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HSF-1-100-5R90-K-LF

Description
RES SMD 5.9 OHM 10% 1W 2512
CategoryPassive components   
File Size413KB,4 Pages
ManufacturerTT Electronics
Environmental Compliance
Download Datasheet Parametric Compare View All

HSF-1-100-5R90-K-LF Overview

RES SMD 5.9 OHM 10% 1W 2512

HSF-1-100-5R90-K-LF Parametric

Parameter NameAttribute value
resistance5.9 Ohms
Tolerance±10%
Power (W)1W
componentthick film
characteristicMoisture proof, pulse resistant
Temperature Coefficient±100ppm/°C
Operating temperature-55°C ~ 150°C
Package/casing2512 (6432 metric)
Supplier device packaging2512
size/dimensions0.079" diameter x 0.251" length (2.01mm x 6.38mm)
Height - Installation (maximum)-
Number of terminals2
failure rate-
Resistors
High Surge Film
TM
Surface Mount Metal Glaze
HSF
High Surge
HSF Series
Film
Surface Mount Metal Glaze
TM
150°C maximum operating temperature
RoHS - compatible components available
Up to triple the surge rating of the rugged CHP1
1 Watt and 1/2 Watt power rating
Replaces costly surface-mount wirewound resistors
150°C maximum operating temperature
RoHS - Compatible Components Available
Up to triple the surge rating of the rugged CHP1
Replaces costly surface-mount wirewound resistors
All Pb-free
Metal Glaze
TM
lm element
red at 1000˚C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
nickel barrier
High
temperature
dielectric
coating
parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Solder over
nickel barrier
Electrical Data
Industry
Footprint
2512
3612
Type
HSF-1
HSF-2
Maximum
Power Rating
1W @ 70°C
2W @ 25°C
Working
Voltage
350
500
Resistance
Range (Ω)
5R9, 6R8, 11R, 27R,
12R, 68R, 270R
8R2, 22R, 300R
Tolerance
(±%)
10
10
TCR
(ppm/°C)
±200
1
Product
Category
High Surge
High Surge
±200
1
Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±0.25% +0.01 ohm
95% min. coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
Test Method
MIL-R-55342H Par 4.7.9 (-55°C +125°C)
MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342H Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342H Par 4.7.5
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342H Par 4.7.7
(reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent)
±1% +0.01 ohm
1200 gram push from underside of mounted chip for 60 seconds
no mechanical damage
Chip mounted in center of 90mm long board, deflected 5mm so
±1% +0.01 ohm
no mechanical damage as to exert pull on chip contacts for 10 seconds
General Note
TT
reserves the
reserves the right
in
make
specification
product specification
IRC
Electronics
right to make changes
to
product
changes in
without notice or liability.
without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
© TT Electronics plc
General Note
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
TT electronics plc
HSF-1 Series Issue October 2010 Sheet 1 of 4
A subsidiary of
06.18

HSF-1-100-5R90-K-LF Related Products

HSF-1-100-5R90-K-LF HSF-1-100-6R80-K-LF HSF-1-100-68R0-K-LF HSF-1-100-11R0-K-LF
Description RES SMD 5.9 OHM 10% 1W 2512 RES SMD 6.8 OHM 10% 1W 2512 RES SMD 68 OHM 10% 1W 2512 RES SMD 11 OHM 10% 1W 2512
resistance 5.9 Ohms 6.8 Ohms 68 Ohms 11 Ohms
Tolerance ±10% ±10% ±10% ±10%
Power (W) 1W 1W 1W 1W
component thick film thick film thick film thick film
characteristic Moisture proof, pulse resistant Moisture proof, pulse resistant Moisture proof, pulse resistant Moisture proof, pulse resistant
Temperature Coefficient ±100ppm/°C ±100ppm/°C ±100ppm/°C ±100ppm/°C
Operating temperature -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C
Package/casing 2512 (6432 metric) 2512 (6432 metric) 2512 (6432 metric) 2512 (6432 metric)
Supplier device packaging 2512 2512 2512 2512
size/dimensions 0.079" diameter x 0.251" length (2.01mm x 6.38mm) 0.079" diameter x 0.251" length (2.01mm x 6.38mm) 0.079" diameter x 0.251" length (2.01mm x 6.38mm) 0.079" diameter x 0.251" length (2.01mm x 6.38mm)
Number of terminals 2 2 2 2
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