MT47H512M4THN-25E:H datasheet, PDF

MT47H512M4THN-25E:H: DescriptionIC DRAM 2G PARALLEL 63FBGA; Categorystorage storage; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT47H512M4THN-25E:H Overview

IC DRAM 2G PARALLEL 63FBGA

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	TFBGA, BGA63,9X11,32
Reach Compliance Code	compliant
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	400 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B63
length	10 mm
memory density	2147483648 bit
Memory IC Type	DDR DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	63
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	512MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA63,9X11,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Maximum standby current	0.014 A
Maximum slew rate	0.217 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm
Base Number Matches	1

	MT47H512M4THN-25E:H	MT47H512M4THN-3:H
Description	IC DRAM 2G PARALLEL 63FBGA	IC DRAM 2G PARALLEL 63FBGA
Is it Rohs certified?	conform to	conform to
package instruction	TFBGA, BGA63,9X11,32	FBGA, BGA63,9X11,32
Reach Compliance Code	compliant	compliant
Maximum clock frequency (fCLK)	400 MHz	333 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-PBGA-B63	R-PBGA-B63
memory density	2147483648 bit	2147483648 bit
Memory IC Type	DDR DRAM	DDR DRAM
memory width	4	4
Number of terminals	63	63
word count	536870912 words	536870912 words
character code	512000000	512000000
Maximum operating temperature	85 °C	85 °C
organize	512MX4	512MX4
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	FBGA
Encapsulate equivalent code	BGA63,9X11,32	BGA63,9X11,32
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified
refresh cycle	8192	8192
Maximum standby current	0.014 A	0.014 A
Maximum slew rate	0.217 mA	0.192 mA
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM

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