EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-21B-57-C2-R0

Description
HEATSINK 35X35X20MM L-TAB T766
CategoryThermal management products   
File Size119KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-21B-57-C2-R0 Overview

HEATSINK 35X35X20MM L-TAB T766

ATS-21B-57-C2-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length1.378"(35.00mm)
width1.378"(35.00mm)
diameter-
Height from base (fin height)0.790"(20.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows13.16°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-21B-57-C2-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:LEFT-TABBED,BLUE,T766
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPX035035020-57-C2-R0
Push Pin:
Springs:
ATS-PP-02
ATS-PPS-21
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
13.16
2.35
200
(1.0)
4.61
1.54
300
(1.5)
2.72
1.27
400
(2.0)
2.02
1.12
500
(2.5)
1.68
1.03
600
(3.0)
1.48
0.96
700
(3.5)
1.34
Fin
Pitch
FINE-PITCH
Fin
Type
STRAIGHT
Hole
Pattern
LEFT-
TABBED
0.90
Product Detail
P/N
ATS-21B-57-C2-R0
A
35
Dimensions
B
C
E
35
20
40
F
40
NOTES:
Push Pin
ATS-PP-02
Spring
ATS-PPS-21
TIM
T766
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM R2-0917
What is the macro definition of GPIO_PF4_T2CCP0?
I can't find macros like GPIO_PF4_T2CCP0 of SPI. Has anyone used them? What are their macros?...
Hachi Microcontroller MCU
DK-LM3S316 (Keil development example)
DK-LM3S316 (Keil development example)...
yuhua8688 Microcontroller MCU
Regarding the issue of Remote-SAT, I hope experts can give me some advice
[img]C:\1.PNG[/img] The above figure shows the issue PAC on the SIM side of the PAC process. Under what circumstances is the PAC sent? Is it necessary to operate the SIM side under the MMI interface b...
kuandeng Embedded System
Ask Altium Designer a question
As shown in the picture, how to set the block at the end of the wire?...
白手梦想家 PCB Design
High salary looking for WINCE experts
[size=11px]Our company is urgently hiring a WIN CE project manager with high salary, responsible for developing an application program on GPS, with generous benefits. Our company's business model is t...
dg00010170 Embedded System
EEWORLD University - Introduction to Computer Science and Programming
Introduction to Computer Science and Programming : https://training.eeworld.com.cn/course/4681This course is intended for students with little or no programming experience. It aims to give students an...
老白菜 DIY/Open Source Hardware

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2409  763  2781  2790  140  49  16  56  57  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号