TRENZ ELECTRONIC
SHORT FORM CATALOGUE
updated february 2018
Company Prole
Trenz Electronic GmbH operates as a provider of
development services in the electronic industry since
1992. Our services include design-in support as
well as turnkey designs which typically covers all steps
from product specication, hardware and software
design up to prototyping and production.
Hardware Design
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System architecture and design
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Hardware integration (Design-In)
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Ultrafast digital logic
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Analog and mixed signal
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Digital signal processing
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Schematic capture and PCB layout
HDL Design
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FPGA and System-On-Chip design
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System design and synthesis
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HDL design (VHDL,Verilog)
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Integration of soft-cores
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USB, PCI-Express, Gigabit Ethernet
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Ultrafast ADC/DAC interfaces
Software Development
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Device driver and application software
development
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Software and Firmware development
We are particularly specialized in the design of high-
speed data acquisition, high-accuracy measurement
and embedded digital signal processing systems
based on FPGA and CPU architectures.
Many of our products are compatible with some
widespread form factors. We also provide SoM
products for Automotive industry and high-end
applications.
In the event that an off-the-shelf FPGA board won't t
the customers requirements, the design can be easily
adapted by our comprehensive engineering design
service.
Our in-house EMS and worldwide supply of FPGA and
SoC modules complete the portfolio. All modules
produced by Trenz Electronic GmbH are developed
and manufactured in Germany.
Other assembly options of our modules for cost or
performance optimization plus high volume prices are
available on request. Also, cooling solutions and
several carrier boards are available.
Trenz Electronic
by design
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Extended device life cycle
Rugged for industrial applications
Small and powerful
Customizable
Rapid prototyping
Cooling solutions
Baseboards
Developed & produced in Germany
ISO 9001:2015
(quality management)
certied
ISO 14001:2015
(environmental
management) certied
2
Index
Trenz Electronic
Company Prole..........................................................2
Table of contents .........................................................3
TE0808 (Xilinx Zynq UltraScale+) ...............................4
TE0807 (Xilinx Zynq UltraScale+) ...............................4
TE0803 (Xilinx Zynq UltraScale+) ...............................5
TE0820 (Xilinx Zynq UltraScale+) ...............................5
TEB0911 (Xilinx Zynq UltraScale+).............................6
TEC0330 (PCIe FMC Carrier, Xilinx Virtex-7) ...............7
TEF1001 (PCIe FMC Carrier, Xilinx Kintex-7)...............7
TE0745 (Xilinx Zynq-7000) ..........................................8
TE0729 (Xilinx Zynq-7000) ..........................................8
TE0715 (Xilinx Zynq-7000) ..........................................9
TE0720 (Xilinx Zynq-7000) ..........................................9
TE0728 (Xilinx Zynq-7000) ........................................10
TE0782 (Xilinx Zynq-7000) ........................................10
TE0724 (Xilinx Zynq-7000) ........................................11
TE0722 (Xilinx Zynq-7000) ........................................11
TE0723 (Xilinx Zynq-7000) ........................................12
TE0726 (Xilinx Zynq-7000) ........................................12
TE0841 (Xilinx Kintex UltraScale+) ...........................13
TE0741 (Xilinx Kintex-7).............................................13
TE0710 (Xilinx Artix-7)................................................14
TE0711 (Xilinx Artix-7)................................................14
TE0712 (Xilinx Artix-7)................................................15
TE0713 (Xilinx Artix-7)................................................15
TE0714 (Xilinx Artix-7)................................................16
TE0725 (Xilinx Artix-7)................................................17
TE0725LP (Xilinx Artix-7)............................................17
Carrier Boards ...........................................................18
Starter Kits .................................................................20
Development Boards ................................................21
TEI0001 - MAX1000 (Intel MAX10) ............................22
TEI0003 - CYC1000 (Intel Cyclone 10LP) .................22
TEL0001 - XO2000 (Lattice XO2-4000) .....................23
TE0876 - IceZero (Lattice ICE40HX) .........................23
Trenz Electronic Distributors
Distributor list.............................................................36
cronologic
Product comparison table, Ndigo Series..................33
Violet Series, Time Tagger .........................................34
Ndigo Crate ...............................................................35
XILINX - All Programmable
Xilinx Development Boards and Kits .........................32
Sundance Multiprocessor Technology
PC/104 OneBank Carrier for SoC Modules, oi110 -
Dual Cameralink, oi115 - HDMI in/out.......................30
Oi 710 - Quad 1.2 GHz DAC, oi816 - Octal 16-bit
ADC, EMC2-DP stackable box..................................31
TEM0001 - SMF2000 (Microsemi SmartFusion2) .....24
TEM0002 - SmartBerry (Microsemi M2S010)............24
TEI0004 - ARROW USB Programmer2 .....................25
TEI0005 - FPGA Programmer2 Module ....................25
TE0790 XMOD FTDI JTAG Adapter ..........................26
TEC0810/TEC0850, compactPCI serial cards ..........26
Cooling Solutions ......................................................27
Module series comparison table...............................28
3
TE0808 UltraSOM+ Series
Xilinx Zynq UltraScale+, DDR4, Flash, 20 x Transceiver
5.2 x 7.6 cm
form factor
http://trenz.org/te0808-info
Device list
Pin Package
Connectors
SDRAM
[MByte] max
Flash
[MByte]
Total I/O
GBit
Transceivers
Other Features
ZU6CG, ZU9CG,
ZU6EG, ZU9EG,
ZU15EG
C900
4 x Samtec ST5
8192 DDR4
128
204 + 65 MIO
4 x GTR,
16 x GTH
Programmable Clock Generator,
Single Supply
TE0807 Series
Xilinx Zynq UltraScale+, DDR4, Flash, 20 x Transceiver
5.2 x 7.6 cm
form factor
http://trenz.org/te0807-info
Device list
Pin Package Connectors
SDRAM
[MByte] max
Flash
[MByte]
Total I/O
GBit
Transceivers
Other Features
ZU4CG, ZU5CG, ZU7CG, ZU4EG,
ZU5EG, ZU7EG, ZU4EV, ZU5EV,
ZU7EV
4
B900
4 x Samtec ST5
8192 DDR4
128
204 + 65 MIO
4 x GTR,
16 x GTH
Programmable Clock
Generator, Single Supply
TE0803 Series
Xilinx Zynq UltraScale+, DDR4, SPI Boot Flash, Serial Transceiver
5.2 x 7.6 cm
form factor
http://trenz.org/te0803-info
Pin
Packages
SDRAM
[MByte] max
Flash
[MByte]
Device list
Connectors
Total I/O
GBit Transceivers
Other Features
ZU2CG, ZU3CG, ZU4CG, ZU5CG,
ZU2EG, ZU3EG, ZU4EG, ZU5EG,
ZU4EV, ZU5EV
C784
4 x Samtec ST5
8192 DDR4
128
156 + 65 MIO
4 x PS GTR
4 x GTH (nur ZU4+ZU5)
Programmable Clock
Generator, Single Supply
TE0820 Series
Xilinx Zynq UltraScale+, DDR4, SPI Boot Flash, e.MMC
4 x 5 cm
form factor
http://trenz.org/te0820-info
Device list
Connectors
SDRAM
[MByte]
max
Flash
[MByte]
e.MMC
Ethernet
PHY
USB
PHY
Total I/O
GBit
Transceivers
Other
Features
Programmable
Clock Generator,
Singly Supply
5
ZU2CG, ZU3CG, ZU4CG,
ZU5CG, ZU2EG, ZU3EG,
3 x Samtec LSHM
ZU4EG, ZU5EG, ZU4EV, ZU5EV
4096 DDR4
128
4 - 64 GByte
4 - 64 GBit
USB2.0
OTG
132 + 14
MIO
PS GTR 4