W25X10LSNCG datasheet, PDF - EEWORLD Datasheet

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W25X10LSNCG: Description1M X 8 FLASH 2.7V PROM, PDSO8; Categorystorage storage; File Size1MB，45 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25X10LSNCG Overview

1M X 8 FLASH 2.7V PROM, PDSO8

W25X10LSNCG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	0.150 INCH, GREEN, PLASTIC, SOIC-8
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Other features	SYNCHRONOUS MODE ALSO POSSIBLE
Maximum clock frequency (fCLK)	33 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.85 mm
memory density	1048576 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1.72 mm
Serial bus type	SPI
Maximum standby current	0.00001 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	3.9 mm
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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W25X10, W25X20, W25X40, W25X80

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT

SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL OUTPUT SPI

-1-

Publication Release Date: September 22, 2006

Preliminary - Revision I

W25X10, W25X20, W25X40, W25X80

Table of Contents-

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5

PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6

PIN DESCRIPTION..................................................................................................................... 6

7.1

7.2

7.3

7.4

7.5

7.6

7.7

Package Types ............................................................................................................... 7

Chip Select (/CS) ............................................................................................................ 7

Serial Data Output (DO) ................................................................................................. 7

Write Protect (/WP)......................................................................................................... 7

HOLD (/HOLD) ............................................................................................................... 7

Serial Clock (CLK) .......................................................................................................... 7

Serial Data Input / Output (DIO) ..................................................................................... 7

BLOCK DIAGRAM ...................................................................................................................... 8

FUNCTIONAL DESCRIPTION ................................................................................................... 9

9.1

SPI OPERATIONS ......................................................................................................... 9

9.1.1

9.1.2

9.1.3

SPI Modes ........................................................................................................................9

Dual Output SPI................................................................................................................9

Hold Function ...................................................................................................................9

Write Protect Features....................................................................................................10

9.2

10.

WRITE PROTECTION.................................................................................................. 10

9.2.1

CONTROL AND STATUS REGISTERS................................................................................... 11

10.1

STATUS REGISTER .................................................................................................... 11

10.1.1

10.1.2

10.1.3

10.1.4

10.1.5

10.1.6

10.1.7

BUSY............................................................................................................................11

Write Enable Latch (WEL) ............................................................................................11

Block Protect Bits (BP2, BP1, BP0)..............................................................................11

Top/Bottom Block Protect (TB) .....................................................................................11

Reserved Bits ...............................................................................................................11

Status Register Protect (SRP) ......................................................................................12

Status Register Memory Protection ..............................................................................13

Manufacturer and Device Identification.........................................................................14

Instruction Set

(1)

...........................................................................................................15

Write Ensable (06h)......................................................................................................16

Write Disable (04h).......................................................................................................16

10.2

INSTRUCTIONS........................................................................................................... 14

10.2.1

10.2.2

10.2.3

10.2.4

-2-

W25X10, W25X20, W25X40, W25X80

10.2.5

10.2.6

10.2.7

10.2.8

10.2.9

10.2.10

10.2.11

10.2.12

10.2.13

10.2.14

10.2.15

10.2.16

10.2.17

Read Status Register (05h) ..........................................................................................17

Write Status Register (01h) ..........................................................................................18

Read Data (03h) ...........................................................................................................19

Fast Read (0Bh) ...........................................................................................................20

Fast Read Dual Output (3Bh) .......................................................................................21

Page Program (02h) ...................................................................................................22

Sector Erase (20h) .....................................................................................................23

Block Erase (D8h) ......................................................................................................24

Chip Erase (C7h)........................................................................................................25

Power-down (B9h) ......................................................................................................26

Release Power-down / Device ID (ABh) .....................................................................27

Read Manufacturer / Device ID (90h) .........................................................................29

JEDEC ID (9Fh)..........................................................................................................30

11.

ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 31

11.1 Absolute Maximum Ratings (1) .................................................................................... 31

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

11.10

11.11

Operating Ranges......................................................................................................... 31

Endurance and Data Retention .................................................................................... 32

Power-up Timing and Write Inhibit Threshold .............................................................. 32

DC Electrical Characteristics ........................................................................................ 33

AC Measurement Conditions........................................................................................ 34

AC Electrical Characteristics ........................................................................................ 35

AC Electrical Characteristics (cont’d) ........................................................................... 36

Serial Output Timing ..................................................................................................... 37

Input Timing................................................................................................................. 37

Hold Timing ................................................................................................................. 37

8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40

8-contact 6x5 WSON .................................................................................................... 41

8-contact 6x5 WSON Cont’d. ....................................................................................... 42

12.

PACKAGE SPECIFICATION .................................................................................................... 38

12.1

12.2

12.3

12.4

12.5

13.

14.

ORDERING INFORMATION

(1)

................................................................................................. 43

REVISION HISTORY ................................................................................................................ 44

-3-

Publication Release Date: September 22, 2006

Preliminary - Revision I

W25X10, W25X20, W25X40, W25X80

1. GENERAL DESCRIPTION

The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash

memories provide a storage solution for systems with limited space, pins and power. The 25X series

offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code

download applications as well as storing voice, text and data. The devices operate on a single 2.7V to

3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All

devices are offered in space-saving packages.

The W25X10/20/40/80 array is organized into 512/1024/2048/4096 programmable pages of 256-bytes

each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can

be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase).

The W25X10/20/40/80 has 32/64/128/256 erasable sectors and 2/4/8/16 erasable blocks respectively.

The small 4KB sectors allow for greater flexibility in applications that require data and parameter

storage. (See figure 2.)

The W25X10/20/40/80 supports the standard Serial Peripheral Interface (SPI), and a high

performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial

Data Out. SPI clock frequencies of up to 75MHz are supported allowing equivalent clock rates of

150MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to

those of 8 and 16-bit Parallel Flash memories.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control

features, provide further control flexibility. Additionally, the device supports JEDEC standard

manufacturer and device identification.

2. FEATURES

•

Family of Serial Flash Memories

–

W25X10: 1M-bit / 128K-byte (131,072)

–

W25X20: 2M-bit / 256K-byte (262,144)

–

W25X40: 4M-bit / 512K-byte (524,288)

–

W25X80: 8M-bit / 1M-byte (1,048,576)

– 256-bytes per programmable page

– Uniform 4K-byte Sectors / 64K-byte Blocks

•

SPI with Single or Dual Outputs

– Clock, Chip Select, Data I/O, Data Out

– Optional Hold function for SPI flexibility

•

Data Transfer up to 150M-bits / second

– Clock operation to 75MHz

– Fast Read Dual Output instruction

–

Auto-increment Read capability

•

Flexible Architecture with 4KB sectors

– Sector Erase (4K-bytes)

– Block Erase (64K-byte)

–

Page program up to 256 bytes <2ms

–

Up to 100,000 erase/write cycles

–

20-year retention

•

Low Power Consumption, Wide

Temperature Range

– Single 2.7 to 3.6V supply

– 5mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

•

Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

–

Top or bottom array protection

•

Space Efficient Packaging

– 8-pin SOIC 150-mil (W25X10/20/40)

– 8-pin SOIC 208-mil (W25X40/80)

– 8-pin PDIP 300-mil (W25X10/20/40/80)

– 8-pin WSON 6x5-mm (W25X10/20/40/80)

-4-

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