Thermal Products Division
APPLICATION NOTE
Bond-Ply™ 100/660B
Introduction
Bond-Ply 100 material is a thermally conductive acrylic-based pressure
sensitive tape. The Bond-Ply 100 was designed to replace liquid adhesive and
mechanical fasteners. The Bond-Ply 100 adhesive has a high temperature bond
strength and excellent humidity and temperature characteristics. The Bond-Ply
100 adhesive is a solid at room temperature and can be punched into most
configurations. The Bond-Ply 100 product is a reinforced adhesive tape that is
protected on both sides with release liners.
Bond-Ply 100 Material Forms
Bond-Ply 100 is a reinforced double-sided pressure sensitive tape. The
color of the material is white and is supplied with two protective liners. One
release liner is a white HDPE (typically the top-side) and the other liner is a clear
PET (typically the bottom-side). These liners protect the Bond-Ply 100 adhesive
from collecting debris in transportation and handling.
Bond-Ply 100 is available in roll stock, individual punch parts, punch part
on continuous rolls kiss cut or gap between parts, punched parts with tabs kiss
cut on continuous roll. Continuous rolls are provided on 3 inch core. The color
red is used to designate the white HDPE release liner layer, and the color blue is
used to designate the Bond-Ply 100 adhesive layer. Both layers are actually
white.
18930 West 78
th
Street Chanhassen, MN 55317 · (800) 347-4572 Fax (952) 835-0430 · www.bergquistcompany.com
Thermal Products
· Membrane Switches · Electronic Components · Touch Screens
Page 1 of 6
Rev: July, 2009
Thermal Products Division
Top liner cut to same dimension as Bond-Ply 100 layer
Top view of parts
punched on
continuous roll.
White HDPE
release liner
Bond Ply 100
layer (white)
Kiss Cut part to liner
Butt Cut, i.e. no gap between parts
Clear PET
release liner
Cross Section view of Tabulated Part
Tab layer and portion
Bond-Ply 100 layer
Clear Release liner
The tab portion can be 0.250 to 1 inch in width. The pull-tab makes it
easier to remove the part from the continuous liner and then to remove the top
release liner from the Bond-Ply has been applied to the appropriate surface.
18930 West 78
th
Street Chanhassen, MN 55317 · (800) 347-4572 Fax (952) 835-0430 · www.bergquistcompany.com
Thermal Products
· Membrane Switches · Electronic Components · Touch Screens
Page 2 of 6
Rev: July, 2009
Thermal Products Division
Bond-Ply 100 Application Method
1. Clean the Surfaces
The two surfaces to be bonded must be clean of oil (fingerprints, processing
oil, etc.), dust and or debris from packaging or work area. Use your
company’s procedure for proper handling of industrial solvents. Apply a small
amount of industrial solvent to the cloth and wipe one or both surfaces
depending on the processing being completed at one time. The cloth should
be replaced occasionally to prevent the contamination of the next surface.
2. Allow the surface to dry
Depending on the time available, the surface will dry within 5 minutes at room
temperature or faster at elevated temperature.
3. Apply precut tape pad to the surface
Remove the precut pad from the continuous liner. Avoid contact with the
exposed adhesive, and apply precut pad to the surface of the device or heat
sink with a rolling action. Rolling action can be accomplished with a rubber
roller or thumb. The objective is to remove all air from the interface.
Bergquist suggests the application of the pad to a plastic package first to
achieve optimum adhesion. For other surface combinations, the assembly
process can go either way.
4. Apply to second surface
Use Step #1 to assure cleanliness of the surface. Remove the second liner
from the adhesive pad. Center the heat sink or device in a “V” or “
>
” angle
approach. Rotate the device or heat sink to close the “V” and make complete
contact. The objective is to eliminate the air from the interface.
Application pressure, temperature and time
Temperature,
°C
25
25
25
25
25
35
35
35
35
35
Pressure, psi
5
10
20
40
80
5
10
20
40
80
Time, sec.
48
24
12
6
3
24
12
6
3
1.5
18930 West 78
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Street Chanhassen, MN 55317 · (800) 347-4572 Fax (952) 835-0430 · www.bergquistcompany.com
Thermal Products
· Membrane Switches · Electronic Components · Touch Screens
Page 3 of 6
Rev: July, 2009
Thermal Products Division
As the table above indicates, the doubling of pressure applied to the assembly
will decrease the dwell time required by 50 %. The increase of every 10
°C
in
temperature decreases the time by 50%. These values are targets for bonding
metal-to-metal surfaces.
Affect of temperature exposure after lamination on lap shear values
Test Method:
Lap shear joints were made using Bond-Ply 100, 8 mil on anodized aluminum.
The sample specimens were conditioned in an air-circulating oven at 25, 50, 100
and 200
o
C. The graph attached shows the lap shear strength increase with time
at the various conditioning temperatures. All pulls were completed at room
temperature.
S h e a r S tre n g th a s a F u n c tio n o f T im e a n d
T e m p e ra tu re
250
Lap Shear Strength (psi)
200
2 0 0
o
C
1 0 0
o
C
150
5 0
o
C
100
2 5
o
C
50
0
0
5
10
15
20
25
30
T im e (h )
Note:
The continuous lines in the graph above are meant as a visual aid and are
not a result of curve fit analysis.
18930 West 78
th
Street Chanhassen, MN 55317 · (800) 347-4572 Fax (952) 835-0430 · www.bergquistcompany.com
Thermal Products
· Membrane Switches · Electronic Components · Touch Screens
Page 4 of 6
Rev: July, 2009
Thermal Products Division
Rework Instructions
1.
Insert the razor or knife into the bond line. This process is to create a void to
insert the thin metal blade. Do not try to pry the components apart at this
point.
2.
Insert the blade and slowly pry or twist the blade to separate the components.
It may be necessary to insert the blade and repeat the twisting action to get
the components apart. These types of adhesives do not response to
snapping action. A slow consistent pressure is a better method to separate
the components
3.
After the two components are separated, the Bond-Ply 100 adhesive can be
removed by pulling on an edge. The razor blade can be to start an edge.
Again, slow separation of the adhesive is better than fast stripping removal.
Fast removal may cause the adhesive to cohesively fail to the surface that will
cause additional clean up procedure.
4.
If some of the adhesive remains on the a surface, then it must be removed
chemically. Lightly soak an area of a soft cloth with IPA and apply to the
adhesive. These solvents will soften the adhesive so that they can be rubbed
off with the cloth. Continue applying the solvent and rubbing until the
adhesive is completely removed.
5.
If solvent is used the cleaning process, then allow the components to air dry
for 10-15 minutes prior to reassembly.
Solder Reflow Conditioning
The process of HASL or solder reflow requires that the material be
processed in a 10 +/- 5°C dew point environment or the assembly needs to be
conditioned to prevent blisters from the moisture absorbed into the adhesive or
substrate (mostly Kapton) layers.
The process of conditioning is used to remove volatiles. The volatiles will cause
the assembly to blister during the solder reflow process. The conditioning step
will remove the volatiles and allow the assembly to withstand the solder reflow
step.
The process control will be affected by the humidity control in the work area. The
assembly area should be controlled to a dew point of 30°C +/- 10°C. A lower
dew point room condition will increase the working time from the conditioning
oven to the reflow process. Removing the assemblies from the conditioning oven
and placing them directly into the solder reflow station achieves best results.
18930 West 78
th
Street Chanhassen, MN 55317 · (800) 347-4572 Fax (952) 835-0430 · www.bergquistcompany.com
Thermal Products
· Membrane Switches · Electronic Components · Touch Screens
Page 5 of 6
Rev: July, 2009
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