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DF13E-20DP-1.25V(51)

Description
CONN HEADER 20POS 1.25MM TIN
CategoryThe connector   
File Size368KB,12 Pages
ManufacturerHirose Electric
Download Datasheet Parametric View All

DF13E-20DP-1.25V(51) Overview

CONN HEADER 20POS 1.25MM TIN

DF13E-20DP-1.25V(51) Parametric

Parameter NameAttribute value
Connector typeConnector
Contact typeMale pin
Spacing - Mating0.049"(1.25mm)
Number of pins20
Number of rows2
Line spacing - patching0.049"(1.25mm)
Number of pins loadedall
styleBoard to cable/wire
shieldCovered - 4 walls
Installation typesurface mount
Terminationwelding
Fastening typepush-pull
Contact Length - Mating0.094"(2.40mm)
Contact length - terminal-
Overall contact length-
Insulation height0.189"(4.80mm)
Contact shapeSquare
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating8.00µin(0.203µm)
Contact Surface Preparation - Columntin copper
Contact materialbrass
Insulation MaterialsPolyamide (PA), nylon
characteristicBoard guide, fixed solder tail
Operating temperature-35°C ~ 85°C
Intrusion protection-
Material flammability ratingUL94 V-0
Insulation colorbeige
Rated current1A
Rated voltage150V
Joint stack height5.8mm
Contact Surface Treatment Thickness - Column39.4µin(1.00µm)
application-
1.25mm Pitch Miniature Crimping Connector (UL Listed)
DF13 Series
Type
DIP
Mounting Type
Mounting Height(h)
5.3mm
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Straight Type
SMT
5.8mm
Right Angle Type
DIP
3.6mm
SMT
■Features
1. Miniature Size
Designed in the low profile at mounting height 5.8mm.
(SMT mounting straight type)
(For DIP type, the mounting height is to 5.3mm to the
straight and 3.6mm at the right angle)
Correspond to Automatic Mounting
Secure the automatic plain area for the absorption
type automatic mounting machine.
Straight Type
Absorption area
2. Multi-contact
The double row type achieves the multi-contact up to 40
contacts, and secures 30% higher density in the mounting
area, compared with the single row type.
3. Correspond to Automatic Mounting
The header provides the grade with the vacuum absorption
area, and secures automatic mounting by the embossed
tape packaging.
In addition, the tube packaging can be selected. (Fig.1)
4. Integral Basic Function Despite Miniature Size
The header is designed in a scoop-proof box structure, and
completely prevents mis-insertion.
In addition, the surface mounting (SMT) header is equipped
with the metal fitting to prevent solder peeling. (Fig.1)
Right Angle Type
Metal fitting
Absorption area
5. UL Certifled
■Applications
Note PC, mobile terminal, miniature type business equipment,
and other various consumer equipment, including video
camera
Fig.1
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