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5413 AMBER 1 IN X 36 YD

Description
TAPE FILM AMBER 1"X 36YDS
Categoryaccessories   
File Size190KB,3 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
Download Datasheet Parametric View All

5413 AMBER 1 IN X 36 YD Overview

TAPE FILM AMBER 1"X 36YDS

5413 AMBER 1 IN X 36 YD Parametric

Parameter NameAttribute value
Tape typethin film
Adhesivethermoset silicone
base fabric, carrierPolyimide
thickness0.0027"(2.7 mils,0.069mm)
Thickness - Adhesive0.0017"(1.7 mils,0.043mm)
Thickness - base fabric, carrier0.0010"(1.0 mils,0.025mm)
width1.00"(25.40mm)
length108' (32.9m) 36 yards
coloramber
useshielded, high temperature
temperature range-100 ~ 500°F(-73 ~ 260°C)
Shelf life start dateManufacturing date
shelf life36 months
Technical Data | September 2014
3M™
Polyimide Film Tape 5413
Product Description
3M™ Polyimide Film Tape 5413 with DuPont™ Kapton® polyimide film and silicone adhesive used for
PCB solder
masking and other high temperature applications. This product is amber colored and 2.7 mil (69 microns) thick
Key Features
The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an
excellent release surface at elevated temperatures
Is dimensionally stable at high temperatures, which helps reduce rework, helping to enable high productivity
Is flame retardant, chemical and radiation resistant which helps protect surfaces to help reduce replacement
costs
The silicone adhesive’s high temperature performance helps reduce adhesive transfer which helps to eliminate
cleaning, enabling high productivity
Polyethylene tape core instead of cardboard
3M™
Polyimide Film Tape 5413
Product Construction/Material Description
Note: The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
3M™ Polyimide Film Tape 5413
Property
Backing
Adhesive
Color
Standard Roll Length
Value
Dupont™ Kapton® Polyimide Film
Silicone
Amber
33 m (36yd)
Applications
Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
Release surface in fabrication of parts cured at elevated temperatures.
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be used for
specification purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis
(COA) that is shipped with the commercialized product.
3M™
Polyimide Film Tape 5413
Property
Adhesion to Steel:
Tensile Strength at Break:
Elongation at Break:
Backing Thickness:
Method*
D-3330
D-3579
D-3579
D-3652
Value
22 oz/in width (24 N/100 mm)
33 lb/in width (578 N/100 mm)
62%
1.0 mil (0.03 mm)

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