RNCP0805FTD200R datasheet, PDF

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RNCP0805FTD200R: DescriptionRES 200 OHM 1% 1/4W 0805; CategoryPassive components; File Size327KB，6 Pages; ManufacturerStackpole Electronics Inc; Environmental Compliance

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RNCP0805FTD200R Overview

RES 200 OHM 1% 1/4W 0805

RNCP0805FTD200R Parametric

Parameter Name	Attribute value
resistance	200 Ohms
Tolerance	±1%
Power (W)	0.25W，1/4W
component	thin film
characteristic	Resistant to vulcanization and moisture
Temperature Coefficient	±100ppm/°C
Operating temperature	-55°C ~ 155°C
Package/casing	0805 (2012 Metric)
Supplier device packaging	805
size/dimensions	0.079" long x 0.049" wide (2.01mm x 1.25mm)
Height - Installation (maximum)	0.024"（0.60mm）
Number of terminals	2
failure rate	-

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RNCP Series

High Power Anti-Sulfur Thin Film Chip Resistor

Features:

•

Stackpole Electronics, Inc.

Resistive Product Solutions

Higher power ratings than standard thick film chips

Absolute TCRs to ±100 ppm/°C

Inner termination engineered to deter sulfur contamination

Absolute Tolerances to 1%

Completely lead free - RoHS compliant and halogen free

Comparable in cost to standard thick film chip resistors

Electrical Specifications

Type / Code

RNCP0402

RNCP0603

RNCP0805

Power Rating

(Watts) @ 70ºC

0.1W

0.125W

0.25W

(1)

Maximum Working

(2)

Voltage

50V

150V

Maximum Overload

Voltage

100V

300V

Resistance

Temperature

Coefficient

Ohmic Range (Ω) and

Tolerance

1%, 5%

1 - 10K

1 - 47K

1 - 100K

±100 ppm/ºC

200V

400V

RNCP1206

0.5W

(1) Power rating for each package size is valid if ambient temp ≤80°C and terminal temp ≤105°C

(2) Lesser of √PR or maximum working voltage

Certain resistance values will require a high minimum order quantity. Contact Stackpole Customer Service for details.

Please refer to the High Power Resistor Application Note (page 5) for more information on designing and implementing

high power resistor types.

Mechanical Specifications

Type / Code

RNCP0402

RNCP0603

RNCP0805

RNCP1206

Body Length

0.039 ± 0.004

1.00 ± 0.10

0.059 ± 0.004

1.50 ± 0.10

0.079 ± 0.006

2.00 ± 0.15

0.122 ± 0.008

3.10 ± 0.20

Body Width

0.020 ± 0.002

0.50 ± 0.05

0.031 ± 0.004

0.80 ± 0.10

0.049 ± 0.006

1.25 ± 0.15

0.059 ± 0.008

1.50 ± 0.20

Body Height

0.012 ± 0.002

0.30 ± 0.05

0.016 ± 0.004

0.40 ± 0.10

0.020 ± 0.004

0.50 ± 0.10

0.020 ± 0.004

0.50 ± 0.10

Top Termination

0.010 ± 0.006

0.25 ± 0.15

0.012 ± 0.008

0.30 ± 0.20

0.016 ± 0.008

0.40 ± 0.20

0.020 ± 0.012

0.50 ± 0.30

Bottom Termination

0.012 ± 0.006

0.30 ± 0.15

0.016 ± 0.008

0.40 ± 0.20

0.024 ± 0.008

0.60 ± 0.20

0.028 ± 0.008

0.70 ± 0.20

Unit

inches

Rev Date: 10/23/2017

This specification may be changed at any time without prior notice

Please confirm technical specifications before you order and/or use.

www.seielect.com

marketing@seielect.com

RNCP Series

High Power Anti-Sulfur Thin Film Chip Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

High Power Chip Resistors and Thermal Management

Stackpole has developed several surface mount resistor series in addition to our current sense resistors,

which have had higher power ratings than standard resistor chips. This has caused some uncertainty and

even confusion by users as to how to reliably use these resistors at the higher power ratings in their designs.

The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated

power assumes an ambient temperature of no more than 100°C for the CSS / CSSH series and 70°C for all

other high power resistor series. In addition, IPC and UL best practices dictate that the combined

temperature on any resistor due to power dissipated and ambient air shall be no more than 105°C. At first

glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR ½ 100

milliohm at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with its

unique materials, design, and processes would have less heat rise and therefore would be easier to

implement for any given customer.

The 102°C heat rise shown here would indicate there will be additional thermal reduction techniques needed

to keep this part under 105°C total hot spot temperature if this part is to be used at 0.75 watts of power.

However, this same part at the usual power rating for this size would have a heat rise of around 72°C. This

additional heat rise may be dealt with using wider conductor traces, larger solder pads and land patterns

under the solder mask, heavier copper in the conductors, via through PCB, air movement, and heat sinks,

among many other techniques. Because of the variety of methods customers can use to lower the effective

heat rise of the circuit, resistor manufacturers simply specify power ratings with the limitations on ambient air

temperature and total hot spot temperatures and leave the details of how to best accomplish this to the

design engineers. Design guidelines for products in various market segments can vary widely so it would be

unnecessarily constraining for a resistor manufacturer to recommend the use of any of these methods over

another.

Note:

The final resistance value can be affected by the board layout and assembly process, especially the size of the

mounting pads and the amount of solder used. This is especially notable for resistance values ≤ 50mΩ.

This should be taken into account when designing.

Rev Date: 10/23/2017

This specification may be changed at any time without prior notice

Please confirm technical specifications before you order and/or use.

www.seielect.com

marketing@seielect.com

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