FX11LB-100S/10-SV(71) datasheet, PDF

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FX11LB-100S/10-SV(71): DescriptionCONN RECEPT 100POS W/O POSTS SMD; CategoryThe connector; File Size692KB，16 Pages; ManufacturerHirose Electric; Environmental Compliance

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FX11LB-100S/10-SV(71) Overview

CONN RECEPT 100POS W/O POSTS SMD

FX11LB-100S/10-SV(71) Parametric

Parameter Name	Attribute value
Connector type	Socket with central contact
Number of pins	100
spacing	0.020"（0.50mm）
Number of rows	2
Installation type	surface mount
characteristic	Ground plate, fixed solder tail
Contact plating	gold
Contact plating thickness	3.90µin（0.099µm）
Joint stack height	2mm
board height	0.065"（1.65mm）

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0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm

High-Speed Board-to-Board Connections

FX11 Series

Stacking height : 2mm

Stacking height : 2.5mm, 3mm

■Features

1. Low Profile Design

The board-to-board mating height of 2mm, 2.5mm and 3mm suits

smaller, thinner case designs. (Fig.2)

10 Signal : 1 Ground Arrangement

2. Improved Transmission Efficiency Between Boards

Transmission characteristics have been improved through a design

that fixes ground plates to both sides of the header and receptacle.

Housing

0.7

Ground Plate

Signal contact

0.7

0.5

3. 10 Signal:1 Ground Arrangement

Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to

the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)

Metal fitting

Ground plate and metal fitting make contact

Fig.1

4. Metal Fittings for Added Strength

Metal fittings provide for greater adhesion to the board, which

protects the connector against sheaning forces. The unique

connector design provides a connection between the fitting and the

ground plate for a stronger ground.

Stacking Height Variation

5. Suited to High-Density Applications

The signal contact pitch of 0.5mm affords a compact connector,

and reduces mounting space on the board.

Note: 2.0mm type product cannot be used or interchanged

with the 2.5mm or 3.0mm type product.

Fig.2

6. Structure Prevents Solder Wicking

A solder gap has been designed into the contact SMT portion to

prevent solder wicking. (Fig.3)

Structure Prevent Solder Wicking

7. High Contact Reliability

Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,

3mm height) for signal contacts.

8. Optional Ground Plate

An alternate style is also available without the ground plate. The

space provided by the absence of the ground plate is filled with

additional signal contacts.

Fig.3

■

Signal Integrity Features

●Insertion-Loss-to-Crosstalk

Ratio (ICR)

The insertion-loss-to-crosstalk

ratio (ICR) with five differential

FEXT aggressors meets the

extrapolated IEEE802.3ap

specification to 10

Gbps.

●Differential

Impedance

The differential impedance is

100 + /- 10ø for FX11 at 50 ps

rise time(20% to 80%).

ICR 3mm(Without GND)

ICR

IEEEspec

120

115

110

105

Impedance 3mm(Without GND)

ICR(dB)

Z(ø)

100

0.8

FX11- 3mm DifferentialTDR

0.9

1.1

1.2

1.3

1.4

1.5

Frequency(GHz)

Time(ns)

In cases where the application will demand a high level of reliability, such as automotive,

please contact a company representative for further information.

2017.11e

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