W25P80 / W25P16 / W25P32
8M-BIT, 16M-BIT AND 32M-BIT
SERIAL FLASH MEMORY
Formally NexFlash NX25P80, NX25P16 and NX25P32
The Winbond W25P80/16/32 are fully compatible with the previous NexFlash
NX25P80/16/32 Serial Flash memories.
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Publication Release Date: December 11, 2005
Revision J
W25P80 / W25P16 / W25P32
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION 208-MIL................................................................................................. 5
PIN DESCRIPTION 208-MIL ...................................................................................................... 5
PIN CONFIGURATION 300-MIL................................................................................................. 6
PIN DESCRIPTION 300-MIL ...................................................................................................... 6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7.
8.
Package Types ............................................................................................................... 7
Chip Select (/CS) ............................................................................................................ 7
Serial Data Output (DO) ................................................................................................. 7
Write Protect (/WP)......................................................................................................... 7
HOLD (/HOLD) ............................................................................................................... 7
Serial Clock (CLK) .......................................................................................................... 7
Serial Data Input (DI) ...................................................................................................... 7
BLOCK DIAGRAM ...................................................................................................................... 8
FUNCTIONAL DESCRIPTION ................................................................................................... 9
8.1
SPI OPERATIONS ......................................................................................................... 9
8.1.1
8.1.2
SPI Modes ........................................................................................................................9
HOLD Function.................................................................................................................9
Write Protect Features......................................................................................................9
8.2
9.
WRITE PROTECTION.................................................................................................... 9
8.2.1
CONTROL AND STATUS REGISTERS................................................................................... 10
9.1
STATUS REGISTER .................................................................................................... 10
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6
BUSY..............................................................................................................................10
Write Enable Latch (WEL) ..............................................................................................10
Block Protect Bits (BP2, BP1, BP0)................................................................................11
Reserved Bits .................................................................................................................11
Status Register Protect (SRP) ........................................................................................11
Status Register Memory Protection ................................................................................12
Manufacturer and Device Identification...........................................................................13
Instruction Set
(1)
.............................................................................................................14
Write Disable (04h).........................................................................................................15
Write Enable (06h)..........................................................................................................15
Read Status Register (05h) ............................................................................................16
Write Status Register (01h) ............................................................................................17
Read Data (03h) .............................................................................................................18
9.2
INSTRUCTIONS........................................................................................................... 13
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
9.2.7
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W25P80 / W25P16 / W25P32
9.2.8
9.2.9
9.2.10
9.2.11
9.2.12
9.2.13
9.2.14
9.2.15
9.2.16
9.2.17
9.2.18
9.2.19
Fast Read (0Bh) .............................................................................................................19
Page Program (02h) .......................................................................................................20
Sector Erase (D8h).......................................................................................................21
Chip Erase (C7h)..........................................................................................................22
Power-down (B9h) ........................................................................................................23
Release Power-down / Device ID (ABh) .......................................................................23
Read Manufacturer / Device ID (90h) ...........................................................................25
JEDEC ID (9Fh)............................................................................................................26
Read Parameter Page (53h).........................................................................................27
Fast Read Parameter Page (5Bh) ................................................................................28
Program Parameter Page (52h) ...................................................................................29
Erase Parameter Page (D5h) .......................................................................................31
10.
ELECTRICAL CHARACTERISTICS......................................................................................... 32
10.1 Absolute Maximum Ratings (1) .................................................................................... 32
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
Operating Ranges......................................................................................................... 32
Power-up Timing and Write Inhibit Threshold .............................................................. 33
DC Electrical Characteristics (Preliminary)(1) .............................................................. 34
AC Measurement Conditions........................................................................................ 35
AC Electrical Characteristics ........................................................................................ 36
Serial Output Timing ..................................................................................................... 38
Input Timing .................................................................................................................. 38
Hold Timing................................................................................................................... 38
8-Pin SOIC 208-mil (Winbond Package Code SS) (NexFlash Package Code S)........ 39
16-Pin SOIC 300-mil (Winbond Package Code SF)(NexFlash Package Code F)....... 40
11.
PACKAGE SPECIFICATION .................................................................................................... 39
11.1
11.2
12.
13.
ORDERING INFORMATION .................................................................................................... 41
REVISION HISTORY ................................................................................................................ 42
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Publication Release Date: December 11, 2005
Revision J
W25P80 / W25P16 / W25P32
1. GENERAL DESCRIPTION
The W25P80 (8M-bit), W25P16 (16M-bit) and W25P32 (32M-bit) Serial Flash memories provide a
storage solution for systems with limited space, pins and power. They are ideal for code download
applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V
power supply with current consumption as low as 4mA active and 1µA for power-down. Devices are
offered in space-saving SOIC packages. As part of a family of Serial Flash products, Winbond also
offers compatible devices in 1M/2M/4M-bit densities.
The W25P80/16/32 array is organized into 4,096/8,192/16,384 programmable pages of 256-bytes
each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages are
grouped into 16/32/64 erasable sectors of 256 pages (64K-byte) each as shown in figure 2. Both
Sector Erase and Chip (full chip) Erase instructions are supported. Additionally, a 256-byte Parameter
Page is provided for user data that is typically stored in EEPROMs such as ID or revision numbers
and configuration parameters. The parameter page is separate from the main array allowing for much
faster erase times.
The Serial Peripheral Interface (SPI) consists of four pins (Serial Clock, Chip Select, Serial Data In
and Serial Data Out) that support high speed serial data transfers up to 50MHz. A Hold pin, Write
Protect pin and programmable write protect features provide further control flexibility. Additionally, the
device can be queried for manufacturer and device type.
The Winbond W25P80/16/32 are fully compatible with the previous NexFlash NX25P80/16/32 Serial
Flash memories.
2. FEATUR ES
•
8M / 16M / 32M-bit Serial Flash Memories
•
Family of Serial Flash Memories
– W25P80: 8M-bit/1M-byte (1,048,576)
– W25P16: 16M-bit/2M-byte (2,097,152)
– W25P32: 32M-bit/4M-byte (4,194,304)
– 256-bytes per programmable page
– Compatible 1M/2M/4M-bit devices
•
4-pin SPI Serial Interface
– Clock, Chip Select, Data In, Data Out
– Easily interfaces to popular microcontrollers
– Compatible with SPI Modes 0 and 3
– Optional Hold function for SPI flexibility
•
Low Power Consumption, Wide
Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, 1µA Power-down (typ)
– -40° to +85°C operating range
•
Fast and Flexible Serial Data Access
– Clock operation to 50MHz
– Auto-increment Read capability
– Manufacturer and device type ID
•
Programming Features
– Page program up to 256 bytes
in 3.5ms
– Sector Erase (64K-byte) 0.6 seconds
– 100,000 erase/write cycles
– Twenty-year data retention
•
Software and Hardware Write Protection
– Write-Protect all or portion of memory
– Enable/Disable protection with /WP pin
•
Parameter Page
– 256 Byte page for ID# revision# or
configuration data
– Separate from array, erase time <200ms
•
Space Saving Packaging
– 8-pin SOIC (W25P80 and W25P16)
– 16-pin SOIC (W25P16 and W25P32)
•
Ideal for systems with limited pins, space,
and power
– Controller-based serial code-download
– µC systems storing data, text or voice
– Battery-operated and portable products
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W25P80 / W25P16 / W25P32
3. PIN CONFIGURATION 208-MIL
Figure 1a. W25P80/16 Pin Assignments, 8-pin SOIC 208-mi
4. PIN DESCRIPTION 208-MIL
PIN NO.
PIN NAME
I/O
FUNCTION
1
2
3
4
5
6
7
8
/CS
DO
/WP
GND
DI
CLK
/HOLD
VCC
I
O
I
I
I
I
Chip Select Input
Data Output
Write Protect Input
Ground
Data Input
Serial Clock Input
Hold Input
Power Supply
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Publication Release Date: December 11, 2005
Revision J
ARM Technology
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