel/Serial PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.572 mm 4.572 mm 2.65 mm 1.2 mm 4.572 mm 1.2 mm 4.572 mm 1.2 mm 2.65 mm 1.2 mm
Maximum standby current 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A
Maximum slew rate 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND J BEND GULL WING GULL WING J BEND GULL WING J BEND GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 0.8 mm 1.27 mm 0.8 mm 1.27 mm 0.8 mm 1.27 mm 0.8 mm
Terminal location QUAD QUAD DUAL QUAD QUAD QUAD QUAD QUAD DUAL QUAD
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 8.9662 mm 8.9662 mm 7.5 mm 10 mm 16.5862 mm 10 mm 16.5862 mm 10 mm 7.5 mm 10 mm
Maker XILINX - XILINX - XILINX XILINX XILINX - - XILINX
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 -
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 -
power supply 2.5/3.3,3.3 V - 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Terminal surface Tin/Lead (Sn85Pb15) TIN LEAD Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) -
Peak Reflow Temperature (Celsius) - 225 225 225 225 225 225 225 225 -
Maximum time at peak reflow temperature - 30 30 30 30 30 30 30 30 -
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